公开(公告)号：US4975314A

公开(公告)日：1990-12-04

申请号：US236389

申请日：1988-08-25

申请人： Mitsuru Yano ,  Norio Takahashi ,  Masatoshi Nakamizo ,  Tomoyuki Kido ,  Masatoshi Kawata ,  Katsumi Morikawa

发明人： Mitsuru Yano ,  Norio Takahashi ,  Masatoshi Nakamizo ,  Tomoyuki Kido ,  Masatoshi Kawata ,  Katsumi Morikawa

IPC分类号： B23K1/19 ,  C04B37/02 ,  C23C26/00 ,  F01N13/14 ,  F01N13/16

CPC分类号： C23C26/00 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/258 ,  Y10T428/2982

摘要： A ceramic coating bonded to a metal member comprising a bonding layer formed by the reaction of an oxide layer formed on a surface of said metal member in advance and a silicated; and an anti-oxidizing first ceramic layer formed on said bonding layer and comprising inorganic flaky particles burned to have a cross-linked laminate structure.

摘要翻译： 一种陶瓷涂层，其结合到金属构件上，包括通过预先形成在所述金属构件的表面上的氧化物层与硅化物反应而形成的结合层; 以及形成在所述接合层上并包含燃烧成具有交联层压结构的无机片状颗粒的抗氧化性第一陶瓷层。

公开(公告)号：US4430776A

公开(公告)日：1984-02-14

申请号：US296530

申请日：1981-08-26

申请人： Yoshitaka Shimizu ,  Norio Takahashi

发明人： Yoshitaka Shimizu ,  Norio Takahashi

IPC分类号： F16B19/00 ,  F16B5/06 ,  F16B21/08 ,  F16F1/36 ,  F16F15/08 ,  F25D23/00 ,  A44B17/00 ,  F16F7/00 ,  H01B17/00

CPC分类号： F16B5/065 ,  F16B21/082 ,  F25D23/006 ,  F25B2500/13 ,  Y10T24/28 ,  Y10T24/45

摘要： A combination vibration damper and fastener comprises head portions of the shape of a suction disc opposed back to back to each other across a space and adapted to collide with two separate panels, shanks extended in opposite directions from the head portions and provided with engaging means, damper pieces extended aslant from the head portions so as to be opposed to each other, and a connecting piece serving to connect the two head portions to each other. Insertion of the opposite shanks into the fitting holes bored in advance in the two panels fastens the two panels as separated by a fixed distance from each other. Vibration arising in one of the panels is absorbed by the damper pieces and prevented from reaching the other panel.

摘要翻译： 组合振动阻尼器和紧固件包括吸盘的形状的头部，其吸引盘的形状相互背对背地相对跨过空间并且适于与两个独立的面板碰撞，所述柄部与头部部分沿相反方向延伸并设置有接合装置， 阻挡件从头部向下延伸以彼此相对，以及用于将两个头部彼此连接的连接件。 将相对的杆插入到两个面板中预先钻孔的装配孔中，将两个面板彼此分开地固定一段距离。 在一个面板中产生的振动被阻尼器片吸收并防止到达另一个面板。

公开(公告)号：US08542456B2

公开(公告)日：2013-09-24

申请号：US13218150

申请日：2011-08-25

申请人： Takekazu Yamane ,  Yosuke Antoku ,  Katsuki Kurihara ,  Norio Takahashi ,  Kenzo Makino

发明人： Takekazu Yamane ,  Yosuke Antoku ,  Katsuki Kurihara ,  Norio Takahashi ,  Kenzo Makino

IPC分类号： G11B5/127 ,  G11B21/02 ,  G11B5/48 ,  G11B5/02

CPC分类号： G11B5/6076 ,  G11B5/3133 ,  G11B5/3136 ,  G11B5/3146 ,  G11B5/607

摘要： A magnetic head includes a medium facing surface that faces a surface of a recording medium, a write head section, a contact sensor that detects contact of the medium facing surface with the surface of the recording medium, and a heat sink adjacent to the contact sensor. The write head section has a magnetic pole that produces a write magnetic field for writing data on the recording medium. The contact sensor and the heat sink have respective end faces located in the medium facing surface. The contact sensor varies in resistance in response to temperature variations, and is to be energized. The heat sink includes an intermediate layer made of a nonmagnetic metal material, and two ferromagnetic layers made of a metal-based magnetic material, the two ferromagnetic layers being disposed with the intermediate layer therebetween, and being antiferromagnetically exchange-coupled to each other via the intermediate layer.

