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    Apparatus for reducing signal reflection in a circuit board
    51.
    发明授权
    Apparatus for reducing signal reflection in a circuit board 有权
    用于减少电路板中的信号反射的装置

    公开(公告)号：US07230835B1

    公开(公告)日：2007-06-12

    申请号：US10623216

    申请日：2003-07-18

    Applicant: Bilal Ahmad

    Inventor： Bilal Ahmad

    IPC: H05K1/11 ,  H05K1/14

    CPC classification number: H05K1/111 ,  H05K1/0224 ,  H05K1/0237 ,  H05K1/025 ,  H05K1/0268 ,  H05K2201/0792 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/093 ,  H05K2201/0969 ,  Y02P70/611

    Abstract: A circuit board has, in a first signal layer, a signal conductor having a relatively small width and a contact pad having a relatively large width. The relatively large width of the contact pad combined with the relatively narrow signal conductor creates an impedance mismatch between the contact pad and the signal conductor. The circuit board has, in a second signal layer, a ground plane separated from the first signal layer by a nonconductive layer. The circuit board defines an opening in the second signal layer underneath the contact pad. The presence of the ground plane underneath the contact pad typically affects the impedance of the contact pad. The opening in the second signal layer removes a portion the ground plane relative to the contact pad and, therefore, reduces the impedance mismatch between the contact pad and the signal conductor. Such reduction in the mismatch of the impedances between the contact pad and the signal conductor minimizes signal reflection of a signal transmitted through the signal conductor and across the contact pad.

    Abstract translation: 电路板在第一信号层中具有相对较小宽度的信号导体和具有相对较大宽度的接触垫。 接触焊盘的相对较大的宽度与较窄的信号导体相结合，在接触焊盘和信号导体之间产生阻抗失配。 电路板在第二信号层中具有通过非导电层与第一信号层分离的接地层。 电路板在接触垫下面的第二信号层中限定开口。 接触焊盘下面的接地层的存在通常会影响接触焊盘的阻抗。 第二信号层中的开口相对于接触焊盘去除接地层的一部分，因此减小了接触焊盘和信号导体之间的阻抗失配。 接触焊盘和信号导体之间的阻抗失配的这种减少使通过信号导体传输的信号和接触焊盘的信号反射最小化。

    Conductive member, disk drive using same, and conductive member fabricating method
    52.
    发明申请
    Conductive member, disk drive using same, and conductive member fabricating method 有权
    导电构件，使用其的盘驱动器和导电构件制造方法

    公开(公告)号：US20060175080A1

    公开(公告)日：2006-08-10

    申请号：US11346814

    申请日：2006-02-03

    Applicant: Nobumasa Nishiyama

    Inventor： Nobumasa Nishiyama

    IPC: H05K1/11

    CPC classification number: G11B5/486 ,  G11B5/484 ,  H05K1/056 ,  H05K1/111 ,  H05K2201/0792 ,  H05K2201/0969 ,  Y02P70/611 ,  Y10T29/49126

    Abstract: Embodiments of the present invention provide a conductive member, in which electric characteristics can be improved by matching impedance all the way from a conductive wire to a pad. In one embodiment, a conductive member comprises: a back side metal layer; an insulating layer formed on the back side metal layer; a conductive wire formed on the insulating layer; and a pad formed on the insulating layer and electrically connected to the conductive wire; at least one opening and at least one supporting structure being formed at a position corresponding to the pad on the back side metal layer.

