公开(公告)号：US20080008926A1

公开(公告)日：2008-01-10

申请号：US11856835

申请日：2007-09-18

Applicant: Hyun-chul Lee ,  Soon-ho Kim ,  Doo-hwan Lee ,  Eun-duck Park ,  Eun-yong Ko

Inventor： Hyun-chul Lee ,  Soon-ho Kim ,  Doo-hwan Lee ,  Eun-duck Park ,  Eun-yong Ko

IPC: H01M4/94 ,  B01J23/42 ,  H01M4/88

CPC classification number: H01M8/0612 ,  B01J21/04 ,  B01J23/56 ,  B01J23/89 ,  B01J23/8906 ,  B01J23/8913 ,  B01J23/892 ,  B01J23/8926 ,  B01J35/002 ,  B01J37/16 ,  B01J37/18 ,  C01B3/583 ,  C01B2203/044 ,  C01B2203/047 ,  Y02P70/56

Abstract: Provided are a catalyst for oxidizing carbon monoxide and a method of preparing the same. The catalyst for oxidizing carbon monoxide includes platinum and a transition metal which exists in a bimetallic phase, and the bimetallic phase of the platinum and the transition metal is supported by a support including a vacancy of oxygen. The catalyst for oxidizing carbon monoxide shows much higher activity than a conventional catalyst for oxidizing carbon monoxide even at a relatively low temperature.

Abstract translation: 提供氧化一氧化碳的催化剂及其制备方法。 用于氧化一氧化碳的催化剂包括铂和存在于双金属相中的过渡金属，并且铂和过渡金属的双金属相由包含氧空位的载体负载。 用于氧化一氧化碳的催化剂表现出比用于一氧化碳氧化的常规催化剂甚至在较低温度下高的活性。

公开(公告)号：US20070275280A1

公开(公告)日：2007-11-29

申请号：US11657085

申请日：2007-01-24

Applicant: Hyun-chul Lee ,  Soon-ho Kim ,  Doo-hwan Lee ,  Kang-hee Lee

Inventor： Hyun-chul Lee ,  Soon-ho Kim ,  Doo-hwan Lee ,  Kang-hee Lee

IPC: H01M8/00

CPC classification number: H01M8/0618 ,  H01M8/0631 ,  Y02E60/324

Abstract: A fuel processor having a movable burner, a method of operating the fuel processor, and a fuel cell system having the fuel processor. The fuel processor includes a combustion chamber, a reformer burner, a portion of which is partially disposed inside the combustion chamber, a reformer which is heated by heat transfer from the combustion chamber, and a burner-moving apparatus that moves the reformer burner with respect to the combustion chamber. The method of operating the fuel processor includes determining the load on and a plurality of temperatures within the fuel processor and moving the reformer burner depending upon such information.

Abstract translation: 具有可移动燃烧器的燃料处理器，操作燃料处理器的方法以及具有燃料处理器的燃料电池系统。 燃料处理机包括燃烧室，重整器燃烧器，其一部分部分地设置在燃烧室的内部，通过从燃烧室传热而被加热的重整器，以及使重整器燃烧器相对运动的燃烧器移动装置 到燃烧室。 操作燃料处理器的方法包括确定燃料处理器内的负载和多个温度，并根据这些信息移动重整器燃烧器。

公开(公告)号：US20070197376A1

公开(公告)日：2007-08-23

申请号：US11605435

申请日：2006-11-29

Applicant: Yulia Potapova ,  Soon-ho Kim ,  Doo-hwan Lee ,  Hyun-chul Lee

Inventor： Yulia Potapova ,  Soon-ho Kim ,  Doo-hwan Lee ,  Hyun-chul Lee

IPC: B01J21/00

CPC classification number: B01J23/462 ,  B01J37/0009 ,  B01J37/04 ,  C01B3/38 ,  C01B3/40 ,  C01B2203/0227 ,  C01B2203/1047 ,  C01B2203/1082 ,  C01B2203/1241 ,  Y02P20/52

Abstract: A hydrocarbon reforming catalyst, a method of preparing the same, and a fuel processor including the same includes the hydrocarbon reforming catalyst having an active catalyst component impregnated in a oxide carrier and a thermally conductive material having higher thermal conductivity than that of the oxide carrier, the method of preparing the same, and a fuel processor including the same. The hydrocarbon reforming catalyst has excellent catalytic activity and thermal conductivity, and thus can easily transfer heat required in a hydrocarbon reforming reaction. Accordingly, by using the hydrocarbon reforming catalyst above, a high hydrogen production rate can be obtained.