摘要翻译： 磁头包括面向记录介质的表面的介质面向表面，写入头部分，检测介质面向表面与记录介质表面的接触的接触传感器以及与接触传感器相邻的散热器 。 写头部分具有产生用于在记录介质上写入数据的写入磁场的磁极。 接触传感器和散热器具有位于介质面对表面中的相应端面。 接触传感器响应于温度变化而变化，并且被通电。 散热器包括由非磁性金属材料制成的中间层和由金属基磁性材料制成的两个铁磁层，所述两个铁磁层在其间具有中间层，并经由该铁磁材料彼此反铁磁交换耦合 中间层。

公开(公告)号：US08362668B2

公开(公告)日：2013-01-29

申请号：US12745108

申请日：2008-11-25

申请人： Norio Takahashi ,  Mikio Takabatake ,  Masanori Arata ,  Kazuto Sakai ,  Yutaka Hashiba ,  Wataru Ito ,  Tadashi Tokumasu ,  Masakatsu Matsubara

发明人： Norio Takahashi ,  Mikio Takabatake ,  Masanori Arata ,  Kazuto Sakai ,  Yutaka Hashiba ,  Wataru Ito ,  Tadashi Tokumasu ,  Masakatsu Matsubara

IPC分类号： H02K21/14 ,  H02K21/12 ,  H02K1/22

CPC分类号： H02K1/2766 ,  H02K2201/06

摘要： A rotor for a rotating electrical machine suppresses demagnetization of permanent magnets without deteriorating motor characteristics, is low-cost, and is highly reliable. The rotor has a plurality of rotor cores that are stacked together, a plurality of permanent magnets axially divided by the rotor cores and circumferentially arranged on each of the rotor cores, to circumferentially form magnetic irregularities, and a rotor blank made of nonmagnetic material arranged between those of the rotor cores that are adjacent to each other.

摘要翻译： 用于旋转电机的转子抑制永磁体的退磁而不会降低电动机特性，成本低，并且可靠性高。 转子具有堆叠在一起的多个转子铁芯，多个由转子铁芯轴向分隔并沿圆周方向设置在每个转子铁芯上的永久磁铁，以周向形成磁性不规则，以及由非磁性材料制成的转子坯体， 那些转子铁芯彼此相邻。

公开(公告)号：US08240026B2

公开(公告)日：2012-08-14

申请号：US12232785

申请日：2008-09-24

申请人： Takeo Kagami ,  Tetsuya Kuwashima ,  Norio Takahashi

发明人： Takeo Kagami ,  Tetsuya Kuwashima ,  Norio Takahashi

IPC分类号： G11B5/127 ,  H04R31/00

CPC分类号： G11B5/3906 ,  G11B5/3909 ,  G11B2005/3996 ,  Y10T29/49021 ,  Y10T29/49039 ,  Y10T29/49043 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49048 ,  Y10T29/49052

摘要： A method for manufacturing a magneto-resistive device. The magneto-resistive device is for reducing the deterioration in the characteristics of the device due to annealing. The magneto-resistive device has a magneto-resistive layer formed on one surface side of a base, and an insulating layer formed of two layers and deposited around the magneto-resistive layer. The layer of the insulating layer closest to the base is made of a metal or semiconductor oxide. This layer extends over end faces of a plurality of layers made of different materials from one another, which make up the magneto-resistive device, and is in contact with the end faces of the plurality of layers with the same materials.

摘要翻译： 一种用于制造磁阻装置的方法。 该磁阻装置用于减少由退火引起的器件特性的劣化。 磁阻装置具有形成在基底的一个表面侧上的磁阻层和由两层形成并且沉积在磁阻层周围的绝缘层。 最靠近基底的绝缘层的层由金属或半导体氧化物制成。 该层在由不同材料制成的多个层的端面上延伸，其构成磁阻装置，并且与相同材料的多个层的端面接触。

