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    Method and Apparatus for Interconnecting Circuit Boards
    51.
    发明申请
    Method and Apparatus for Interconnecting Circuit Boards 审中-公开
    用于互连电路板的方法和装置

    公开(公告)号：US20110317373A1

    公开(公告)日：2011-12-29

    申请号：US13166814

    申请日：2011-06-23

    申请人： William James McDermid

    发明人： William James McDermid

    IPC分类号： H05K1/14 ,  H05K3/30

    CPC分类号： H05K1/144 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/1034 ,  H05K2201/10446 ,  Y10T29/4913

    摘要： A method and apparatus are provided for the interconnection of multiple circuit boards within a device. A module is provided which comprises multiple circuit boards interconnected with a plurality of connectors. Modules may be interconnected to other modules using the same connectors. Circuit components are disposed on inner surfaces of the circuit boards of the module. Multiple circuit boards and modules are interconnected by contacts that do not require soldering, that permit the circuit boards and modules to be removably coupled to each other by the contacts, and that permit circuit boards to be positioned by a spaced amount that results in a small spacing between circuit boards. Enclosures are also provided, which allow modules to be configured and secured in both a horizontal and vertical direction. Thus, modules may be interconnected to other modules on each side, as well as interconnected to other modules stacked above or below the module.

    摘要翻译： 提供了一种用于在设备内互连多个电路板的方法和装置。 提供了一种模块，其包括与多个连接器互连的多个电路板。 模块可以使用相同的连接器与其他模块互连。 电路部件设置在模块的电路板的内表面上。 多个电路板和模块通过不需要焊接的触点互连，允许电路板和模块通过触点彼此可拆卸地连接，并且允许将电路板定位成间隔的量，导致小的 电路板之间的间距。 还提供外壳，这允许在水平和垂直方向上配置和固定模块。 因此，模块可以互连到每一侧上的其他模块，以及与模块上方或下方堆叠的其他模块互连。

    ELECTRICAL FIELD DEVICE AND EXPANSION MODULE FOR INSERTION INTO AN ELECTRICAL FIELD DEVICE
    53.
    发明申请
    ELECTRICAL FIELD DEVICE AND EXPANSION MODULE FOR INSERTION INTO AN ELECTRICAL FIELD DEVICE 有权
    用于插入到电场装置中的电场装置和扩展模块

    公开(公告)号：US20110255248A1

    公开(公告)日：2011-10-20

    申请号：US13159693

    申请日：2011-06-14

    申请人： Christoph LEIFER ,  Andre KORREK

    发明人： Christoph LEIFER ,  Andre KORREK

    IPC分类号： H05K7/00

    CPC分类号： H05K1/141 ,  H05K2201/09145 ,  H05K2201/10446 ,  Y10S439/951

    摘要： An electronic expansion module which has at least one circuit board, that has a contact region with contacts for mechanical and electrical contact-making with mating contacts connected to the circuit board of the expansion module and a circuit board recess formed such that, with the expansion module inserted into an opening formed on a side of the housing of an electrical field device for use in industrial control, the circuit board of the expansion module does not have any conductive connection to the electrical field device except in the contact region so that reliable electrical isolation between the interior of the device and the user is ensured.

    摘要翻译： 一种电子扩展模块，其具有至少一个电路板，所述电路板具有与用于机械和电接触的触点的接触区域，所述接触区域具有连接到所述扩展模块的电路板的配合触点，以及电路板凹部， 模块插入形成在用于工业控制的电场设备的壳体的侧面上的开口中，扩展模块的电路板除了在接触区域中没有与电场设备的任何导电连接，使得可靠的电气 确保设备内部与用户之间的隔离。

    Three-dimensional LED light-emitting plate
    54.
    发明授权
    Three-dimensional LED light-emitting plate 失效
    三维LED发光板

