公开(公告)号：US20050105243A1

公开(公告)日：2005-05-19

申请号：US10990579

申请日：2004-11-17

Applicant: Tae-Won Lee ,  Jeong-Min Choi ,  Do-In Bae

Inventor： Tae-Won Lee ,  Jeong-Min Choi ,  Do-In Bae

IPC: H01L21/306 ,  H01L21/683 ,  H02H1/00

CPC classification number: H01L21/6833

Abstract: An electrostatic chuck to minimize an arc and a glow discharge during processing of a semiconductor substrate is provided, In one aspect, an electrostatic chuckin a processing chamber includes a body having a first hole for providing a cooling gas to a backside of a substrate to control a temperature of the substrate, an inner electrode for generating an electrostatic force and a dielectric layer. A ceramic block is tightly inserted into a first hole and has a second hole connected to the first hole. A third hole formed through the dielectric layer is connected to the first hole and the second hole. The cooling gas is provided to the backside of the substrate through the first hole or the second hole. Since the first hole is covered with the ceramic block, the generation of an arc or a glow discharge inside the first hole may be minimized, thereby preventing damage to the electrostatic chuck and improving production yields.

Abstract translation: 提供了一种在半导体衬底的处理期间使电弧和辉光放电最小化的静电吸盘。一方面，一种处理室中的静电吸盘包括具有用于向衬底的背面提供冷却气体的第一孔的主体以控制 基板的温度，产生静电力的内部电极和电介质层。 陶瓷块被紧密插入第一孔中，并且具有连接到第一孔的第二孔。 通过电介质层形成的第三孔连接到第一孔和第二孔。 冷却气体通过第一孔或第二孔提供到衬底的背面。 由于第一孔被陶瓷块覆盖，所以可以使第一孔内的电弧或辉光放电的产生最小化，从而防止对静电卡盘的损坏并提高生产率。

公开(公告)号：US06787739B2

公开(公告)日：2004-09-07

申请号：US10264482

申请日：2002-10-04

Applicant: Tae-Won Lee ,  Do-In Bae ,  Sang-Yeoul Lee

Inventor： Tae-Won Lee ,  Do-In Bae ,  Sang-Yeoul Lee

IPC: H05B368

CPC classification number: H01L21/67103 ,  H05B3/72

Abstract: An apparatus for heating a substrate of a semiconductor device includes a hot plate, on which a semiconductor substrate is placed, and a heater for heating the hot plate. The hot plate is preferably a composite plate including a plurality of plates having different thermal conductivities from each other. For example, a first plate adjacent to the heater can be made of aluminum, which has a relatively high thermal conductivity. A second plate, laminated on top of the first plate, can be made of titanium or stainless steel, which both have a thermal conductivity lower than aluminum. A composite hot plate as disclosed herein is better able to maintain a constant temperature and a uniform temperature distribution in order to more uniformly heat a substrate and to reduce an amount of energy required for the heating process. In addition, the reliability and productivity of the semiconductor device manufactured by the apparatus can be improved.

Abstract translation: 用于加热半导体器件的衬底的装置包括其上放置半导体衬底的加热板和用于加热热板的加热器。 热板优选为包括彼此具有不同热导率的多个板的复合板。 例如，与加热器相邻的第一板可以由铝制成，其具有相对较高的热导率。 层压在第一板顶部的第二板可以由钛或不锈钢制成，它们都具有比铝低的导热性。 如本文所公开的复合热板更能够保持恒定的温度和均匀的温度分布，以便更均匀地加热基底并减少加热过程所需的能量。 此外，可以提高由该装置制造的半导体器件的可靠性和生产率。

公开(公告)号：US3911923A

公开(公告)日：1975-10-14

申请号：US45941474

申请日：1974-04-09

Applicant: YOON IN BAE

Inventor： YOON IN BAE

IPC: A61B19/00 ,  A61B17/12 ,  A61B17/30 ,  A61B17/42 ,  A61F6/20 ,  A61N3/00

CPC classification number: A61B17/12013 ,  A61B17/30 ,  A61B17/42 ,  A61B2017/12018 ,  A61F6/202 ,  A61F6/208

Abstract: A ring applicator device for use in applying an elastic occluding ring to an anatomical tubular structure which comprises an inner cylinder slidably disposed within an outer cylinder, forceps means slidably disposed within said inner cylinder, means for moving said forceps means into and out of the inner cylinder and means for ejecting an elastic ring from the end of said inner cylinder by axially displacing said outer and inner cylinders relative to each other.

