公开(公告)号：US20080138612A1

公开(公告)日：2008-06-12

申请号：US11795365

申请日：2006-01-11

申请人： Yoshikazu Kondo ,  Atsushi Saito ,  Takahide Toyama

发明人： Yoshikazu Kondo ,  Atsushi Saito ,  Takahide Toyama

IPC分类号： B32B17/06

CPC分类号： C03C17/32 ,  C03C17/30 ,  C03C17/42 ,  G02B1/105 ,  G02B1/14 ,  G02B1/16 ,  G02B1/18 ,  H04N1/00909 ,  Y10T428/265

摘要： The object of the present invention is to provide:a glass member characterized by excellent friction resistance property, and antifouling property;a reading glass wherein, when this glass member is used as the reading glass of a scanner or a copier, toner, dust or adhesive does not easily deposit on the reading glass, with the result that deterioration in the copied image quality such as black spots or black streaks can be avoided;and a scanner or a copier wherein the glass is used.The glass member including a glass substrate including a fluorine containing film coated directly, not through any other layer interposed, on at least one surface of the glass substrate, wherein an element composition of the fluorine containing film is characterized in that a content of fluorine atoms exceeds 30 atomic percent, and an atomic ratio of oxygen atom to fluorine atom (O/F) is between 0.2 and 1.0.

摘要翻译： 本发明的目的是提供：具有优异的耐摩擦性能和防污性能的玻璃构件; 一种读数玻璃，其中，当将该玻璃构件用作扫描仪或复印机的读数玻璃时，调色剂，灰尘或粘合剂不容易沉积在读数玻璃板上，导致复印图像质量如黑点的劣化 或黑条可以避免; 以及使用玻璃的扫描器或复印机。 所述玻璃构件包括玻璃基板，所述玻璃基板包括直接涂覆在所述玻璃基板的至少一个表面上的通过任何其它层插入的含氟膜，其中所述含氟膜的元素组成的特征在于，氟原子的含量 超过30原子％，氧原子与氟原子的原子比（O / F）为0.2〜1.0。

公开(公告)号：US07166920B2

公开(公告)日：2007-01-23

申请号：US11103412

申请日：2005-04-11

申请人： Atsushi Saito ,  Shuichi Tanaka

发明人： Atsushi Saito ,  Shuichi Tanaka

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic component electrically connected to a counter substrate through a pad on an active surface, characterized in that a resin bump on the active surface and an electrically conductive film on the resin bump constitute a bump electrode, and that a plurality of bump electrodes are electrically connected to the one pad.

摘要翻译： 一种电子部件，其通过活性表面上的焊盘与相对基板电连接，其特征在于，所述有源面上的树脂凸块和所述树脂凸块上的导电膜构成凸起电极，并且多个凸块电极为电气 连接到一个垫。

公开(公告)号：US07122896B2

公开(公告)日：2006-10-17

申请号：US10914121

申请日：2004-08-10

申请人： Atsushi Saito ,  Shuichi Tanaka

发明人： Atsushi Saito ,  Shuichi Tanaka

IPC分类号： H01L23/48 ,  H01L29/40 ,  B23K31/02

CPC分类号： H05K3/325 ,  H01L23/49816 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/07811 ,  H01L2924/12044 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00

摘要： To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in the mounting structure of the electronic component, the bump electrode includes a core composed of an inner resin and a conductive film covering the surface of the core. The bump electrode is brought into conductive contact with the terminal directly and is elastically deformed to make contact with the face of the substrate in a planar manner. A sealing resin is filled in around the conductive contact portion between the bump electrode and the terminal to hold the bump electrode and the terminal.

摘要翻译： 为了提供电子部件的低成本安装结构，并且增加突起电极和形成在基板上的端子之间的导电连接的可靠性，在电子部件的安装结构中，凸块电极包括由 内部树脂和覆盖芯的表面的导电膜。 凸起电极直接与端子导电接触，并且以平面方式弹性变形以与基板的表面接触。 密封树脂填充在凸起电极和端子之间的导电接触部分周围，以保持凸起电极和端子。

公开(公告)号：US07070368B2

公开(公告)日：2006-07-04

申请号：US10255693

申请日：2002-09-27

申请人： Shinji Murakami ,  Kazuya Hattori ,  Yoshihiko Yamada ,  Tadashi Otani ,  Atsushi Saito

