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    Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal
    51.
    发明授权
    Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal 失效
    用于监测和添加电镀液的镀液和控制沉积金属质量的装置

    公开(公告)号：US6113769A

    公开(公告)日：2000-09-05

    申请号：US975756

    申请日：1997-11-21

    申请人： Cyprian Emeka Uzoh ,  Wilma Jean Horkans ,  Panayotis Constantinou Andricacos

    发明人： Cyprian Emeka Uzoh ,  Wilma Jean Horkans ,  Panayotis Constantinou Andricacos

    IPC分类号： C25D21/14 ,  C25D21/18 ,  C25B15/00

    CPC分类号： C25D21/14 ,  C25D21/18

    摘要： An apparatus for monitoring and adding solution to a plating bath and controlling the quality of deposited metal. At least one monitor monitors at least one condition within a plating bath and produces at least one signal corresponding to the at least one condition. At least one controller receives the at least one signal produced by the at least one monitor, processes the at least one signal, determines whether an additional amount of at least one chemical should be added to the plating bath, and controls at least one valve for controlling flow of the additional amount of the at least one chemical. A pre-mix tank pre-mixes chemicals to be added to the tank. A plurality of holding tanks holds chemicals and supplies the chemicals to the pre-mix tank. At least one valve is arranged between each holding tank and the pre-mix tank. At least one valve is also arranged between the pre-mix tank and the plating bath.

    摘要翻译： 一种用于监测和添加镀液溶液并控制沉积金属质量的装置。 至少一个监视器监测电镀槽内的至少一个状况，并产生至少一个对应于至少一个条件的信号。 至少一个控制器接收由至少一个监视器产生的至少一个信号，处理该至少一个信号，确定是否应当向镀浴添加额外量的至少一种化学品，并且控制至少一个阀用于 控制附加量的至少一种化学品的流动。 预混罐预混合添加到罐中的化学物质。 多个容纳罐容纳化学品并将化学品供应到预混合罐中。 每个保持槽和预混罐之间至少安装一个阀。 在预混合槽和电镀槽之间还设置至少一个阀。

    Apparatus for electrochemical mechanical planarization
    52.
    发明授权
    Apparatus for electrochemical mechanical planarization 失效
    电化学机械平面化装置

    公开(公告)号：US5911619A

    公开(公告)日：1999-06-15

    申请号：US824747

    申请日：1997-03-26

    申请人： Cyprian Emeka Uzoh ,  James McKell Edwin Harper

    发明人： Cyprian Emeka Uzoh ,  James McKell Edwin Harper

    IPC分类号： H01L21/304 ,  B24B37/04 ,  B24B49/04 ,  B24B49/10 ,  B24B7/22

    CPC分类号： B24B37/26 ,  B24B37/046

    摘要： A method of planarizing a layer of a workpiece such as a semiconductor wafer includes rotating the layer against an electrolytic polishing slurry and flowing an electrical current through the slurry and through only one major side and/or minor sides of the layer, to remove portions of the layer. The one major side carries no microelectronic components which might be damaged by the current. At least a part of each step of rotating and of flowing occurs simultaneously. An apparatus for planarizing a layer includes a rotatable workpiece carrier, a rotatable platen arranged proximately to the carrier, a polishing pad mounted on the platen, and workpiece electrodes. The workpiece electrodes are movably attached to the carrier so as to engage electrically the minor sides of a layer when a workpiece is held on the carrier.

    摘要翻译： 平面化诸如半导体晶片的工件的层的方法包括使层抵抗电解抛光浆料旋转并使电流流过浆料并且仅通过层的一个主侧和/或次侧，以去除部分 层。 一个主要方面不存在可能被电流损坏的微电子元件。 旋转和流动的每个步骤的至少一部分同时发生。 用于平坦化层的装置包括可旋转工件载体，靠近载体布置的可旋转压板，安装在压板上的抛光垫和工件电极。 当工件被保持在载体上时，工件电极可移动地附接到载体以便电耦合层的次侧面。

    OPTICAL INTERPOSER
    58.
    发明申请
    OPTICAL INTERPOSER 有权
    光学插件

    公开(公告)号：US20130177281A1

    公开(公告)日：2013-07-11

    申请号：US13362898

    申请日：2012-01-31

    申请人： Valentin Kosenko ,  Edward Lee McBain ,  Cyprian Emeka Uzoh ,  Pezhman Monadgemi ,  Sergey Savastiouk

    发明人： Valentin Kosenko ,  Edward Lee McBain ,  Cyprian Emeka Uzoh ,  Pezhman Monadgemi ,  Sergey Savastiouk

    IPC分类号： G02B6/42 ,  H01B13/00 ,  B44C1/22

    CPC分类号： G02B6/4214

    摘要： An optical interposer includes grooves (310) for optical fiber cables (104) coupled to a transducer (120). The grooves are formed by etching a cavity (410) in a substrate (130), filling the cavity with some layer (520), then etching the layer to form the grooves. The cavity has outwardly sloped sidewalls on which mirrors (144) are later formed. The groove etch is selective not to damage the sidewalls. The groove depth is uniform due to high etch selectivity of the layer, and also because of good control over the cavity etch due to the low aspect ratio of the cavity. Electrical circuitry for connection to the transducer is fabricated after the cavity filling but before the groove etch. The cavity filling leaves the wafer planar, facilitating fabrication of the electrical circuitry. Grooves can be provided on top and bottom of the interposer. Other features are also provided.

    摘要翻译： 光学插入器包括耦合到换能器（120）的光纤电缆（104）的凹槽（310）。 凹槽通过蚀刻衬底（130）中的空腔（410）形成，用一些层（520）填充空腔，然后蚀刻该层以形成凹槽。 空腔具有向外倾斜的侧壁，后面形成有反射镜（144）。 凹槽蚀刻是选择性的，不损坏侧壁。 由于该层的高蚀刻选择性，凹槽深度是均匀的，并且还由于腔的低纵横比由于对腔蚀刻的良好控制。 用于连接到换能器的电路在腔填充之后但在凹槽蚀刻之前制造。 空腔填充离开晶片平面，便于制造电路。 可以在插入器的顶部和底部提供凹槽。 还提供其他功能。