公开(公告)号：US10734236B2

公开(公告)日：2020-08-04

申请号：US16399703

申请日：2019-04-30

Applicant: INTEL CORPORATION

Inventor： Sasha N. Oster ,  Fay Hua ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Henning Braunisch ,  Johanna M. Swan

IPC: H01L21/4763 ,  H01L21/285 ,  H01L21/768 ,  H01L21/033 ,  B82Y40/00 ,  H01L23/66 ,  H01L25/16 ,  H05K1/16 ,  H05K3/28 ,  H01L23/538 ,  H01L21/48 ,  H05K1/02 ,  H05K3/34

Abstract: Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.

公开(公告)号：US10680788B2

公开(公告)日：2020-06-09

申请号：US16127800

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Emanuel Cohen ,  Sasha N. Oster

IPC: H04L5/14 ,  H04B3/52 ,  H04B3/23 ,  H04W72/04 ,  H04B1/44

Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.

公开(公告)号：US10658566B2

公开(公告)日：2020-05-19

申请号：US16072166

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Shawna M. Liff ,  Feras Eid ,  Aleksandar Aleksov ,  Sasha N. Oster ,  Baris Bicen ,  Thomas L. Sounart ,  Johanna M. Swan ,  Adel A. Elsherbini ,  Valluri R. Rao

IPC: G02B26/00 ,  H01L41/09 ,  H01L27/32 ,  H05B45/00 ,  F21S10/02 ,  G02F1/01 ,  H01L41/22 ,  H01L51/00 ,  G06F3/041

Abstract: Embodiments of the invention include piezoelectrically driven switches that are used for modifying a background color or light source color in display systems, and methods of forming such devices. In an embodiment, a piezoelectrically actuated switch for modulating a background color in a display may include a photonic crystal that has a plurality of blinds oriented substantially perpendicular to a surface of the display. In an embodiment, the blinds include a black surface and a white surface. The switch may also include an anchor spaced away from an edge of the photonic crystal and a piezoelectric actuator formed on the surface of the anchor and a surface of the photonic crystal. Some embodiments may include a photonic crystal that is a multi-layer polymeric structure or a polymer chain with a plurality of nanoparticles spaced at regular intervals on the polymer chain.

公开(公告)号：US20190312001A1

公开(公告)日：2019-10-10

申请号：US16464930

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Veronica A. Strong ,  Sasha N. Oster ,  Shawna M. Liff

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: A system for packaging integrated circuits includes an integrated circuit having one or more integrated circuit terminals. The system for packaging integrated circuits also includes a substrate having one or more substrate terminals. The system for packaging integrated circuits further includes an electrically conductive adhesive in communication with the integrated circuit terminals and the substrate terminals. The electrically conductive adhesive establishes an electrical connection between each of the one or more integrated circuit terminals and the one or more substrate terminals. The electrical connection between each of the one or more integrated circuit terminals and the one or more substrate terminals are enclosed in a dielectric. The system for packaging integrated circuits includes a second adhesive in communication with the integrated circuit and the substrate, wherein the second adhesive couples the integrated circuit and substrate together.

公开(公告)号：US10404499B2

公开(公告)日：2019-09-03

申请号：US15388564

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Emanuel Cohen ,  Sasha N. Oster ,  Telesphor Kamgaing

IPC: H04B10/90 ,  H04L25/03 ,  H04J1/08

Abstract: Embodiments of the present disclosure may relate to a transmitter that includes a baseband dispersion compensator to perform baseband dispersion compensation on an input signal. Embodiments may also include a receiver that includes a radio frequency (RF) dispersion compensator to perform RF dispersion compensation. Embodiments may also include a dielectric waveguide coupled with the transmitter and the receiver, the dielectric waveguide to convey the RF signal from the transmitter to the receiver. Other embodiments may be described and/or claimed.

公开(公告)号：US10353146B2

公开(公告)日：2019-07-16

申请号：US15635881

申请日：2017-06-28

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Michael C. Rifani ,  Sasha N. Oster ,  Adel A. Elsherbini

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/42 ,  H05K1/02 ,  H04B10/80

Abstract: Various embodiments disclosed relate to a stretchable packaging system. The system includes a first electronic component. The first electronic component includes a first optical emitter. The system further includes a second electronic component. The second electronic component includes a first receiver. An optical interconnect including a first elastomer having a first refractive index connects the first optical emitter to the first receiver. An encapsulate layer including a second elastomer having a second refractive index at least partially encapsulates the first electronic component, the second electronic component, and the optical interconnect.

公开(公告)号：US10249925B2

公开(公告)日：2019-04-02

申请号：US15282086

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/12 ,  H01P3/14 ,  H01P11/00 ,  G06F1/18 ,  H01P3/16

Abstract: An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.

公开(公告)号：US20180316434A1

公开(公告)日：2018-11-01

申请号：US15965637

申请日：2018-04-27

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Emanuel Cohen

IPC: H04B10/2575

CPC classification number: H04B10/2575 ,  H04B10/2513

Abstract: Embodiments of the present disclosure may relate to a transmitter to transmit a radio frequency (RF) signal to a receiver via a dielectric waveguide where the transmitter includes a plurality of mixers to generate modulated RF signals and a combiner to combine the modulated RF signals. Embodiments may also include a receiver to receive, from a dielectric waveguide, a RF signal where the receiver includes a splitter to split the RF signal into a plurality of signal paths, a plurality of filters, and a plurality of demodulators. Embodiments may also include a dielectric waveguide communication apparatus that may include the transmitter and the receiver. Other embodiments may be described and/or claimed.

公开(公告)号：US20180287115A1

公开(公告)日：2018-10-04

申请号：US15475751

申请日：2017-03-31

Applicant: INTEL CORPORATION

Inventor： Veronica A. Strong ,  Sasha N. Oster ,  Feras Eid ,  Aranzazu Maestre Caro

IPC: H01M2/10 ,  H01M4/70 ,  H01M4/66 ,  H01M4/04 ,  C23C18/38 ,  C23C18/18 ,  C23C18/16 ,  A41D1/00 ,  A61B5/00

CPC classification number: H01M2/1066 ,  A41D1/002 ,  A61B5/01 ,  A61B5/024 ,  A61B5/14532 ,  A61B5/4266 ,  A61B5/6804 ,  B32B5/24 ,  C23C18/1641 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/38 ,  G06F1/163 ,  H01L23/5387 ,  H01M4/0402 ,  H01M4/661 ,  H01M10/0422 ,  H01M10/0436 ,  H01M2220/30 ,  H05K1/038 ,  H05K2201/10037

Abstract: An apparatus system is provided which comprises: a fabric; a self-assembled monolayer (SAM) material formed on the fabric; and a battery cell formed on the fabric, wherein a current collector of the battery cell is at least in part formed on the SAM material.

公开(公告)号：US10083923B2

公开(公告)日：2018-09-25

申请号：US14860614

申请日：2015-09-21

Applicant: INTEL CORPORATION

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Feras Eid

IPC: H01L23/58 ,  H01L23/66 ,  H01L23/498 ,  H01L23/367 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/014 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/00014

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.