发明人： Shinji Murakami ,  Kazuya Hattori ,  Yoshihiko Yamada ,  Tadashi Otani ,  Atsushi Saito

IPC分类号： B23Q15/00

CPC分类号： G05B19/416 ,  B23Q15/013 ,  G05B2219/36278 ,  G05B2219/36283 ,  G05B2219/36288 ,  Y10T409/300896 ,  Y10T409/30112 ,  Y10T409/303808

摘要： A machining feed rate for machining a workpiece portion to be machined by a machining tool based upon a machining program is set by reading a data of the workpiece portion, by sectionalizing the workpiece portion in an area corresponding to a workpiece shape of the workpiece portion, and by determining a shape change point based upon a workpiece shape of the workpiece portion. The machining feed rate is set for each area and for each shape change point with reference to a predetermined parameter corresponding to an attribute of the each sectionalized area and corresponding to an attribute of the each determined shape change point.

公开(公告)号：US07028214B2

公开(公告)日：2006-04-11

申请号：US10206104

申请日：2002-07-29

申请人： Terumi Takashi ,  Seiichi Mita ,  Atsushi Saito

发明人： Terumi Takashi ,  Seiichi Mita ,  Atsushi Saito

IPC分类号： G06F11/00

CPC分类号： G11B20/10009 ,  G11B20/00086 ,  G11B20/10055 ,  G11B20/10074 ,  G11B20/10481 ,  G11B20/18 ,  G11B2020/10638 ,  G11B2020/183

摘要： In a data recovery processing, the conventional overhead, primarily, latency due to a rotational recording media is removed. Secondary, in a signal processing or in a recording and reproducing apparatus, reliability of data reproduction is improved by repeatedly processing data. These processing are achieved that input signal, i.e., raw analog signal read from the recording media is digitized to be stored in a secondary storage such as a memory or a FIFO memory. The apparatus includes a signal processing circuit to repeatedly process the stored digital signal in the secondary storage. When detecting data, operation of the circuit is efficiently controlled by a change over detector parameters, in which characteristics for the detecting performance. Resultantly, data recovery processing speed is increased and reliability of data reproduced is improved.

公开(公告)号：US20060069945A1

公开(公告)日：2006-03-30

申请号：US11272837

申请日：2005-11-15

申请人： Terumi Takashi ,  Seiichi Mita ,  Atsushi Saito

发明人： Terumi Takashi ,  Seiichi Mita ,  Atsushi Saito

IPC分类号： G06F11/00

CPC分类号： G11B20/10009 ,  G11B20/00086 ,  G11B20/10055 ,  G11B20/10074 ,  G11B20/10481 ,  G11B20/18 ,  G11B2020/10638 ,  G11B2020/183

摘要： In a data recovery processing, the conventional overhead, primarily, latency due to a rotational recording media is removed. Secondary, in a signal processing or in a recording and reproducing apparatus, reliability of data reproduction is improved by repeatedly processing data. These processing are achieved that input signal, i.e., raw analog signal read from the recording media is digitized to be stored in a secondary storage such as a memory or a FIFO memory. The apparatus includes a signal processing circuit to repeatedly process the stored digital signal in the secondary storage. When detecting data, operation of the circuit is efficiently controlled by a change over detector parameters, in which characteristics for the detecting performance. Resultantly, data recovery processing speed is increased and reliability of data reproduced is improved.

公开(公告)号：US20060069845A1

公开(公告)日：2006-03-30

申请号：US11228776

申请日：2005-09-16

申请人： Yoshiteru Ishida ,  Hitoshi Ogawa ,  Atsushi Saito ,  Terumi Takashi

发明人： Yoshiteru Ishida ,  Hitoshi Ogawa ,  Atsushi Saito ,  Terumi Takashi

IPC分类号： G06F12/00

CPC分类号： G11B19/04 ,  G11B20/10 ,  G11B27/036 ,  G11B27/322 ,  G11B2220/2516

摘要： In one embodiment, a write/read apparatus includes an external interface section for data input; an external interface section for data output; a memory for temporarily storing the data that is input through the external interface section for data input and written on the recording medium and the data that is read from the recording medium and sent to the outside through the external interface section for data output; an address generating section for generating unique addresses associated with physical block addresses of the recording medium; a flag generating section for generating flags for prohibiting overwriting of the data to be written on the recording medium; and a processing section for adding the unique addresses generated in the address generating section to the data that is stored in the memory and that is to be written on the recording medium. The data with the addition of the flags generated in the flag generating section and the unique addresses is written on the recording medium.

