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公开(公告)号：US4583378A
公开(公告)日：1986-04-22
申请号：US708942
申请日：1985-03-06
申请人： Noriaki Sakamoto , Shinji Hirai
发明人： Noriaki Sakamoto , Shinji Hirai
CPC分类号： F25B31/006 , F25D21/04
摘要： A refrigerator has a main body. A compressor is provided in the bottom portion of the body, and a receiving box for housing electric appliances is arranged in the body above the compressor. A thermosiphon for conveying the heat from the compressor to the receiving box is provided in the body. The thermosiphon includes a heat receiving portion located in the vicinity of the compressor, an upper portion located in the vicinity of the receiving box, an advancing path extending from the heat receiving portion to the upper portion, and a returning path extending from the upper portion to the heat receiving portion. The upper portion is adhered to the body by a tape of aluminum foil, thereby having heat radiation efficiency higher than that of the advancing portion.
摘要翻译： 冰箱有一个主体。 在本体的底部设有压缩机，在压缩机的上方配置有用于容纳电器的收纳箱。 用于将热量从压缩机输送到接收箱的热虹吸管设置在主体中。 热虹吸管包括位于压缩机附近的受热部分，位于接收箱附近的上部，从热接收部分延伸到上部的前进路径，以及从上部延伸的返回路径 到热接收部分。 上部通过铝箔带粘附到主体上，从而具有高于推进部分的散热效率。
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公开(公告)号：US4485639A
公开(公告)日：1984-12-04
申请号：US467881
申请日：1983-02-18
申请人： Noriaki Sakamoto
发明人： Noriaki Sakamoto
CPC分类号： F25D21/04 , F25B31/006
摘要： A compressor included in a refrigerative cycle is disposed in a refrigerator with a rear plate and side plates. The cooling device for the compressor includes a thermo-siphon which includes a closed pipe loop disposed independent of the refrigerative cycle to cool the compressor. The thermo-siphon contains a gaseous liquid refrigerant corresponding to 60% to 80% of the inner volume of the closed pipe loop and has a heat absorbing portion immersed in an oil stored in the compressor and a heat discharging portion at least a part of which thermally contacts the rear plate or the side plates.
摘要翻译： 包括在制冷循环中的压缩机设置在具有后板和侧板的冰箱中。 用于压缩机的冷却装置包括热虹吸管，其包括独立于制冷循环设置的冷却压缩机的封闭管道回路。 热虹吸管包含对应于封闭管道回路的内部体积的60％至80％的气态液体制冷剂，并且具有浸入存储在压缩机中的油中的吸热部分和其至少一部分的排热部分 热接触后板或侧板。
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公开(公告)号：US20130003326A1
公开(公告)日：2013-01-03
申请号：US13402700
申请日：2012-02-22
IPC分类号： H05K5/02
CPC分类号： H05K9/006
摘要： According to one embodiment, an electronic device includes a printed circuit board includes a plurality of circuit parts, a conductive shield case provided on the printed circuit board, a tuner provided on the printed circuit board and inside the shield case, a first ground portion provided on the printed circuit board and outside the shield case and a second ground portion provided on the printed circuit board and inside the shield case. The first ground portion is electrically connected to the second ground portion via the shield case.
摘要翻译： 根据一个实施例，电子设备包括印刷电路板，其包括多个电路部分，设置在印刷电路板上的导电屏蔽壳体，设置在印刷电路板上并在屏蔽壳体内部的调谐器，提供的第一接地部分 在印刷电路板上和屏蔽壳外部，以及设置在印刷电路板上和屏蔽罩内部的第二接地部分。 第一接地部分经由屏蔽壳体电连接到第二接地部分。
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公开(公告)号：US08283681B2
公开(公告)日：2012-10-09
申请号：US12905855
申请日：2010-10-15
申请人： Noriaki Sakamoto , Naoki Tanahashi , Tsuyoshi Hasegawa , Takaya Kusabe , Masahiko Mizutani , Hideki Mizuhara , Yoshinari Sakuma
发明人： Noriaki Sakamoto , Naoki Tanahashi , Tsuyoshi Hasegawa , Takaya Kusabe , Masahiko Mizutani , Hideki Mizuhara , Yoshinari Sakuma
IPC分类号： H01L29/18
CPC分类号： H01L33/486 , H01L24/73 , H01L24/97 , H01L33/62 , H01L33/642 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/12041 , H01L2924/15787 , H01L2924/16195 , H01L2924/00014 , H01L2924/00 , H01L2224/85 , H01L2224/83 , H01L2924/00012
摘要： A lighting device including a metal substrate to prevent temperature rise of LED chip is offered. The lighting device includes the metal substrate, an anode or cathode electrode of the LED chip disposed on the metal substrate, brazing materials connecting the LED chip and the metal substrate, and a groove formed in the anode or cathode electrode. Forming the groove can prevent an occurrence of a crack in the brazing materials.Also, a lighting device includes the metal substrate, an anode and cathode electrode of the LED chip disposed on the metal substrate and brazing materials connecting the LED chip and the metal substrate. Further, a slit is formed in the metal substrate between the anode and cathode electrode. Forming the slit in the metal substrate can prevent an occurrence of a crack in the brazing materials.
