公开(公告)号：US20110033887A1

公开(公告)日：2011-02-10

申请号：US12679497

申请日：2008-09-24

Applicant: Nicholas X. Fang ,  Chunguang Xia ,  Andrew Cox

Inventor： Nicholas X. Fang ,  Chunguang Xia ,  Andrew Cox

IPC: C12M3/00 ,  G03F7/20 ,  C12P1/00 ,  G01D18/00

CPC classification number: C12M23/16 ,  B01L3/502707 ,  B33Y10/00 ,  B81B2201/058 ,  B81B2201/06 ,  B81C1/00119 ,  B81C99/0095

Abstract: In an aspect, the present invention uses projection micro stereolithography to generate three-dimensional microvessel networks that are capable of supporting and fostering growth of a cell population. For example, provided is a method of making a microvascularized bioreactor via layer-by-layer polymerization of a photocurable liquid composition with repeated patterns of illumination, wherein each layer corresponds to a layer of the desired microvessel network. The plurality of layers are assembled to make a microvascular network. Support structures having different etch rates than the structures that make up the network provides access to manufacturing arbitrary geometries that cannot be made by conventional methods. A cell population is introduced to the external wall of the network to obtain a microvascularized bioreactor. Provided are various methods and related bioreactors, wherein the network wall has a permeability to a biological material that varies within and along the network.

Abstract translation: 在一方面，本发明使用投影微立体光刻术来产生能够支持和促进细胞群体生长的三维微血管网络。 例如，提供了通过具有重复照明模式的光固化液体组合物的逐层聚合制备微血管化生物反应器的方法，其中每层对应于所需微血管网络的层。 组合多个层以形成微血管网络。 具有与组成网络的结构不同的蚀刻速率的支撑结构提供了对通过常规方法不能制造的任意几何形状的访问。 将细胞群引入网络的外壁以获得微血管生物反应器。 提供了各种方法和相关的生物反应器，其中网络壁具有在网络内和沿网络变化的生物材料的渗透性。

公开(公告)号：US20110030874A1

公开(公告)日：2011-02-10

申请号：US12745131

申请日：2007-11-28

Applicant: Leng Kin Lao

Inventor： Leng Kin Lao

IPC: B29C65/14

CPC classification number: C09J5/02 ,  B01L3/502707 ,  B01L2300/0816 ,  B01L2300/0887 ,  B29C65/1406 ,  B29C65/4845 ,  B29C65/5057 ,  B29C66/543 ,  B29C66/71 ,  B29C66/723 ,  B29C66/72325 ,  B29C66/72326 ,  B29C66/7375 ,  B29C66/73756 ,  B29C66/73921 ,  B29C66/73941 ,  B29C66/91411 ,  B29C66/91443 ,  B29C66/91445 ,  B29C66/919 ,  B29C66/91951 ,  B29C2035/0827 ,  B29K2063/00 ,  B29K2105/243 ,  B29K2105/246 ,  B29K2995/0008 ,  B29K2995/0018 ,  B29K2995/0035 ,  B29K2995/0056 ,  B29K2995/0092 ,  B29L2031/756 ,  B81B2201/06 ,  B81C3/001 ,  B81C2203/038 ,  C09J5/06 ,  C09J2205/31 ,  C09J2400/228 ,  C09J2463/003 ,  H01L21/187 ,  B29K2033/12 ,  B29K2067/003 ,  B29K2069/00

Abstract: A method of bonding at least two substrates, each substrate having at least one surface that includes a layer of SU8, said method comprising soft baking at least a portion of the layer of SU8 of the first and second substrates, exposing at least the portion of the layer of SU8 of the first and second substrates to ultraviolet (UV) radiation to cross-link at least the portion of the layer of SU8 of the second substrate to a suitable degree, post exposure baking at least the portion of the layer of SU8 of the first substrate at a temperature greater than or equal to 20 degree Celsius (° C.) and less than or equal to 50 degree Celsius (° C.) to cross-link at least the portion of the layer of SU8 of the first substrate to a suitable degree. The method also includes compressing the portion of the cross-linked layer of SU8 of the first substrate against the portion of the cross-linked layer of SU8 of the second substrate at a suitable starting temperature (Ts) for a suitable time period (tcomp). In addition, the method also includes elevating the temperature during compression from Ts to a suitable elevated temperature (Te), thereby bonding the first and second substrates.