公开(公告)号：US20120091848A1

公开(公告)日：2012-04-19

申请号：US13130206

申请日：2009-11-19

申请人： Kazuto Sakai ,  Yutaka Hashiba ,  Norio Takahashi ,  Kazuaki Yuuki

发明人： Kazuto Sakai ,  Yutaka Hashiba ,  Norio Takahashi ,  Kazuaki Yuuki

IPC分类号： H02K1/27

CPC分类号： H02K1/2766

摘要： An increase of the magnetization current can be prevented during demagnetization and magnetization, and a variable speed operation can be achieved at a high power output over a wide range of from a low speed to a high speed. A rotor (1) is configured by a rotor core (2), a variable magnetic force magnet (3) and a fixed magnetic force magnet (4). A variable magnetic force magnet (3) and a fixed magnetic force magnet (4a) are overlapped in the magnetization direction thereof to form a series of magnets. The series of magnets is located within the rotor core at a position where the magnetization direction is in the direction of a d-axis. On either side of the series of magnets of the variable magnetic force magnet (3) and the fixed magnetic force magnet (4a), fixed magnetic force magnets (4b, 4b) are located at a position where the magnetization direction is in the direction of the d-axis. When the flux linkage of the variable magnetic force magnet is reduced, a current of an armature coil allows a magnetic field to act in the reverse direction to the magnetization direction of the variable magnetic force magnet. When the flux linkage of the variable magnetic force magnet is increased, a current of the armature coil allows a magnetic field to act in the same direction as the magnetization direction of the variable magnetic force magnet.

摘要翻译： 在退磁和磁化期间可以防止磁化电流的增加，并且可以在从低速到高速的宽范围内的高功率输出下实现可变速度操作。 转子（1）由转子铁芯（2），可变磁力磁铁（3）和固定磁力磁铁（4）构成。 可变磁力磁体（3）和固定磁力磁铁（4a）在其磁化方向上重叠以形成一系列磁体。 一系列磁体位于转子芯内的磁化方向为d轴方向的位置。 在可变磁力磁铁（3）和固定磁力磁铁（4a）的一系列磁铁的两侧，固定磁力磁铁（4b，4b）位于磁化方向为 d轴。 当可变磁力磁铁的磁链减小时，电枢线圈的电流允许磁场沿与可变磁力磁铁的磁化方向相反的方向作用。 当可变磁力磁铁的磁通增加时，电枢线圈的电流允许磁场沿与可变磁力磁铁的磁化方向相同的方向起作用。

公开(公告)号：US20110304235A1

公开(公告)日：2011-12-15

申请号：US13139889

申请日：2009-12-15

申请人： Yutaka Hashiba ,  Kazuto Sakai ,  Norio Takahashi ,  Kazuaki Yuuki ,  Masanori Arata ,  Yusuke Matsuoka ,  Motoyasu Mochizuki ,  Tadashi Tokumasu

发明人： Yutaka Hashiba ,  Kazuto Sakai ,  Norio Takahashi ,  Kazuaki Yuuki ,  Masanori Arata ,  Yusuke Matsuoka ,  Motoyasu Mochizuki ,  Tadashi Tokumasu

IPC分类号： H02K3/16 ,  H02K15/02

CPC分类号： H02K15/03 ,  H02K1/02 ,  H02K1/223 ,  H02K1/2766 ,  H02K21/028 ,  Y10T29/49009 ,  Y10T29/49012

摘要： According to one embodiment, a rotor is configured by a rotor core and magnetic poles. Two or more types of permanent magnets are used such that each product of coercivity and thickness in the magnetization direction becomes different. A stator is located outside the rotor with air gap therebetween and configured by an armature core winding. At least one permanent magnet is magnetized by a magnetic field by a current of the armature winding to change a magnetic flux content thereof irreversibly. A short circuited coil is provided to surround a magnetic path portion of the other permanent magnet excluding the magnet changed irreversibly and a portion adjacent to the other permanent magnet where the magnetic flux leaks. A short-circuit current is generated in the short circuited coil by the magnetic flux generated by conducting a magnetization current to the winding. A magnetic field is generated by the short-circuit current.

摘要翻译： 根据一个实施例，转子由转子芯和磁极构成。 使用两种或更多种类型的永磁体，使得矫顽力和磁化方向上的厚度的每个乘积变得不同。 定子位于转子外部，其间具有气隙，并由电枢铁心绕组构成。 至少一个永磁体被电枢绕组的电流通过磁场磁化，以不可逆地改变其磁通量。 设置短路线圈以围绕除了不可逆地改变的磁体之外的另一个永磁体的磁路部分和与磁通量泄漏的另一个永久磁铁相邻的部分。 短路电流由短路线圈产生的磁通量通过向绕组施加磁化电流而产生。 由短路电流产生磁场。