摘要翻译： 提供了一种包括防止LED芯片升温的金属基板的照明装置。 照明装置包括金属基板，设置在金属基板上的LED芯片的阳极或阴极电极，连接LED芯片和金属基板的钎焊材料以及形成在阳极或阴极电极中的槽。 形成凹槽可以防止钎焊材料中出现裂纹。 此外，照明装置包括金属基板，设置在金属基板上的LED芯片的阳极和阴极电极以及连接LED芯片和金属基板的钎焊材料。 此外，在阳极和阴极之间的金属基板中形成狭缝。 在金属基材中形成狭缝可以防止钎焊材料中出现裂缝。
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公开(公告)号：US07936569B2
公开(公告)日：2011-05-03
申请号：US11307283
申请日：2006-01-30
IPC分类号： H05K7/00
CPC分类号： H05K3/341 , H01L24/83 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83 , H01L2924/01322 , H01L2924/01327 , H01L2924/14 , H01L2924/15787 , H01L2924/19105 , H01L2924/30107 , H05K3/243 , H05K3/244 , H05K3/284 , H05K3/3463 , H05K2201/0391 , H05K2201/10969 , Y02P70/613 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要： In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.
摘要翻译： 在作为本发明的电路装置的混合集成电路装置中，在基板的表面上形成包括焊盘的导电图案。 由于在其上安装散热器，所以形成第一焊盘相对较大。 第二焊盘是固定芯片部件或小信号晶体管的小焊盘。 在本发明中，在第一焊盘的表面上形成由镍制成的镀膜。 因此，第一焊盘和焊料不会彼此接触。 因此，不会产生焊接性差的Cu / Sn合金层，而是产生焊接性优异的Ni / Sn合金层。 因此，抑制熔融焊料中的沉陷的发生。
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66.发明申请METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING PLURAL SEMICONDUCTOR CHIPS 有权制造半导体器件的方法，包括多个半导体器件公开(公告)号：US20100255639A1
公开(公告)日：2010-10-07
申请号：US12817832
申请日：2010-06-17
申请人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Noriaki Sakamoto
发明人： Fujio Ito , Hiromichi Suzuki , Akihiko Kameoka , Noriaki Sakamoto
CPC分类号： H01L24/85 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/06153 , H01L2224/32245 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/49051 , H01L2224/4912 , H01L2224/49171 , H01L2224/49175 , H01L2224/4943 , H01L2224/73265 , H01L2224/78743 , H01L2224/85148 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01055 , H01L2924/01079 , H01L2924/01082 , H01L2924/10162 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , H01L2924/19043 , H01L2924/3011 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a second chip over a second area of the chip mounting section, wherein the second area is adjacent to the first area via the slit. The chip mounting section is disposed on a flat heating jig. First pads of the first chip are connected with second pads of the second chip via first wires, respectively, and the first pads are connected with leads of the lead frame via second wires, respectively, the first chip, the second chip, the first wires and the second wires are sealed with a resin such that a part of each of the leads is exposed from the resin, and each of the leads is then separated from the lead frame.
摘要翻译： 一种制造半导体器件的方法，包括将第一芯片安装在引线框架的芯片安装部分的第一区域上，并将第二芯片安装在芯片安装部分的第二区域上，其中第二区域与第一区域相邻 通过狭缝。 芯片安装部分设置在平坦的加热夹具上。 第一芯片的第一焊盘分别经由第一引线与第二芯片的第二焊盘连接，并且第一焊盘分别经由第二焊丝与引线框架的引线连接，第一芯片，第二芯片，第一焊丝 并且第二导线用树脂密封，使得每个引线的一部分从树脂露出，并且每个引线然后与引线框架分离。
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公开(公告)号：US20090129038A1
公开(公告)日：2009-05-21
申请号：US12065001
申请日：2006-08-30
CPC分类号： H01L23/49861 , H01L23/3672 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L25/16 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H05K1/0203 , H05K1/056 , H05K3/284 , H05K2201/1034 , H05K2201/1053 , H05K2201/10969 , Y10T29/49139 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： Provided is a simplified structure of a circuit device in which a power element generating a large amount of heat is incorporated. The circuit device according to the present invention includes: a circuit board whose surface is covered with an insulating layer; a conductive pattern formed on the surface of the insulating layer; a circuit element electrically connected to the conductive pattern; and a lead connected to a pad formed of the conductive pattern. Furthermore, a power element is fixed to the top surface of a land portion formed of a part of the lead. Accordingly, the land portion serves as a heat sink, thereby contributing to heat dissipation.
