公开(公告)号：US06909055B2

公开(公告)日：2005-06-21

申请号：US10301990

申请日：2002-11-22

Applicant: Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

Inventor： Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

IPC: H01L23/495 ,  H05K1/02 ,  H05K1/09 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate.

Abstract translation: 一种装置，包括电路，具有连接到所述电路并具有第二端的第一端的引线和连接到所述引线的第二端的可变形结构。 本发明可以实现在电路板上，使得电路板包括基板和连接到所述基板的可变形结构。

公开(公告)号：US06817869B1

公开(公告)日：2004-11-16

申请号：US10330232

申请日：2002-12-30

Applicant: Richard S. Norman

Inventor： Richard S. Norman

IPC: H01R1200

CPC classification number: H01R43/007 ,  H05K3/325 ,  H05K3/366 ,  H05K2201/0314 ,  H05K2203/0235

Abstract: The present invention provides a connector for transporting signals. The connector comprises a body made of a continuous body of material or alternatively of a plurality of superposed layers. The body includes a first terminal end, a second terminal end that is remote from the first terminal end and a three-dimensional arrangement of signal transmissive pathways within the body. The signal transmissive pathways are spaced apart from one another and extend side by side along a direction of propagation from the first terminal end to the second terminal end. The signal transmissive pathways are exposed at the first terminal end and at the second terminal end to allow external devices connected to the first terminal end and to the second terminal end to exchange signals via the signal transmissive pathways. The signal transmissive pathways are distributed in the body in multiple directions transverse to the direction of propagation.

Abstract translation: 本发明提供一种传输信号的连接器。 连接器包括由连续的材料体或多个重叠层的替代物制成的主体。 主体包括第一终端，远离第一终端的第二终端和身体内的信号传输路径的三维排列。 信号传输路径彼此间隔开并且沿着从第一终端到第二终端的传播方向并排延伸。 信号传输路径在第一终端和第二终端暴露，以允许连接到第一终端和第二终端的外部设备通过信号传输路径交换信号。 信号传输路径在横向于传播方向的多个方向上分布在身体中。

公开(公告)号：US20040074671A1

公开(公告)日：2004-04-22

申请号：US10678062

申请日：2003-10-06

Applicant: Sony Corporation

Inventor： Tomio Hirano ,  Masao Ono ,  Nobuyuki Oikawa

IPC: H05K007/06 ,  H05K001/09

CPC classification number: G06F3/045 ,  G06F3/047 ,  H05K3/305 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/0314 ,  H05K2203/0191

Abstract: Providing a method for manufacturing a multilayer wiring board and a touch panel, which does not cause decreasing of yields, reliabilities and productivities even though the materials of each board to be stacked are different, and which manufactures the multilayer wiring board and the touch panel at low cost with high productivities. A multilayer wired board constituting at least part of a electrical circuit board in which a plurality of wired boards are stacked so as to face their wired surfaces each other, wherein: electrical connection parts between the multilayer wired boards are connected through an elastic conductive material part adhered to one of the wired boards; and at least part of a peripheral edge portion of the elastic conductive material part is adhered by a double-sided adhesive material part to seal the plurality of multilayer wired boards.

Abstract translation: 提供一种制造多层布线板和触摸面板的方法，即使要堆叠的每个板的材料不同，也不会导致产量，可靠性和生产率的降低，并且将多层布线板和触摸面板制造在 成本低，生产效率高。 构成电路板的至少一部分的多层布线板，其中多个布线板堆叠成面对它们的布线表面，其中：多层布线板之间的电连接部分通过弹性导电材料部分 坚持其中一个有线电路板; 并且弹性导电材料部分的周缘部分的至少一部分通过双面粘合材料部分粘合以密封多个多层布线板。

公开(公告)号：US20010012706A1

公开(公告)日：2001-08-09

申请号：US09730382

申请日：2000-12-05

Inventor： Chiaki Imaeda

IPC: H01R012/00

CPC classification number: H01R4/04 ,  G02F1/13452 ,  H01R13/24 ,  H05K3/321 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0314 ,  H05K2201/10393

Abstract: A connecting structure includes a substrate 104 provided with terminals 117, a conductive member 116 provided with conductive sections 116b connected to the terminals 117. The conductive sections 116b are connected to the conductive terminals 117 with a hardened conductive paste therebetween, and when the conductive member 116 are interposed between the substrate 104 and a flexible wiring board 115 provided with the terminals 115a, the conductive sections 116b are pressed onto the terminals 115a by resilience due to elastic deformation of the conductive members 116, thereby electrically connecting the terminals 117 and the terminals 115a to each other.