公开(公告)号：US20110299187A1

公开(公告)日：2011-12-08

申请号：US12794148

申请日：2010-06-04

申请人： Yosuke ANTOKU ,  Norio Takahashi ,  Katsuki Kurihara

发明人： Yosuke ANTOKU ,  Norio Takahashi ,  Katsuki Kurihara

IPC分类号： G11B5/02 ,  G11B5/127

CPC分类号： G11B5/6011 ,  G11B5/3163 ,  G11B5/607 ,  Y10T29/49027

摘要： A magnetic head includes a reproducing element for reproducing information recorded on a magnetic recording medium, a recording element for recording information on the magnetic recording medium, and a heating resistor. The magnetic head has a magnetic medium-facing surface on which the reproducing element and the recording element are exposed.The magnetic head is obtained as follows: (1) a protective film is formed to cover the magnetic medium-facing surface; (2) within a case of a magnetic recording/reproducing apparatus including the magnetic recording medium, the magnetic medium-facing surface is opposed to a surface of the magnetic recording medium; (3) the heating resistor is allowed to generate heat by power supply while rotating the magnetic recording medium, wherein thermal expansion due to the heat generation causes bulging of the magnetic medium-facing surface, bringing the protective film into contact with the magnetic recording medium; and (4) a portion of the protective film covering at least one of the reproducing element and the recording element is removed by scraping.

摘要翻译： 磁头包括用于再现记录在磁记录介质上的信息的再现元件，用于在磁记录介质上记录信息的记录元件和加热电阻器。 磁头具有面向再现元件和记录元件的金属介质表面。 磁头如下获得：（1）形成保护膜以覆盖面向磁介质的表面; （2）在包括磁记录介质的磁记录/再现装置的情况下，磁介质面向表面与磁记录介质的表面相对; （3）使加热电阻器在旋转磁记录介质的同时通过供电产生热量，其中由于发热引起的热膨胀导致磁介质面向表面的膨胀，使保护膜与磁记录介质接触 ; 和（4）通过刮擦除去覆盖再现元件和记录元件中的至少一个的保护膜的一部分。

公开(公告)号：US07911047B2

公开(公告)日：2011-03-22

申请号：US12081740

申请日：2008-04-21

申请人： Hidenori Hasegawa ,  Norio Takahashi

发明人： Hidenori Hasegawa ,  Norio Takahashi

IPC分类号： H01L23/49 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L23/043 ,  H01L23/053 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes: a package substrate that includes a recessed portion, with electrode pads that are electrically connected to electrodes of the semiconductor chip being formed inside the recessed portion; a semiconductor chip that is housed in the recessed portion; terminal-use wires that are formed on the surface of the package substrate and are electrically connected to the electrode pads; external connection pads that are formed on a back surface of the package substrate and are electrically connected to the electrode pads; a sealing resin portion that includes a grinded surface that is parallel to the surface of the package substrate, and seals at least the semiconductor chip by a sealing resin; rewiring pads that are formed on the grinded surface; and connecting wires that are formed on the grinded surface and electrically interconnect the terminal-use wires and the rewiring pads.

摘要翻译： 半导体器件包括：封装衬底，其包括凹部，电极焊盘与半导体芯片的电极电连接形成在凹部内; 半导体芯片，其容纳在所述凹部中; 端子用导线，其形成在封装基板的表面上并与电极焊盘电连接; 外部连接焊盘，其形成在封装基板的背面并电连接到电极焊盘; 密封树脂部分，其包括平行于所述封装基板的表面的研磨表面，并且通过密封树脂至少密封所述半导体芯片; 形成在研磨表面上的再布线垫; 以及形成在研磨表面上的电线，并且使端子用导线和再布线焊盘电连接。

公开(公告)号：US07868470B2

公开(公告)日：2011-01-11

申请号：US12458808

申请日：2009-07-23

申请人： Norio Takahashi

发明人： Norio Takahashi

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/06 ,  H01L23/3128 ,  H01L23/49575 ,  H01L23/525 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a multichip package wherein a plurality of semiconductor chip packages (100) in each of which first electrode pads (16a) provided in a main surface of a semiconductor chip, and first bonding pads (20a) and first central bonding pads (18a) formed in an upper area of the main surface are respectively electrically connected by first redistribution wiring layers (24) in a one-to-one correspondence relationship, and second electrode pads (17b), and second bonding pads (22b) and second central bonding pads (18b) formed in an upper area of the main surface are respectively electrically connected by second redistribution wiring layers (26) in a one-to-one correspondence relationship, are stacked on one another.

摘要翻译： 本发明提供一种多芯片封装，其中，设置在半导体芯片的主表面中的第一电极焊盘（16a）和第一焊盘（20a）和第一中心焊盘（20a）中的多个半导体芯片封装（100） 形成在主表面的上部区域中的第一电极（18a）分别由一对一对应关系的第一再分布布线层（24）电连接，第二电极焊盘（17b）和第二焊盘（22b） 形成在主表面的上部区域的中心接合焊盘（18b）分别通过第一再分配布线层（26）以一对一对应关系彼此电连接。