Abstract translation: 一种用于将弹性闭塞环施加到解剖管状结构上的环施加器装置，其包括可滑动地设置在外筒内的内筒，可滑动地设置在所述内筒内的钳子装置，用于将所述钳子装置移入和移出内 气缸和装置，用于通过相对于彼此轴向移动所述外筒和内筒从所述内筒的端部弹出弹性环。

公开(公告)号：US09748154B1

公开(公告)日：2017-08-29

申请号：US12939588

申请日：2010-11-04

Applicant: Boo Yang Jung ,  Jong Sik Paek ,  Choon Heung Lee ,  In Bae Park ,  Sang Won Kim ,  Sung Kyu Kim ,  Sang Gyu Lee

Inventor： Boo Yang Jung ,  Jong Sik Paek ,  Choon Heung Lee ,  In Bae Park ,  Sang Won Kim ,  Sung Kyu Kim ,  Sang Gyu Lee

IPC: H01L23/00

CPC classification number: H01L24/09 ,  H01L21/56 ,  H01L23/00 ,  H01L23/3135 ,  H01L23/522 ,  H01L24/14 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2924/15172 ,  H01L2924/18162 ,  H01L2924/3511

Abstract: A wafer level fan out semiconductor device and a manufacturing method thereof are provided. A first sealing part is formed on lateral surfaces of a semiconductor die. A plurality of redistribution layers are formed on surfaces of the semiconductor die and the first sealing part, and solder balls are attached to the redistribution layers. The solder balls are arrayed on the semiconductor die and the first sealing part. In addition, a second sealing part is formed on the semiconductor die, the first sealing part and lower portions of the solder balls. The solder balls are exposed to the outside through the second sealing part. Since the first sealing part and the second sealing part are formed of materials having thermal expansion coefficients which are the same as or similar to each other, warpage occurring to the wafer level fan out semiconductor device can be suppressed.

公开(公告)号：US09133550B2

公开(公告)日：2015-09-15

申请号：US13433013

申请日：2012-03-28

Applicant: In-Bae Kim ,  Jong-Hyun Choung ,  Ji-Young Park ,  Seon-Il Kim ,  Jae-Woo Jeong ,  Sang Gab Kim ,  Sang-Woo Kim ,  Ki-Beom Lee ,  Dae-Woo Lee ,  Sam-Young Cho

Inventor： In-Bae Kim ,  Jong-Hyun Choung ,  Ji-Young Park ,  Seon-Il Kim ,  Jae-Woo Jeong ,  Sang Gab Kim ,  Sang-Woo Kim ,  Ki-Beom Lee ,  Dae-Woo Lee ,  Sam-Young Cho

IPC: C09K13/00 ,  C23F1/18 ,  C23F1/26 ,  H01L21/3213 ,  C09K13/08 ,  H01L27/12

CPC classification number: C23F1/18 ,  C09K13/08 ,  C23F1/26 ,  H01L21/32134 ,  H01L27/124

Abstract: An etching composition, a method of forming a metal pattern using the etching composition, and a method of manufacturing a display substrate are disclosed. The etching composition includes about 0.1% by weight to about 25% by weight of ammonium persulfate, about 0.1% by weight to about 25% by weight of an organic acid, about 0.01% by weight to about 5% by weight of a chelating agent, about 0.01% by weight to about 5% by weight of a fluoride compound, about 0.01% by weight to about 5% by weight of a chloride compound, about 0.01% by weight to about 2% by weight of an azole-based compound and a remainder of water. Thus, a copper layer may be stably etched to improve a reliability of manufacturing the metal pattern and the display substrate.

