公开(公告)号：US20230317502A1

公开(公告)日：2023-10-05

申请号：US17711762

申请日：2022-04-01

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chun Hung TSAI ,  Chenghan SHE ,  Kuo-Chih HUANG ,  Kuan-Lin YEH

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6838 ,  H01L21/67144 ,  H01L24/14

摘要： A method for manufacturing an electronic package and a suction device are provided. The method includes: providing an electronic component having a first surface and including at least one conductive stud on the first surface; providing a suction device having at least one recess; and moving the electronic component with the suction device, wherein an edge of the at least one recess does not overlap the at least one conductive stud from a top view while moving the electronic component with the suction device.

公开(公告)号：US11776863B2

公开(公告)日：2023-10-03

申请号：US17404912

申请日：2021-08-17

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Hao-Chih Hsieh ,  Tun-Ching Pi ,  Sung-Hung Chiang ,  Yu-Chang Chen

IPC分类号： H01L23/13 ,  H01L23/14 ,  H01L23/498 ,  H01L23/40

CPC分类号： H01L23/13 ,  H01L23/147 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2023/4087

摘要： A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.

公开(公告)号：US11774673B2

公开(公告)日：2023-10-03

申请号：US17719277

申请日：2022-04-12

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Cheng-Hsuan Wu ,  Yung-Hui Wang

IPC分类号： G02B6/12 ,  G02B6/42

CPC分类号： G02B6/12 ,  G02B6/4204 ,  G02B2006/12061

摘要： An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.

公开(公告)号：US20230307380A1

公开(公告)日：2023-09-28

申请号：US17705216

申请日：2022-03-25

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Cheng-Nan LIN ,  Ming-Chiang LEE ,  Yung-I YEH

IPC分类号： H01L23/00 ,  H01L25/18 ,  H01L23/538

CPC分类号： H01L23/562 ,  H01L25/18 ,  H01L23/5385 ,  H01L24/48 ,  H01L2224/48145

摘要： A semiconductor device package is disclosed. The semiconductor device package includes a carrier, a first electronic component disposed on the carrier and a support component disposed on the carrier. The semiconductor device package also includes a second electronic component disposed on the first electronic component and supported by the support component.

公开(公告)号：US20230299462A1

公开(公告)日：2023-09-21

申请号：US18203632

申请日：2023-05-30

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Han-Chee YEN

IPC分类号： H01Q1/22 ,  H01L23/66 ,  H01L25/16 ,  H01L23/31 ,  H01L23/00 ,  H01Q9/04

CPC分类号： H01Q1/2283 ,  H01L23/66 ,  H01L25/16 ,  H01L23/3128 ,  H01L24/97 ,  H01Q9/0407 ,  H01L2223/6677 ,  H01L2924/15787 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L21/561

摘要： A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device.

公开(公告)号：US11764137B2

公开(公告)日：2023-09-19

申请号：US17140926

申请日：2021-01-04

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Cheng Yuan Chen

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49838 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/10446 ,  H05K2201/10522

摘要： A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

公开(公告)号：US11756896B2

公开(公告)日：2023-09-12

申请号：US17111347

申请日：2020-12-03

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Cheng-Yuan Kung ,  Meng-Wei Hsieh

IPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/538 ,  H01L23/00

CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/5389 ,  H01L24/32 ,  H01L2224/32227

摘要： A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes an electronic component, a conductive contact, and a first shielding layer. The electronic component has a first surface, a lateral surface angled with the first surface, and a second surface opposite to the first surface. The conductive contact is connected to the first surface of the electronic component. The first shielding layer is disposed on the lateral surface of the electronic component and a portion of the first surface of the electronic component. The first shielding layer contacts the conductive contact.

公开(公告)号：US20230274998A1

公开(公告)日：2023-08-31

申请号：US17681695

申请日：2022-02-25

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Po-Chih PAN ,  Hung-Chun KUO

IPC分类号： H01L23/367 ,  H01L23/538 ,  H01L25/065 ,  H01L25/18 ,  H01L23/495

CPC分类号： H01L23/367 ,  H01L23/5384 ,  H01L25/0657 ,  H01L25/18 ,  H01L23/49575 ,  H01L23/49568

摘要： An electronic device is disclosed. The electronic device includes an active component, a power regulating component disposed on the active component, and a patterned conductive element disposed between the active component and the power regulating component. The patterned conductive element is configured to provide one or more heat dissipation paths for the active component and to provide a power path between the active component and the power regulating component.

公开(公告)号：US20230268314A1

公开(公告)日：2023-08-24

申请号：US17676094

申请日：2022-02-18

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Shan-Bo WANG ,  Chin-Li KAO ,  An-Hsuan HSU

IPC分类号： H01L23/00 ,  H01L25/10

CPC分类号： H01L24/81 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/105 ,  H01L23/49816 ,  H01L2224/11849 ,  H01L2224/14505 ,  H01L2224/17505 ,  H01L2224/81097 ,  H01L2224/81211 ,  H01L2224/81815 ,  H01L2224/81825 ,  H01L2224/81935 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058

摘要： A semiconductor device package and a fabrication method thereof are disclosed. The semiconductor package comprises: a package component having a first mounting surface and a second mounting surface; and a first electronic component having a first conductive pad signal communicatively mounted on the first mounting surface through a first type connector; wherein the first type connector comprises a first solder composition having a lower melting point layer sandwiched between a pair of higher melting point layers, wherein the lower melting point layer is composed of alloys capable of forming a room temperature eutectic.

公开(公告)号：US20230268293A1

公开(公告)日：2023-08-24

申请号：US17676093

申请日：2022-02-18

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Pao-Nan LEE ,  Chen-Chao WANG ,  Chang Chi LEE

IPC分类号： H01L23/64 ,  H01L25/065

CPC分类号： H01L23/645 ,  H01L25/0657 ,  H01L25/0652

摘要： An electronic device is disclosed. The electronic device includes a first electronic component and a power regulating structure configured to provide a first power to the first electronic component. The power regulating structure includes a first component and a second component at least partially overlapped with the first component from a top view.