Abstract translation: 烃重整催化剂及其制备方法以及包含该烃重整催化剂的燃料处理机包括具有浸渍在氧化物载体中的活性催化剂组分和导热性高于氧化物载体的导热材料的烃重整催化剂， 其制备方法以及包括该燃料处理器的燃料处理器。 烃重整催化剂具有优异的催化活性和导热性，因此可以容易地转移烃重整反应中所需的热。 因此，通过使用上述烃重整催化剂，可以得到高的氢生产率。

公开(公告)号：US20070074900A1

公开(公告)日：2007-04-05

申请号：US11528322

申请日：2006-09-28

Applicant: Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

Inventor： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC: H05K1/16

CPC classification number: H05K1/185 ,  H01L23/13 ,  H01L23/142 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/053 ,  H05K3/4608 ,  H05K2201/09745 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/49156 ,  H01L2924/00

Abstract: A printed circuit board and manufacturing method thereof are disclosed. By use of a method of manufacturing a printed circuit board, which uses a metal substrate as a core member and has an electronic component embedded in the metal substrate, mainly comprising: (a) anodizing at least one surface of the metal substrate to form at least one insulation layer, (b) forming an inner layer circuit on the at least one insulation layer, (d) placing chip bond adhesive in correspondence with a position where the electronic component is to be embedded and mounting the electronic component, and (e) forming an outer layer circuit in correspondence with a position where the inner layer circuit is formed and with positions of the electrodes of the electronic component, and which may further comprise an operation (c) of etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded between the operations (b) and (d), a metal substrate, such as that of aluminum, etc., is rendered electrically insulating by applying an anodizing process and is used as a core member in a printed circuit board, so that bending stiffness and heat-releasing property are improved; wet etching can be applied, so that manufacturing costs are reduced; and a chip bond adhesive, die attach film, or nonconductive paste, etc., that is high in thixotropy is used in embedding the electronic component, so that the degree of precision may be increased for the position and height of the electronic component when embedding the electronic component.

Abstract translation: 公开了一种印刷电路板及其制造方法。 通过使用制造印刷电路板的方法，该印刷电路板使用金属基板作为核心部件并且具有嵌入金属基板中的电子部件，其主要包括：（a）阳极氧化金属基板的至少一个表面以形成 至少一个绝缘层，（b）在所述至少一个绝缘层上形成内层电路，（d）将芯片粘结粘合剂放置在与要嵌入电子元件的位置相对应并安装电子元件的位置 ）形成与形成内层电路的位置对应的外层电路和电子部件的电极的位置，并且还可以包括蚀刻金属基板以形成相应的空腔的操作（c） 具有将电子部件嵌入在操作（b）和（d）之间的位置，诸如铝等的金属基板通过ap被电绝缘 采用阳极氧化工艺，用作印刷电路板中的芯材，改善了弯曲刚度和散热性能; 可以应用湿蚀刻，从而降低制造成本; 并且在嵌入电子部件时使用具有高触变性的芯片接合粘合剂，芯片附着膜或非导电浆料等，使得当嵌入时电子部件的位置和高度的精度可以增加 电子元件。

公开(公告)号：US20050152282A1

公开(公告)日：2005-07-14

申请号：US10996709

申请日：2004-11-24

Applicant: Doo-Hwan Lee ,  Jung-A Yun ,  Myoung-Soo You ,  Ki-Hyun Kim

Inventor： Doo-Hwan Lee ,  Jung-A Yun ,  Myoung-Soo You ,  Ki-Hyun Kim

IPC: H04L12/16 ,  H04B1/00 ,  H04L12/26 ,  H04L29/02

CPC classification number: H04L43/0811

Abstract: A bi-directional detector which enables a host and a client in a collection terminal is disclosed. The bi-directional detector includes a client detection unit in the host part, for detecting the clients connected to the host part; a client identification unit for identifying types of the clients detected by the client detection unit; a host detection unit in each of the clients for detecting the host part; and a switch unit in each of the clients for determining whether to apply comparison power to the client detection unit and the host detection unit according to whether power is applied to the client. In the bi-directional detector, the client directly detects the host part and manages the connection, thereby reducing the load on the host part, without performing a step by which a host part responds to a connection request of a client.

