摘要:
A semiconductor device includes a plurality of first chips, a second chip that controls the first chips, and internal wiring that connects the first chips and the second chip. The first chips each include: an optical fuse; a first latch circuit that retains information on the optical fuse; a second latch circuit that retains information on an electrical fuse, the information being supplied from the second chip through the internal wiring; and a select circuit that selects the information retained in either one of the first and second latch circuits. A redundancy determination signal is generated from the information selected. The information on the electrical fuse is transferred from the second chip to the first chips through the internal wiring.
摘要:
To improve the access efficiency of a semiconductor memory that includes a plurality of memory chips. Based on a layer address, a bank address, and a row address received in synchronization with a row command, and a layer address, a bank address, and a column address received in synchronization with a column command, a memory cell selected by the row address and column address in a bank selected by the bank address included in a core chip selected by the chip address is accessed. This can increase the number of banks recognizable to a controller, thereby improving the memory access efficiency of the semiconductor device which includes the plurality of memory chips.
摘要:
A semiconductor device includes a plurality of core chips and an interface chip that controls the core chips. Each of the core chips and the interface chip includes plural through silicon vias that penetrate a semiconductor substrate and plural pads respectively connected to the through silicon vias. The through silicon vias include a through silicon via of a power source system to which a power source potential or a ground potential is supplied, and a through silicon via of a signal system to which various signals are supplied. Among the pads, at least an size of a pad connected to the through silicon via of the power source system is larger than a size of a pad connected to the through silicon via of the signal system. Therefore, a larger parasitic capacitance can be secured.
摘要:
A plurality of memory cells are tested in order. Each time a defective memory cell is detected by the test, error pattern information is updated based on a relative arrangement relationship between a plurality of defective memory cells, and error address information is updated based on the addresses of at least part of the plurality of defective memory cells. According to the present invention, it is possible to significantly reduce the storage capacity of the analysis memory. This allows the implementation of the analysis memory itself in the semiconductor device, in which case external testers need not include the analysis memory.
摘要:
A semiconductor device includes a plurality of first chips, a second chip that controls the first chips, and internal wiring that connects the first chips and the second chip. The first chips each include: an optical fuse; a first latch circuit that retains information on the optical fuse; a second latch circuit that retains information on an electrical fuse, the information being supplied from the second chip through the internal wiring; and a select circuit that selects the information retained in either one of the first and second latch circuits. A redundancy determination signal is generated from the information selected. The information on the electrical fuse is transferred from the second chip to the first chips through the internal wiring.
摘要:
A band-gap reference voltage source circuit is constituted of a diode-pair circuit connected to a reference voltage output terminal, a first differential amplifier including a first transistor and a first operational amplifier, and a second differential amplifier including a second transistor and a second operational amplifier. The second differential amplifier operates based on a bias voltage, which is lower than a predetermined voltage, so as to forcedly pull up the level of the reference voltage output terminal via the second transistor before the first differential amplifier starts to pull up the level of the reference voltage output terminal up to the predetermined voltage via the first transistor.
摘要:
A differential amplification circuit is constituted of a differential transistor pair including a pair of n-channel MOS transistors whose sources are connected together, a constant current source circuit which is connected to the sources of the differential transistor pair, a current-mirror load circuit including a pair of p-channel MOS transistors whose gates are connected together, and a bias generation circuit which generates a gate bias voltage and a drain bias voltage applied to the current-mirror load circuit in such a way that the same potential is set to both the drains of the p-channel MOS transistors. Thus, it is possible to reduce the input offset voltage without reducing the margin of operation voltage and without increasing the overall chip size.
摘要:
A differential amplifier includes a main differential amplifier circuit that receives a pair of input signals and supplies a pair of output signals based on a difference between the input signals; and a bias control differential amplifier circuit that receives the pair of output signals, controls a control terminal of a current-limiting transistor making up the main differential amplifying circuit based on an offset voltage included in the output signals, and reduces the offset voltage.
摘要:
A power supply circuit is disclosed in which the influence due to variation in the characteristics of transistors is reduced by variation alleviating devices, each connected to transistors that constitute a current mirror. The power supply circuit comprises a configuration having a current mirror to produce a reference voltage. A multiple number of transistors constitute a current mirror. Multiple variation alleviating devices are connected in series with individual transistors.
摘要:
Disclosed is a semiconductor device including a first clock generator that generates a first clock signal having a first period from an input clock signal, a second clock generator that generates a second clock signal having a second period from the input clock signal, and a timing generator that receives the first clock signal, the second clock signal, an activation signal from a command decoder and a selection signal for selecting the delay time from a timing register to produce a timing signal delayed as from activation of the activation signal by a delay equal to a sum of a time equal to a preset number m prescribed by the selection signal times the first period and a time equal to another preset number n prescribed by the selection signal times the second period. The timing register holds the values of m and n. These values are set in the timing register in an initialization sequence at the time of a mode register set command. In the operating states, the timing signals are output from the timing generator at a desired timing based on the information stored in the timing register (FIG. 6).