    Abstract translation: 本发明的实施例提供一种导电构件，其中可以通过将阻抗从导线与衬垫相匹配来改善电特性。 在一个实施例中，导电构件包括：背面金属层; 形成在背面金属层上的绝缘层; 形成在所述绝缘层上的导线; 以及形成在绝缘层上并与导线电连接的焊盘; 至少一个开口和至少一个支撑结构形成在与背面金属层上的垫对应的位置处。

    Signal transmission structure having a non-reference region for matching to a conductive ball attached to the signal transmission structure
    53.
    发明授权
    Signal transmission structure having a non-reference region for matching to a conductive ball attached to the signal transmission structure 有权
    信号传输结构具有用于与连接到信号传输结构的导电球匹配的非参考区域

    公开(公告)号：US07064627B2

    公开(公告)日：2006-06-20

    申请号：US10700684

    申请日：2003-11-03

    Applicant: Jimmy Hsu

    Inventor： Jimmy Hsu

    IPC: H01P5/02

    CPC classification number: H05K1/025 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2924/00014 ,  H01P1/047 ,  H05K1/0224 ,  H05K1/0298 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/09727 ,  H01L2224/05599

    Abstract: A signal transmission structure is provided. The structure comprises a reference plane, a bonding pad, a conductive trace and a conductive ball. By changing the shapes of the reference plane and the conductive trace, the equivalent capacitance at the conductive ball and the signal route near the conductive ball is reduced, or the equivalent inductance at the conductive ball and the signal route near the conductive ball is increased to compensate the high equivalent capacitance between the conductive ball and the reference plane. Therefore, the impedance of the conductive ball and the signal route near the conductive ball are matched to increase the integrity of the signals after these signals pass through the conductive ball and the signal neighbor route near the conductive ball.

    Abstract translation: 提供了一种信号传输结构。 该结构包括参考平面，接合焊盘，导电迹线和导电球。 通过改变参考平面和导电迹线的形状，导电球的等效电容和靠近导电球的信号路径减小，或导电球上的等效电感和靠近导电球的信号路径增加到 补偿导电球和参考平面之间的高等效电容。 因此，导电球的阻抗和导电球附近的信号路径匹配，这些信号通过导电球和导电球附近的信号相邻路径之后增加了信号的完整性。

    High frequency via with stripped semi-rigid cable
    55.
    发明申请
    High frequency via with stripped semi-rigid cable 失效
    高频通道带剥离的半刚性电缆

    公开(公告)号：US20060022774A1

    公开(公告)日：2006-02-02

    申请号：US10903534

    申请日：2004-07-30

    Applicant: John Greeley

    Inventor： John Greeley

    IPC: H01P3/08

    CPC classification number: H01P1/047 ,  H05K1/0219 ,  H05K3/4046 ,  H05K3/42 ,  H05K2201/0792 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10757

    Abstract: A high frequency coax via structure is configured with a stripped semi-rigid cable (no shield), and an inductive compensation loop to mitigate transition discontinuity between that via structure's center conductor and the pad to which the center conductor is connected. The performance of top-to-bottom microwave transitions at high frequencies (e.g., 1 to 12 GHz) for such boards is enhanced. A non-metallized via hole embodiment that is configured with surrounding ground vias provides a greater degree of compensation for connection pads associated with greater capacitance (such as those coupled to a component).

    Abstract translation: 高频同轴电缆通孔结构配置有剥离的半刚性电缆（无屏蔽）和电感补偿环路，以减轻该通孔结构的中心导体与中心导体所连接的焊盘之间的过渡不连续性。 在这种板的高频（例如，1至12GHz）上的顶部到底部的微波转换的性能得到提高。 配置有周围接地通孔的非金属化通孔实施例为与较大电容（例如耦合到部件的连接焊盘）相关联的连接焊盘提供更大程度的补偿。

    Transmission line parasitic element discontinuity cancellation
    56.
    发明授权
    Transmission line parasitic element discontinuity cancellation 有权

    公开(公告)号：US06980063B2

    公开(公告)日：2005-12-27

    申请号：US10910028

    申请日：2004-08-03

    Applicant: Frank G. Mikalauskas

    Inventor： Frank G. Mikalauskas

    IPC: G01R31/28 ,  H05K1/02 ,  H01P3/08

    CPC classification number: H05K1/0248 ,  G01R31/2853 ,  H05K1/0219 ,  H05K1/025 ,  H05K2201/0792 ,  H05K2201/09236 ,  H05K2201/09727