Abstract translation: 公开了一种使收集终端中的主机和客户端能够实现的双向检测器。 双向检测器包括主机部分中的客户端检测单元，用于检测连接到主机部分的客户端; 客户识别单元，用于识别由客户端检测单元检测到的客户端的类型; 每个客户机中的主机检测单元，用于检测主机部分; 以及每个客户端中的切换单元，用于根据是否向客户端施加电力来确定是否将比较功率应用于客户端检测单元和主机检测单元。 在双向检测器中，客户端直接检测主机部分并管理连接，从而减少主机部分的负载，而不必执行主机部分响应客户端的连接请求的步骤。

公开(公告)号：US5707228A

公开(公告)日：1998-01-13

申请号：US708487

申请日：1996-09-05

Applicant: Doo Hwan Lee

Inventor： Doo Hwan Lee

IPC: C21D1/00 ,  F27B17/02 ,  F27B21/00 ,  F27D7/06 ,  F27D15/02

CPC classification number: F27B17/02 ,  F27B21/00 ,  F27D15/02 ,  F27D2007/066

Abstract: The present invention relates to a heat treatment machine for laboratory use which has a cooling chamber incorporated with a heating chamber of a furnace, both chambers are formed with a vacuum tube of simple construction, in which heating and cooling of a test piece are performed in vacuum atmosphere. The cooling process can be effected following the heating process with maintaining the same vacuum atmosphere, whereby a rapid cooling of the test piece is allowed and physical characteristics of the treated metal can be improved.

Abstract translation: 本发明涉及一种用于实验室用途的热处理机，其具有与炉的加热室结合的冷却室，两个室均形成有简单结构的真空管，其中对试件进行加热和冷却 真空气氛。 冷却过程可以在保持相同真空气氛的加热过程之后进行，从而允许试样的快速冷却，并且可以改善处理过的金属的物理特性。

公开(公告)号：US08929091B2

公开(公告)日：2015-01-06

申请号：US13067131

申请日：2011-05-11

Applicant: Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

Inventor： Kyung-Jin Han ,  Hyung-Tae Kim ,  Moon-Il Kim ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC: H05K1/16 ,  H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H05K1/18

CPC classification number: H01L23/5389 ,  H01L23/13 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1132 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/24227 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H05K1/185 ,  Y10T29/4913 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: A method of manufacturing a printed circuit board (PCB) having an embedded bare chip includes attaching a tape to one side of an insulated substrate having a penetration hole formed therein, and attaching the bare chip onto the tape inside the penetration hole such that electrode pads of the bare chip face the tape; filling up the penetration hole with a filler, and removing the tape; laminating a metal layer onto a surface of the filler and the insulated substrate from which the tape is removed; and forming electrode bumps by removing portions of the metal layer. The forming of electrode bumps further includes simultaneously removing portions of the metal layer and forming an circuit pattern on one side of the insulated substrate. The circuit pattern is formed directly on the upper side of the insulated substrate and the electrode bumps are formed on the surface of the electrode pads.

Abstract translation: 一种制造具有嵌入式裸芯片的印刷电路板（PCB）的方法包括：将带粘附到具有形成在其中的穿透孔的绝缘基板的一侧，并将裸芯片附接到穿透孔内的带上，使得电极焊盘 的裸片面对磁带; 用填料填充贯通孔，取出胶带; 将金属层层压到填料的表面上以及除去带的绝缘基板; 以及通过去除金属层的部分形成电极凸块。 电极凸块的形成还包括同时去除金属层的部分并在绝缘基板的一侧上形成电路图案。 电路图案直接形成在绝缘基板的上侧，并且电极凸块形成在电极焊盘的表面上。