Abstract translation: 一种键合至少两个基板的方法，每个基板具有包括一层SU8的至少一个表面，所述方法包括软化第一和第二基板的SU8层的至少一部分， 第一和第二基板的SU8层至紫外（UV）辐射，以至少将第二基板的SU8层的部分交叉连接到适当的程度，曝光后至少烧制SU8层的部分 在大于或等于20摄氏度（℃）和小于或等于50摄氏度（℃）的温度下的第一衬底的至少一部分交联至第一衬底的第一衬底的至少一部分 底物达到适当的程度。 该方法还包括在合适的起始温度（Ts）下将第一衬底的SU8的交联层的部分压靠第二衬底的SU8的交联层的部分适合的时间段（tcomp） 。 此外，该方法还包括将压缩期间的温度从Ts升高到合适的高温（Te），从而粘合第一和第二基板。

公开(公告)号：US20080299695A1

公开(公告)日：2008-12-04

申请号：US12045853

申请日：2008-03-11

Applicant: Luc Ouellet ,  Patrick Wright

Inventor： Luc Ouellet ,  Patrick Wright

IPC: H01L21/00

CPC classification number: B81C1/00071 ,  B81B2201/06 ,  B81C2201/0191

Abstract: A method is disclosed for making a MEMS device wherein anhydrous HF exposed silicon nitride is used as a temporary adhesion layer allowing the transfer of a layer from a Carrier Wafer to a Device Wafer.

Abstract translation: 公开了一种用于制造MEMS器件的方法，其中使用无水HF暴露的氮化硅作为允许将层从载体晶片转移到器件晶片的临时粘合层。

公开(公告)号：US20080095977A1

公开(公告)日：2008-04-24

申请号：US11773534

申请日：2007-07-05

Applicant: Joanna Aizenberg ,  Thomas Krupenkin ,  Oleksandr Sydorenko ,  Joseph Taylor

Inventor： Joanna Aizenberg ,  Thomas Krupenkin ,  Oleksandr Sydorenko ,  Joseph Taylor

IPC: B32B7/00 ,  B32B37/12 ,  B29C53/02

CPC classification number: B81B3/0032 ,  B01L3/502761 ,  B01L2300/0896 ,  B81B2201/047 ,  B81B2201/058 ,  B81B2201/06 ,  B81B2203/0361 ,  B81B2203/058 ,  B82Y30/00 ,  G02B5/1828 ,  Y10S310/80 ,  Y10T156/10 ,  Y10T428/24182 ,  Y10T428/24479

Abstract: Provided is an apparatus. In one embodiment, this apparatus includes a substrate having a surface, and a plurality of nanostructures each having a first end and a second end, wherein the first end of each of the plurality of nanostructures is attached to the surface. At least a portion of the second ends of the plurality of nanostructures, in this embodiment, are bent toward one another to form two or more similarly configured clumps each including two or more nanostructures.

Abstract translation: 提供了一种装置。 在一个实施例中，该装置包括具有表面的基板和多个纳米结构，每个纳米结构具有第一端和第二端，其中多个纳米结构中的每一个的第一端附接到该表面。 在该实施例中，多个纳米结构的第二端的至少一部分彼此弯曲以形成两个或更多个类似配置的团块，每个组合包括两个或多个纳米结构。

公开(公告)号：US20070117243A1

公开(公告)日：2007-05-24

申请号：US11286065

申请日：2005-11-22

Applicant: Manish Sharma

Inventor： Manish Sharma

IPC: H01L21/00 ,  H01L21/4763

CPC classification number: B81C1/00063 ,  B81B2201/06 ,  B81C2201/0133 ,  B81C2201/0153

Abstract: The present invention provides a method of fabricating a biosensor. The method includes providing a substrate which has a surface coating. The surface coating is deformable and the substrate includes a layered structure which has at least two electrically conductive layers separated by at least one electrically insulating layer. The method also includes imprinting a structure into the surface coating. Further, the method includes etching at least a region of the imprinted structure and the substrate to remove at least a portion of the structure and the substrate. The structure is shaped so that the etching forms at least a portion of the biosensor in the substrate and exposes at least a portion of each electrically conductive layer to form electrodes of the biosensor.