Abstract translation: 连接结构包括设置有端子117的基板104，设置有连接到端子117的导电部116b的导电部件116.导电部分116b与导电端子117连接，其间具有硬化的导电膏，并且当导电部件 116被插入在基板104和设置有端子115a的柔性布线板115之间，导电部分116b由于导电部件116的弹性变形而通过弹性被压在端子115a上，从而电连接端子117和端子 115a彼此。

公开(公告)号：US5738530A

公开(公告)日：1998-04-14

申请号：US654509

申请日：1996-05-28

Applicant: Chris M. Schreiber ,  Bao Le

Inventor： Chris M. Schreiber ,  Bao Le

IPC: H01R12/00 ,  H01R13/24 ,  H05K1/09 ,  H05K3/20 ,  H05K3/40 ,  H01R9/09

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H05K3/4007 ,  H05K1/095 ,  H05K2201/0314 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K3/205 ,  Y10T29/49158 ,  Y10T29/49204 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: A printed-circuit-type electrical contact pad having a plurality of electrically conductive metal traces and a plurality of protuberant electrical contacts projecting from the traces. The protuberances comprise an electrically conductive elastomer having a wide base portion anchored in the end of the trace by a truncated portion of the trace upstanding from the face of the pad. A denuded tip portion of the elastomer extends from the base portion for resiliently engaging a contact site on an electrical device to which the pad is coupled. A unique process for making the aforesaid pad is disclosed and claimed.

Abstract translation: 印刷电路式电接触焊盘，其具有多个导电金属迹线和从该迹线突出的多个突出的电触点。 突起包括导电弹性体，该导电弹性体具有宽的基部，其在轨迹的末端被从垫的表面直立的截面的截断部分锚定。 弹性体的裸露的尖端部分从基部延伸，用于弹性地接合焊盘耦合到的电气装置上的接触部位。 公开并要求保护制造上述垫的独特工艺。

公开(公告)号：US5709576A

公开(公告)日：1998-01-20

申请号：US617706

申请日：1996-04-01

Applicant: Raymond Lippmann ,  Michael John Schnars ,  James Edward Nelson ,  Mark James Miller ,  Gerard Arnold Streelman ,  Victor David Kruppa

Inventor： Raymond Lippmann ,  Michael John Schnars ,  James Edward Nelson ,  Mark James Miller ,  Gerard Arnold Streelman ,  Victor David Kruppa

IPC: G02F1/13 ,  H05K1/02 ,  H05K3/30 ,  H05K3/32 ,  H01J9/42

CPC classification number: G02F1/13452 ,  H05K3/303 ,  H05K1/0268 ,  H05K2201/0314 ,  H05K2201/10136 ,  H05K2203/166 ,  H05K3/325 ,  Y02P70/613 ,  Y10T29/49133

Abstract: An elastomeric connector couples the terminal pads of an LCD with corresponding terminal pads of a printed wiring board (PWB). Conductive elements in the connector are subject to skewing at such an angle that the LCD must be adjusted relative to the PWB to attain pad alignment. Sense pads on the terminal strips are coupled to contact pads and are arranged so that a continuity test on substantially opposed contact pads will verify pad alignment. In one embodiment, one sense pad is narrower than the terminal pads so that even marginal continuity will assure proper alignment of the terminal pads. In another embodiment, a pair of sense pads on either one of the LCD and the PWB is bracketed by a pair of spaced pads on the other such that continuity is evidence of non-alignment.

Abstract translation: 弹性体连接器将LCD的端子焊盘与印刷电路板（PWB）的相应的端子焊盘耦合。 连接器中的导电元件以这样的角度经受倾斜，使得LCD必须相对于PWB进行调整以获得焊盘对准。 端子条上的感应焊盘耦合到接触焊盘，并且被布置成使得在基本相对的接触焊盘上的连续性测试将验证焊盘对准。 在一个实施例中，一个感测焊盘比端子焊盘窄，使得甚至边缘连续性将确保端子焊盘的正确对准。 在另一个实施例中，LCD和PWB中的任一个上的一对感测焊盘由另一个间隔开的一对衬垫包围，使得连续性是不对准的证据。

公开(公告)号：US5578527A

公开(公告)日：1996-11-26

申请号：US494582

申请日：1995-06-23

Applicant: Shyh-Ming Chang ,  Yu-Chi Lee ,  Pao-Yun Tang

Inventor： Shyh-Ming Chang ,  Yu-Chi Lee ,  Pao-Yun Tang

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32

CPC classification number: H01L24/13 ,  H01L21/563 ,  H01L23/49883 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H05K3/323 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10674

Abstract: This invention provides a connection structure and methods of forming the connection structure which combines the advantages of composite bumps and conductive films formed of conductive particles in a non-conductive binder. The conductive film provides conductive particles in a non-conductive binder which can be placed on the input/output pads of an integrated circuit element or substrate. The conductive particles contact composite bumps comprised of a polymer body, having a relatively low Young's Modulus, and a conductive metal coating to form the connection structure. The relatively low Young's Modulus of the composite bumps greatly reduce the recoil forces during bonding. Because of the low recoil forces the connection can be formed with reduced bonding force and forces tending to separate the connection once formed are reduced. The non-conductive binder is cured to form the adhesive between the integrated circuit element and the substrate.