公开(公告)号：US08881382B2

公开(公告)日：2014-11-11

申请号：US13214009

申请日：2011-08-19

Applicant: Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

Inventor： Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

IPC: H05K3/36 ,  H05K3/30 ,  H05K3/10 ,  H05K1/09 ,  H05K1/18 ,  H01L23/00 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Embodiments of the invention provide a method of manufacturing an embedded printed circuit board, which includes the following operations in the order presented: a first operation of forming a first cavity and a third cavity, disposing a first device in the first cavity and disposing a third device in the third cavity; a second operation of forming a second cavity and a fourth cavity, disposing a second device in the second cavity; a third operation of providing an insulating member; a fourth operation of disposing a first base substrate and a second base substrate and pressure laminating the first base substrate, the second base substrate, and the insulating member together; and a fifth operation of forming a first copper clad laminate and forming a second copper clad laminate.

Abstract translation: 本发明的实施例提供一种制造嵌入式印刷电路板的方法，其包括以下顺序的操作：形成第一腔和第三腔的第一操作，将第一器件设置在第一腔中，并且设置第三腔 装置在第三腔中; 形成第二腔和第四腔的第二操作，将第二装置设置在所述第二腔中; 提供绝缘构件的第三操作; 设置第一基底基板和第二基底基板并将第一基底基板，第二基底基板和绝缘部件压合在一起的第四操作; 以及形成第一覆铜层压板并形成第二覆铜层压板的第五操作。

公开(公告)号：US08731608B2

公开(公告)日：2014-05-20

申请号：US13050289

申请日：2011-03-17

Applicant: Ho Jin Jung ,  Doo Hwan Lee ,  Seon Jun Kim ,  Young Hak Park

Inventor： Ho Jin Jung ,  Doo Hwan Lee ,  Seon Jun Kim ,  Young Hak Park

IPC: H04M1/00

CPC classification number: H04B1/0064 ,  H04B1/3805 ,  H04B1/3816 ,  H04B1/401 ,  H04W88/06

Abstract: A communication method and apparatus of a dual standby mode mobile terminal for improving the emission performance are provided. The mobile terminal includes a master switch for connecting a master antenna to a master Radio Frequency (RF) unit for communication with a first network, a slave switch for connecting a slave antenna to a slave RF unit for communication with a second network, a slave control unit for controlling communication with the second network and for detecting attachment of a slave Subscriber Identity Module (SIM), and a master control unit for controlling communication with the first network, for detecting attachment of a master SIM, and for controlling the master and slave switches to establish/release either the connection between the master antenna and the master RF unit or the connection between the slave antenna and the slave RF unit.

Abstract translation: 提供了一种用于提高排放性能的双待机模式移动终端的通信方法和装置。 移动终端包括用于将主天线连接到用于与第一网络通信的主射频（RF）单元的主开关，用于将从天线连接到用于与第二网络通信的从RF单元的从设备开关，从站 控制单元，用于控制与第二网络的通信并且用于检测从用户识别模块（SIM）的附接;以及主控制单元，用于控制与第一网络的通信，用于检测主SIM卡的附件，以及用于控制主站和 从站交换机建立/释放主天线和主RF单元之间的连接或从天线和从RF单元之间的连接。

公开(公告)号：US20130320516A1

公开(公告)日：2013-12-05

申请号：US13572833

申请日：2012-08-13

Applicant: Doo Hwan Lee ,  Tae Sung Jeong ,  Yul Kyo Chung

Inventor： Doo Hwan Lee ,  Tae Sung Jeong ,  Yul Kyo Chung

IPC: H01L21/52 ,  H01L21/54 ,  H01L23/24 ,  H01L21/60 ,  H01L23/498 ,  H01L23/055

CPC classification number: H01L21/52 ,  H01L21/54 ,  H01L21/561 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/5389 ,  H01L23/544 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings.

Abstract translation: 这里公开了一种半导体封装及其制造方法，所述半导体封装包括：模制构件，其中形成有空腔; 安装在腔体中的装置; 绝缘构件，其形成在所述空腔内并且在所述模制构件和所述装置之上和/或之下; 形成在所述绝缘构件上的电路层，并且包括与所述装置电连接的通孔和连接垫; 形成在电路层上的阻焊层，并且具有暴露连接焊盘的上部的开口; 以及形成在开口中的焊球。