    公开(公告)号：US08039851B2

    公开(公告)日：2011-10-18

    申请号：US12615081

    申请日：2009-11-09

    申请人： Rong-Ming Chang

    发明人： Rong-Ming Chang

    IPC分类号： H01L29/18

    CPC分类号： H05K1/021 ,  F21K9/00 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/0393 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10446 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In the field of opto-electronic technology, a three-dimensional (3D) light-emitting diode (LED) light-emitting plate is described. The 3D LED light-emitting plate includes an aluminum substrate. The aluminum substrate is vertically disposed. Notches are formed on an upper side of the aluminum substrate in a thickness direction. LED chips are mounted in the notches. A flexible circuit layer is disposed on a surface of the aluminum substrate. Each LED chip is connected to a circuit of the flexible circuit layer by a gold wire. A fluorescent colloid light-emitting shell is disposed outside each LED chip correspondingly. A cavity is formed between the LED chip and the fluorescent colloid light-emitting shell. A lower portion of the fluorescent colloid light-emitting shell is fixed on the aluminum substrate. The 3D LED light-emitting plate effectively improves the luminous brightness and efficiency of an LED and enlarges an effective light-emitting angle, and alleviates the problem of non-uniform light pattern and light color, such that an LED white light lamp can achieve the luminous effect of a tungsten lamp. The fluorescent colloid light-emitting shell wraps the LED chip, which not only protects the LED chip from dust and produces white light, but is also suitable for use in a severe environment. Moreover, the production cost is reduced due to the simple structure.

    摘要翻译： 在光电技术领域，描述了三维（3D）发光二极管（LED）发光板。 3D LED发光板包括铝基板。 铝基板垂直设置。 在铝基板的厚度方向的上侧形成有切口。 LED芯片安装在凹口中。 柔性电路层设置在铝基板的表面上。 每个LED芯片通过金线连接到柔性电路层的电路。 荧光胶体发光壳相应地设置在每个LED芯片的外侧。 在LED芯片和荧光胶体发光壳体之间形成腔体。 荧光胶体发光壳的下部固定在铝基板上。 3D LED发光板有效地提高了LED的发光亮度和效率，并且扩大了有效的发光角度，并且减轻了不均匀的光图案和浅色的问题，使得LED白光灯可以实现 钨灯的发光效果。 荧光胶体发光壳封装LED芯片，不仅可以保护LED芯片免受灰尘的干扰，还可以产生白光，同时也适用于恶劣环境。 此外，由于结构简单，生产成本降低。

    Electronic apparatus
    55.
    发明授权
    Electronic apparatus 失效
    电子仪器

    公开(公告)号：US08004859B2

    公开(公告)日：2011-08-23

    申请号：US12603277

    申请日：2009-10-21

    申请人： Hirofumi Morita

    发明人： Hirofumi Morita

    IPC分类号： H05K7/02 ,  H05K7/04

    CPC分类号： H05K1/0271 ,  H05K1/181 ,  H05K3/0058 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10522 ,  H05K2201/10734 ,  H05K2201/2009

    摘要： According to one embodiment, an electronic apparatus includes a printed circuit board on which a part is mounted, a first connector for external connection provided in a peripheral portion of the printed circuit board, a reinforcing plate, a first fixing member, and a second fixing member. The reinforcing plate has a first portion to be attached in a region corresponding to the part on the printed circuit board, and a second portion attached to the printed circuit board to reinforce the first connector. The first fixing member fixes the first portion to the printed circuit board at an end of the first portion that is opposite to a portion facing the second portion. The second fixing member fixes the second portion to the printed circuit board.

    摘要翻译： 根据一个实施例，电子设备包括其上安装有部件的印刷电路板，设置在印刷电路板的周边部分中的用于外部连接的第一连接器，加强板，第一固定构件和第二固定 会员。 加强板具有第一部分，其被附接在与印刷电路板上的部分相对应的区域中，第二部分附接到印刷电路板以加强第一连接器。 第一固定构件将第一部分固定在第一部分的与面对第二部分的部分相对的端部处的印刷电路板上。 第二固定构件将第二部分固定到印刷电路板。

    Liquid crystal display module
    58.
    发明授权
    Liquid crystal display module 有权
    液晶显示模块

    公开(公告)号：US07924391B2

    公开(公告)日：2011-04-12

    申请号：US12314852

    申请日：2008-12-17

    申请人： Byung-Jin Choi ,  Ji-Woon Min ,  Kyoung-Sub Kim ,  Hong-Sung Song

    发明人： Byung-Jin Choi ,  Ji-Woon Min ,  Kyoung-Sub Kim ,  Hong-Sung Song

    IPC分类号： G02F1/1345 ,  G02F1/1333

    CPC分类号： H05K1/147 ,  G02F1/1336 ,  G02F1/13452 ,  G02F2001/133322 ,  H05K2201/09154 ,  H05K2201/10136 ,  H05K2201/10189 ,  H05K2201/10446

    摘要： A liquid crystal display module (LCDM) includes a liquid crystal panel; a backlight unit disposed under the liquid crystal panel and projecting light on the light crystal panel; a main frame surrounding a side of the backlight unit and a side of the liquid crystal panel; an integrated printed circuit board (PCB) connected to the liquid crystal panel and disposed at a side surface of the main frame, the integrated PCB including a data unit for providing a data driving signal to the liquid crystal panel, a signal generating unit for generating a data control signal, a gate control signal, and a power source signal and a timing control unit; a connector disposed on the integrated PCB and including a slot along the side surface of the main frame, the connector for receiving a signal from an external unit; a bottom frame under the backlight unit; a system board on a rear side of the bottom frame; a flexible cable connecting the connector and the system board; and a top frame covering edges of the liquid crystal panel and combined with the main frame and the bottom frame.