Abstract translation: 公开了一种蚀刻组合物，使用该蚀刻组合物形成金属图案的方法以及一种制造显示衬底的方法。 蚀刻组合物包含约0.1重量％至约25重量％的过硫酸铵，约0.1重量％至约25重量％的有机酸，约0.01重量％至约5重量％的螯合剂 ，约0.01重量％至约5重量％的氟化物，约0.01重量％至约5重量％的氯化物化合物，约0.01重量％至约2重量％的唑类化合物 和余下的水。 因此，可以稳定地蚀刻铜层以提高制造金属图案和显示基板的可靠性。

公开(公告)号：US20140162232A1

公开(公告)日：2014-06-12

申请号：US13972219

申请日：2013-08-21

Applicant: Seung-Jin YANG ,  Nam-Hyuk KIM ,  In-Bae CHANG ,  Seung-Hun JEUNG

Inventor： Seung-Jin YANG ,  Nam-Hyuk KIM ,  In-Bae CHANG ,  Seung-Hun JEUNG

IPC: G09B23/28

CPC classification number: G09B23/285 ,  G09B23/34

Abstract: A buttocks intramuscular injection training model is provided. The buttocks intramuscular injection training model includes a hip model having a similar shape to a human hip; injection modules inserted into both sides of the hip model and each being configured to comprise electrode layers to detect a needle and a muscle layer into which injection liquid is injected; a controller connected to the electrode layers to detect a location of the needle; and an input and output device wired or wireless connected to the controller for bidirectional communication with the controller and configured to visibly output the location of the needle.

Abstract translation: 提供臀部肌内注射训练模型。 臀部肌内注射训练模型包括与人类髋关节相似形状的髋关节模型; 注射模块插入到髋关节模型的两侧，并且每个被配置为包括用于检测注射液注射到其中的针和肌肉层的电极层; 连接到电极层的控制器以检测针的位置; 以及连接到控制器的有线或无线的输入和输出设备，用于与控制器的双向通信，并且被配置为可视地输出针的位置。

公开(公告)号：US20140099618A1

公开(公告)日：2014-04-10

申请号：US13967661

申请日：2013-08-15

Applicant: Seung-Jin YANG ,  Dae-Yong KIM ,  In-Bae CHANG

Inventor： Seung-Jin YANG ,  Dae-Yong KIM ,  In-Bae CHANG

IPC: G09B23/28

CPC classification number: G09B23/288

Abstract: There is provided a Cardiopulmonary Resuscitation (CPR) simulator enabling repeated defibrillation training to allow a user to practice CPR and use of a defibrillator, and the CPR simulator includes a dummy in a body shape similar to a human body shape; a first magnet installed on a upper right part of a chest of a body of the dummy; a second magnet installed on a bottom left side of the chest of the body of the dummy; a first training pad having a first metal sheet formed on one side thereof and a first electrode pad formed on the other side thereof; and a second training pad having a second metal sheet formed on one side thereof and a second electrode pad formed on the other side thereof.

Abstract translation: 提供了一种心肺复苏（CPR）模拟器，其能够进行重复除颤训练，以允许用户练习CPR并使用除颤器，并且CPR模拟器包括具有类似于人体形状的身体形状的虚拟人物; 安装在虚拟人体的胸部的右上方的第一磁体; 安装在虚拟人体的胸部左下方的第二磁体; 第一训练垫，其具有在其一侧上形成的第一金属片和在其另一侧上形成的第一电极焊盘; 以及第二训练垫，其具有形成在其一侧上的第二金属片和在其另一侧上形成的第二电极垫。

公开(公告)号：US08608400B2

公开(公告)日：2013-12-17

申请号：US13309898

申请日：2011-12-02

Applicant: Sang Joon Hong ,  In Bae Jang ,  Sang Hyun Park ,  Ho Seok Choi

Inventor： Sang Joon Hong ,  In Bae Jang ,  Sang Hyun Park ,  Ho Seok Choi

IPC: B23Q3/06 ,  B25B5/10 ,  F16B1/00

CPC classification number: G02B7/00 ,  Y10T403/45

Abstract: According to an example embodiment, a position arrangement device includes at least one joint module between a first base and a second base. The at least one joint module is configured to adjust a position of the second base relative to the first base based on elastic flexion in the joint module.