Abstract translation: 本发明提供了形成连接结构的连接结构和方法，其结合了复合凸块和由导电粘合剂中的导电颗粒形成的导电膜的优点。 导电膜在非导电粘合剂中提供导电颗粒，其可以放置在集成电路元件或衬底的输入/输出焊盘上。 导电颗粒接触由具有相对低的杨氏模量的聚合物主体组成的复合凸块和导电金属涂层以形成连接结构。 复合凸块的相对较低的杨氏模量大大降低了接合期间的反冲力。 由于低的反冲力，连接可以以减小的结合力形成，并且一旦形成就会趋于分离连接。 固化非导电粘合剂以在集成电路元件和基板之间形成粘合剂。

公开(公告)号：US5309324A

公开(公告)日：1994-05-03

申请号：US798229

申请日：1991-11-26

Applicant: Jorge M. Herandez ,  Scott S. Simpson ,  Michael S. Hyslop

Inventor： Jorge M. Herandez ,  Scott S. Simpson ,  Michael S. Hyslop

IPC: H05K1/02 ,  H05K3/32 ,  H05K7/10 ,  H05K7/20 ,  H05K7/00

CPC classification number: H05K7/1061 ,  H05K1/0206 ,  H05K1/0231 ,  H05K3/325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/16195 ,  H01L2924/30107 ,  H05K1/0216 ,  H05K2201/0281 ,  H05K2201/0314 ,  H05K2201/0323 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10719 ,  H05K2201/10727

Abstract: A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted onto the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.

Abstract translation: 提出了一种用于将集成电路封装与电路板互连的新型和改进的器件。 根据本发明，具有没有表面触点的中心区域的集成电路封装被定位在弹性或可压缩的连接器系统上。 可压缩连接器包括围绕其中心的开口，其对应于集成电路封装上的中心区域。 在集成电路封装和电路板之间的可压缩连接器的开口内的部件被安装到电路板上。

公开(公告)号：US5180311A

公开(公告)日：1993-01-19

申请号：US643310

申请日：1991-01-22

Applicant: Christopher M. Schreiber ,  William R. Crumly

Inventor： Christopher M. Schreiber ,  William R. Crumly

IPC: B29C33/56 ,  H01L23/50 ,  H01R12/61 ,  H01R13/24 ,  H01R43/16 ,  H05K1/00 ,  H05K3/20 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01R12/613 ,  H05K3/4007 ,  H01L2924/0002 ,  H01R13/24 ,  H01R43/16 ,  H05K1/0393 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/0726 ,  H05K3/205 ,  H05K3/365 ,  Y10T29/49155

Abstract: An elastomeric member is incorporated between a conductor and a conductive interconnection bridge. This elastomeric member serves as a spring providing compliance to an interconnection so that the flatness requirements of an opposing mating structure may be relaxed. A flat metal mandrel is provided with an enlongated curved depression extending across a predetermined region where a resilient interconnection bridge is to be located. A nonconductive layer of Teflon is bonded to the surface of the mandrel. Grooves are ablated in a predetermined configuration down to the conductive surface of the mandrel using an excimer laser and a computer-controlled x-y table. Fineline electrical circuits are electrodeposited into the ablated grooves. The elongated curved depression is filled with a silicone material. The silicone material is permitted to cure to form a compliant elastomeric member having the shape of the elongated curved depression. An insulating backing is laminated onto the electrical circuits and the elastomeric member, and the completed resilient interconnection bridge is removed from the mandrel. Another method is used when the interconnection site is terminated on a circuit pad or on a high density linear connector configuration. In this method, elastomeric material is dispensed onto the circuit pad or along a line transverse to the high density linear connectors. After the elastomeric material has cured, electrical conductors are bonded thereacross to form raised compliant interconnection features.

Abstract translation: 导体和导电互连桥之间并入弹性部件。 该弹性体构件用作提供对互连的顺应性的弹簧，使得可以放松相对配合结构的平坦度要求。 扁平金属心轴设置有延伸穿过弹性互连桥要被定位的预定区域的伸长的弯曲凹陷。 特氟隆的非导电层结合到心轴的表面。 使用准分子激光器和计算机控制的x-y台，将凹槽以预定的形式烧蚀到心轴的导电表面。 电线电路电沉积到烧蚀槽中。 细长的弯曲凹陷填充有硅树脂材料。 允许硅氧烷材料固化以形成具有细长弯曲凹陷形状的柔顺弹性体构件。 将绝缘背衬层压到电路和弹性体构件上，并且完成的弹性互连桥从心轴移除。 当互连站点终止于电路板或高密度线性连接器配置时，使用另一种方法。 在该方法中，将弹性体材料分配到电路板上或沿着与高密度线性连接器横向的线分配。 在弹性体材料固化之后，电导体在其上结合以形成凸起的顺应互连特征。

公开(公告)号：US5093985A

公开(公告)日：1992-03-10

申请号：US373288

申请日：1989-06-30

Applicant: John Houldsworth ,  Anthony P. Duck

Inventor： John Houldsworth ,  Anthony P. Duck

IPC: H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/325 ,  H05K1/148 ,  H05K2201/0314 ,  H05K2201/10136 ,  H05K3/323 ,  H05K3/361 ,  Y10T29/49105 ,  Y10T29/49126

Abstract: A method of assembly for small electrical devices which enhances automated assembly opportunities while reducing costly and nonuniform hand operations, by including the use of flexible connectors, anisotropic adhesives, three dimensional molded circuit boards and elastomeric connectors.