    摘要翻译： 液晶显示模块（LCDM）包括液晶面板; 设置在所述液晶面板的下方并将光投射在所述光晶体面板上的背光单元; 围绕背光单元的一侧的主框架和液晶面板的一侧; 集成印刷电路板（PCB），其连接到所述液晶面板并且设置在所述主框架的侧表面处，所述集成PCB包括用于向所述液晶面板提供数据驱动信号的数据单元;信号生成单元，用于生成 数据控制信号，门控制信号，电源信号和定时控制单元; 连接器，其设置在所述集成PCB上并且包括沿着所述主框架的侧表面的狭槽，所述连接器用于从外部单元接收信号; 背光单元下方的底框; 位于底架背面的系统板; 连接器和系统板的柔性电缆; 以及覆盖液晶面板的边缘并与主框架和底部框架组合的顶部框架。

    Lateral light-emitting diode backlight module
    59.
    发明授权
    Lateral light-emitting diode backlight module 有权
    侧面发光二极管背光模组

    公开(公告)号：US07919789B2

    公开(公告)日：2011-04-05

    申请号：US12344108

    申请日：2008-12-24

    申请人： Chia-Hsien Chang ,  Yi-Tsuo Wu ,  Hsiao-Chiao Li

    发明人： Chia-Hsien Chang ,  Yi-Tsuo Wu ,  Hsiao-Chiao Li

    IPC分类号： H01L33/00

    CPC分类号： H05K1/021 ,  F21K9/68 ,  F21V29/505 ,  F21V29/70 ,  F21V29/86 ,  F21V29/87 ,  F21V29/89 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10446 ,  Y10S257/918

    摘要： A lateral light-emitting diode backlight module includes a base, a circuit board, and at least a light emitting diode wherein the base having a heat conductor, the circuit board having a conductive pad formed on a surface thereof, and the circuit board disposed on the heat conductor and connected to the heat conductor. Each light emitting diode comprising a substrate, a heat sink fastened to the substrate and connected to the heat conductor, an LED chip disposed on the heat sink and emits light laterally, and a pin mounted on the substrate and extended to the conductive pad of the circuit board.

    摘要翻译： 侧面发光二极管背光模块包括基座，电路板和至少一个发光二极管，其中基座具有热导体，该电路板具有形成在其表面上的导电焊盘，并且电路板设置在 热导体并连接到导热体上。 每个发光二极管包括衬底，固定到衬底并连接到热导体的散热器，布置在散热器上的LED芯片并且侧向发射光;以及安装在衬底上并延伸到衬底的导电焊盘的引脚 电路板。

    Electronic device and on-vehicle module
    60.
    发明授权
    Electronic device and on-vehicle module 有权
    电子设备和车载模块

    公开(公告)号：US07883378B2

    公开(公告)日：2011-02-08

    申请号：US12285893

    申请日：2008-10-16

    申请人： Shiro Yamashita ,  Hideto Yoshinari

    发明人： Shiro Yamashita ,  Hideto Yoshinari

    IPC分类号： H01R13/42

    CPC分类号： H05K1/119 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/141 ,  H05K3/308 ,  H05K3/42 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10803 ,  Y10S439/941

    摘要： In a module, press-fit connection using a pin terminal including a connection part separated into two parts and a flat plane parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal is performed. A through-hole of a board is structured so that an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board and the length of the middle part of the through-hole connected to the pin terminal is shorter than the length of the flat plane of the pin terminal.

    摘要翻译： 在模块中，使用包括分离成两部分的连接部分的引脚端子和在分离部分中与长度方向平行的平面并且垂直于引脚端子的分离方向的压配合连接。 板的通孔的结构使得板的厚度方向中间部分处的通孔的内径小于板的正面和反面以及中间部分的长度 连接到引脚端子的通孔比引脚端子的平面的长度短。