Abstract translation: 根据示例性实施例，位置排列装置包括在第一基座和第二基座之间的至少一个关节模块。 所述至少一个接头模块构造成基于所述接头模块中的弹性弯曲来调节所述第二基座相对于所述第一基座的位置。

公开(公告)号：US08446017B2

公开(公告)日：2013-05-21

申请号：US12562387

申请日：2009-09-18

Applicant: Jong Sik Paek ,  In Bae Park ,  Chang Deok Lee

Inventor： Jong Sik Paek ,  In Bae Park ,  Chang Deok Lee

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L25/0657 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/481 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/221 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/73209 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81815 ,  H01L2224/82106 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83

Abstract: A stackable wafer level package and a fabricating method thereof are disclosed. In the stackable wafer level package, bond pads (or redistribution layers) are arranged on a bottom semiconductor die, and metal pillars are formed on some of the bond pads positioned around the edges of the bottom semiconductor die. A top semiconductor die is electrically connected to the other bond pads, on which the metal pillars are not formed, positioned around the center of the bottom semiconductor die through conductive bumps. The metal pillars and the top semiconductor die are encapsulated by an encapsulant. A plurality of interconnection patterns electrically connected to the metal pillars are formed on the surface of the encapsulant. Solder balls are attached to the interconnection patterns. Due to this stack structure, the wafer level package is reduced in thickness and footprint. Therefore, the wafer level package is highly suitable for mobile applications.

Abstract translation: 公开了一种可堆叠的晶片级封装及其制造方法。 在可堆叠晶片级封装中，接合焊盘（或再分配层）被布置在底部半导体管芯上，并且金属柱形成在位于底部半导体管芯的边缘周围的一些接合焊盘上。 顶部半导体管芯电连接到其上未形成金属柱的其它接合焊盘，通过导电凸块定位在底部半导体管芯的中心附近。 金属柱和顶部半导体管芯由密封剂封装。 电连接到金属柱的多个互连图案形成在密封剂的表面上。 焊球附接到互连图案。 由于这种堆叠结构，晶片级封装的厚度和占地面积减小。 因此，晶片级封装非常适合于移动应用。

公开(公告)号：US20120318769A1

公开(公告)日：2012-12-20

申请号：US13406388

申请日：2012-02-27

Applicant: Jong-Hyun Choung ,  Ji-Young Park ,  Seon-Il Kim ,  Sang-Gab Kim ,  In-Bae Kim ,  Jae-Woo Jeong

Inventor： Jong-Hyun Choung ,  Ji-Young Park ,  Seon-Il Kim ,  Sang-Gab Kim ,  In-Bae Kim ,  Jae-Woo Jeong

IPC: C23F1/00 ,  H01B13/00

CPC classification number: C23F1/18 ,  H01L21/32134 ,  H01L27/124 ,  H01L27/1288 ,  H01L29/458 ,  H01L29/66765

Abstract: A method of forming a metal pattern on a display substrate includes blanket depositing a copper-based layer having a thickness between about 1,500 Å and about 5,500 Å on a base substrate, and forming a patterned photoresist layer on the copper-based layer. The copper-based layer is over-etched by an etching composition containing an oxidizing moderating agent where the over-etch factor is between about 40% and about 200% while using the patterned photoresist layer as an etch stopping layer, and where the etching composition includes ammonium persulfate between about 0.1% by weight and about 50% by weight, includes an azole-based compound between about 0.01% by weight and about 5% by weight and a remainder of water. Thus, reliability of the metal pattern and that of manufacturing a display substrate may be improved.

Abstract translation: 在显示基板上形成金属图案的方法包括：在基底基板上铺设厚度在约至约为500埃之间的铜基层，并在铜基层上形成图案化的光致抗蚀剂层。 通过含有氧化调节剂的蚀刻组合物对铜基层进行过蚀刻，其中过蚀刻因子在约40％至约200％之间，同时使用图案化的光致抗蚀剂层作为蚀刻停止层，并且其中蚀刻组合物 包括约0.1重量％至约50重量％的过硫酸铵，包括约0.01重量％至约5重量％的唑类化合物和剩余的水。 因此，可以提高金属图案的可靠性和制造显示基板的可靠性。