公开(公告)号：US20050230773A1

公开(公告)日：2005-10-20

申请号：US11103412

申请日：2005-04-11

申请人： Atsushi Saito ,  Shuichi Tanaka

发明人： Atsushi Saito ,  Shuichi Tanaka

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/485 ,  H01L31/0203

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic component electrically connected to a counter substrate through a pad on an active surface, characterized in that a resin bump on the active surface and an electrically conductive film on the resin bump constitute a bump electrode, and that a plurality of bump electrodes are electrically connected to the one pad.

摘要翻译： 一种电子部件，其通过活性表面上的焊盘与相对基板电连接，其特征在于，所述有源面上的树脂凸块和所述树脂凸块上的导电膜构成凸起电极，并且多个凸块电极为电气 连接到一个垫。

公开(公告)号：US20050224561A1

公开(公告)日：2005-10-13

申请号：US11098120

申请日：2005-04-04

申请人： Munenori Kurasawa ,  Atsushi Saito

发明人： Munenori Kurasawa ,  Atsushi Saito

IPC分类号： B23K31/02 ,  G02F1/13 ,  G03F7/20 ,  G03F9/00 ,  H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/485 ,  H01L23/544 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K3/34

CPC分类号： G03F9/708 ,  G02F1/13452 ,  G03F7/70633 ,  G03F9/7076 ,  G03F9/7084 ,  H01L21/56 ,  H01L23/3164 ,  H01L23/3171 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/11 ,  H01L2224/1147 ,  H01L2224/13 ,  H01L2224/13083 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13171 ,  H01L2224/1318 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/189 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/10674 ,  H05K2203/1105 ,  H05K2203/1189 ,  H05K2203/1469 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2224/13099 ,  H01L2924/00

摘要： A method of manufacturing an electronic component mounting body is used for mounting an IC chip having a bumps as an external mounting terminal on a base material made of thermoplastic resin, comprising: a bump burying step of burying the bumps into the base material by heating and pressing the IC chip toward the base material to expose a portion of the bumps to a base material surface on the opposite side of the IC chip, and a step of forming a conductor conductively connected to the bump by arranging conductive material on the base material surface to which the portion of the bumps are exposed.

摘要翻译： 使用电子部件安装体的制造方法将具有作为外部安装端子的凸点的IC芯片安装在由热塑性树脂制成的基材上，包括：凸块埋入步骤，通过加热将凸块埋入基材中;以及 将所述IC芯片朝向所述基材挤压以将所述凸块的一部分暴露于所述IC芯片的相对侧上的基材表面，以及通过在所述基材表面上布置导电材料形成导体连接到所述凸块的导体的步骤 凸块的一部分暴露在其上。

公开(公告)号：US20050070046A1

公开(公告)日：2005-03-31

申请号：US10916621

申请日：2004-08-12

申请人： Atsushi Saito

发明人： Atsushi Saito

IPC分类号： G02F1/1345 ,  G02F1/13 ,  G02F1/133 ,  H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/538 ,  H05K3/00 ,  H05K3/32

CPC分类号： H01L24/81 ,  H01L21/4867 ,  H01L23/3114 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/16237 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/76155 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2203/1189 ,  H05K2203/1469 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing an electronic device includes: mounting a plurality of electronic components to a thermoplastic resin layer so that the bump electrode is installed in the thermoplastic resin layer, each of the electronic components including a bump electrode; forming a conductor conductively connected with the bump electrode on a surface of the thermoplastic resin layer opposite to a surface on which the electronic components are mounted; and dividing the thermoplastic resin layer in units of each of the electronic components.

摘要翻译： 一种制造电子设备的方法包括：将多个电子部件安装到热塑性树脂层上，使得凸起电极安装在热塑性树脂层中，每个电子部件包括凸起电极; 在与所述电子部件安装的表面相反的热塑性树脂层的表面上形成与所述凸块电极导电连接的导体; 并以每个电子部件为单位分割热塑性树脂层。