    Abstract: A discontinuity, such as a via, in a signal transmission line can introduce a parasitic element that affects the signal transmission. The method in accordance with embodiments of the present invention are directed to counteracting the transmission line parasitic element discontinuity. The method includes determining the amount of parasitic capacitance or inductance that is introduced at a portion of the transmission line, such as by the via. A suitable amount of delay is introduced to the transmission line by way of correction impedance in order to counteract the affects of the parasitic element. The delay is calculated taking into account at least in part the correction impedance and the parasitic element effect. The correction impedance is suitably added to a portion of the transmission line at which the parasitic element is present.

    Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads
    58.
    发明授权
    Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads 有权
    具有减小的阻抗失配的衬底焊盘和制造衬底焊盘的方法

    公开(公告)号：US06765298B2

    公开(公告)日：2004-07-20

    申请号：US10013326

    申请日：2001-12-08

    Applicant: Tsun-kit Chin ,  William Landucci

    Inventor： Tsun-kit Chin ,  William Landucci

    IPC: H01L2348

    CPC classification number: H05K1/025 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/162 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/09781 ,  H01L2924/00

    Abstract: To significantly reduce parasitic capacitance of component's landing pad, the present invention forms patterned holes in reference potential layers below the pad, thus effectively increasing the dielectric distance between the pad and the reference potential planes below the pad, raising the characteristic impedance of the pad above that of the trace connected to the pad. A controlled amount of parasitic capacitance is re-introduced to the pad by forming at least one grounded metal plate adjacent to the pad, bringing the characteristic impedance of the pad to substantially match that of the trace. The distance of the metal plates from the pad, and the configuration of the patterned holes are predetermined to substantially match the pad's impedance with that of the trace.

    Abstract translation: 为了显着降低部件的着陆焊盘的寄生电容，本发明在焊盘下方的参考电位层中形成图案化的孔，从而有效地增加焊盘与焊盘之下的参考电位面之间的介电距离，从而提高焊盘上方的特性阻抗 痕迹连接到垫。 通过形成与焊盘相邻的至少一个接地金属板，将受控量的寄生电容重新引入焊盘，使焊盘的特性阻抗基本上与迹线的阻抗一致。 金属板与焊盘的距离以及图案化孔的构型被预先确定，以使焊盘的阻抗与迹线的阻抗基本匹配。

    . Component mounting structure
    59.
    发明申请
    . Component mounting structure 审中-公开
    。 组件安装结构

    公开(公告)号：US20030186569A1

    公开(公告)日：2003-10-02

    申请号：US10278446

    申请日：2002-10-23

    Inventor： Yukiko Suzuki ,  Katsumi Sakuma ,  Takehiro Seino ,  Keiji Masuda ,  Akihiko Sugata

    IPC: H01R012/00

    CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K3/0061 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/0792 ,  H05K2201/09181 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A component mounting structure including a metal base; a first substrate bonded to the upper surface of the metal base; a first wiring pattern formed on the upper surface of the first substrate; a second substrate horizontally mounted on the upper surface of the first substrate so that the lower surface of the second substrate is in contact with the upper surface of the first substrate; a second wiring pattern formed on the second substrate so as to be connected to the first wiring pattern; and a component mounted on the second substrate so as to be connected to the second wiring pattern.

    Abstract translation: 一种组件安装结构，包括金属底座; 与所述金属基体的上表面接合的第一基板; 形成在第一基板的上表面上的第一布线图案; 第二基板，其水平地安装在所述第一基板的上表面上，使得所述第二基板的下表面与所述第一基板的上表面接触; 形成在第二基板上以与第一布线图案连接的第二布线图形; 以及安装在第二基板上以与第二布线图形连接的部件。

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