摘要翻译： 提供了其中并入产生大量热量的功率元件的电路装置的简化结构。 根据本发明的电路装置包括：表面被绝缘层覆盖的电路板; 形成在所述绝缘层的表面上的导电图案; 电连接到所述导电图案的电路元件; 以及连接到由导电图案形成的焊盘的引线。 此外，功率元件固定到由引线的一部分形成的接地部的顶表面。 因此，陆部用作散热器，从而有助于散热。
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公开(公告)号：US07443043B2
公开(公告)日：2008-10-28
申请号：US10733724
申请日：2003-12-11
申请人： Noriaki Sakamoto
发明人： Noriaki Sakamoto
IPC分类号： H01L21/44
CPC分类号： H01L24/97 , H01L23/3107 , H01L23/49548 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01078 , H01L2924/01082 , H01L2924/12042 , H01L2924/13055 , H01L2924/181 , H01L2924/19043 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599
摘要： A circuit device 10 comprises a die pad 11, bonding pads 12, a circuit element 9, affixed onto die pad 11, and an insulating resin 14, which seals die pad 11, bonding pads 12, and circuit element 9, and has a configuration wherein recessed parts 15 are formed at parts of the side surfaces of insulating resin 14, and side surface of the conductive patterns that are disposed at peripheral parts are exposed from recessed parts 15. By bonding pads 12, which are to become connecting electrodes to the exterior, being exposed at the side surfaces, fillets of a brazing material 19 are formed at the sides of the device when circuit device 10 is mounted.
摘要翻译： 电路装置10包括贴片11，接合焊盘12，固定在芯片焊盘11上的电路元件9和密封管芯焊盘11，焊盘12和电路元件9的绝缘树脂14，并且具有 其中凹部15形成在绝缘树脂14的侧表面的部分处，并且设置在周边部分的导电图案的侧表面从凹部15露出。 通过将要成为外部的连接电极的焊盘12暴露在侧表面处，当安装电路装置10时，在装置的侧面形成钎焊材料19的圆角。
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公开(公告)号：US20070254231A1
公开(公告)日：2007-11-01
申请号：US11740021
申请日：2007-04-25
申请人： Noriaki Sakamoto , Yasuko Nakagawa
发明人： Noriaki Sakamoto , Yasuko Nakagawa
IPC分类号： G03G9/08
CPC分类号： G03G9/0806 , G03G9/08708 , G03G9/08711 , G03G9/08728 , G03G9/08733 , G03G9/08793 , G03G9/08795 , G03G9/08797
摘要： A toner for electrophotography, wherein the toner is prepared by a suspension polymerization or emulsion polymerization from a monomer composition comprising a monovinyl monomer and a coloring agent, and a filtration velocity of the toner is in the range of 0.1 to 3.0 mL/min. The filtration velocity is obtained by an evaluation method comprising following evaluation steps: (i) 15 mg of a toner is added to 5 mL of THF, and soluble component in the toner is dissolved in THF completely to prepare a sample liquid; and (ii) the sample liquid is filtrated at the temperature of 25° C. and pressure of 0.15 kgf/cm2 is applied using a filter wherein an area thereof is 4.0 cm2 and a pore size thereof is 0.45 μm to measure a filtration time wherein 1 mL of the sample liquid is passed through the filter, and a filtration velocity is determined using the filtration time by a following formula, Filtration velocity (mL/min)=1 (mL)/filtration time (min).
摘要翻译： 一种用于电子照相的调色剂，其中调色剂是由包含单乙烯基单体和着色剂的单体组合物的悬浮聚合或乳液聚合制备的，调色剂的过滤速度在0.1至3.0mL / min的范围内。 通过包括以下评价步骤的评价方法获得过滤速度：（i）将15mg调色剂加入到5mL THF中，并将调色剂中的可溶成分完全溶解在THF中以制备样品液; 和（ii）样品液体在25℃的温度下过滤，并使用其面积为4.0cm 2的过滤器施加0.15kgf / cm 2的压力， SUP>，其孔径为0.45μm，以测量其中1mL样品液体通过过滤器的过滤时间，并且使用过滤时间通过下式确定过滤速度，<β在线式 过滤速度（mL / min）= 1（mL）/过滤时间（min）。<？in-line-formula description =“In-line Formulas”end =“尾巴”？>
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公开(公告)号：US20070205017A1
公开(公告)日：2007-09-06
申请号：US11307283
申请日：2006-01-30
CPC分类号： H05K3/341 , H01L24/83 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83 , H01L2924/01322 , H01L2924/01327 , H01L2924/14 , H01L2924/15787 , H01L2924/19105 , H01L2924/30107 , H05K3/243 , H05K3/244 , H05K3/284 , H05K3/3463 , H05K2201/0391 , H05K2201/10969 , Y02P70/613 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要： In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.
摘要翻译： 在作为本发明的电路装置的混合集成电路装置中，在基板的表面上形成包括焊盘的导电图案。 由于在其上安装散热器，所以形成第一焊盘相对较大。 第二焊盘是固定芯片部件或小信号晶体管的小焊盘。 在本发明中，在第一焊盘的表面上形成由镍制成的镀膜。 因此，第一焊盘和焊料不会彼此接触。 因此，不会产生焊接性差的Cu / Sn合金层，而是产生焊接性优异的Ni / Sn合金层。 因此，抑制熔融焊料中的沉陷的发生。
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