Abstract translation: 本发明提供一种制造生物传感器的方法。 该方法包括提供具有表面涂层的基底。 表面涂层是可变形的，并且衬底包括具有由至少一个电绝缘层分开的至少两个导电层的分层结构。 该方法还包括将结构压印到表面涂层中。 此外，所述方法包括蚀刻所述压印结构的至少一个区域和所述基板以去除所述结构和所述基板的至少一部分。 该结构被成形为使得蚀刻形成衬底中的生物传感器的至少一部分并且暴露出每个导电层的至少一部分以形成生物传感器的电极。

公开(公告)号：US07215429B2

公开(公告)日：2007-05-08

申请号：US11065017

申请日：2005-02-24

Applicant: Huikai Xie

Inventor： Huikai Xie

IPC: G01B9/02

CPC classification number: G02B26/0866 ,  B81B3/0018 ,  B81B2201/038 ,  B81B2201/06 ,  G02B6/3512 ,  G02B6/3526 ,  G02B6/3534 ,  G02B6/3584

Abstract: A MEMS vertical displacement device capable of moving one or more vertically displaceable platforms relative to a base. In particular, the vertical displacement device may be capable of moving a vertically displaceable platform so that the vertically displaceable platform remains generally parallel to a base. The vertically displaceable platform may be, but is not limited to, a microlens, a micromirror, micro-grating, or other device. The vertical displacement device may also be included in optical coherence and confocal imaging systems.

Abstract translation: 能够相对于基座移动一个或多个可垂直移位的平台的MEMS垂直位移装置。 特别地，垂直位移装置可以能够移动可垂直移动的平台，使得垂直移位的平台保持大致平行于基部。 可垂直移位的平台可以是但不限于微透镜，微镜，微光栅或其他器件。 垂直位移装置也可以包括在光学相干和共焦成像系统中。

公开(公告)号：US20050253206A1

公开(公告)日：2005-11-17

申请号：US10524560

申请日：2003-08-25

Applicant: Christophe Bureau ,  Christophe Kergueris ,  Francois Perruchot

Inventor： Christophe Bureau ,  Christophe Kergueris ,  Francois Perruchot

IPC: A61B5/00 ,  B81B3/00 ,  G01L9/00 ,  H01L27/14

CPC classification number: G01L9/0042 ,  A61B5/00 ,  B29C2043/5825 ,  B81B3/0094 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/06 ,  B81B2203/0127 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/181 ,  Y10S977/733 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electromechanical microstructure including a first mechanical part formed in a first electrically conductive material, and which includes a zone deformable in an elastic manner having a thickness value and an exposed surface, and a first organic film having a thickness, present on all of the exposed surface of the deformable zone. The thickness of the first film is such that the elastic response of the deformable zone equipped with the first film does not change by more than 5% compared to the response of the bare deformable zone, or the thickness of the first film is less than ten times the thickness of the deformable zone.

Abstract translation: 一种机电微结构，包括形成在第一导电材料中的第一机械部件，并且包括具有厚度值和暴露表面的弹性变形区域和具有厚度的第一有机膜，存在于所有暴露的 可变形区域的表面。 第一膜的厚度使得配备有第一膜的可变形区域的弹性响应与裸露可变形区域的响应相比不变化多于5％，或者第一膜的厚度小于十 倍的可变形区域的厚度。

公开(公告)号：US06953977B2

公开(公告)日：2005-10-11

申请号：US10284048

申请日：2002-10-29

Applicant: Richard Mlcak ,  Dharanipal Doppalapudi ,  Harry L. Tuller

Inventor： Richard Mlcak ,  Dharanipal Doppalapudi ,  Harry L. Tuller

IPC: B81B3/00 ,  H01L41/09 ,  H01L41/22 ,  H01L27/14

CPC classification number: B81B3/0089 ,  B81B3/0094 ,  B81B2201/06 ,  B81B2203/0127 ,  H01L41/094 ,  H01L41/18 ,  H01L41/316 ,  H01L41/331 ,  H01L41/332

Abstract: A micromechanical device includes a single crystal micromachined micromechanical structure. At least a portion of the micromechanical structure is capable of performing a mechanical motion. A piezoelectric epitaxial layer covers at least a part of said portion of the micromechanical structure that is capable of performing a mechanical motion. The micromechanical structure and piezoelectric epitaxial layer are composed of different materials. At least one electrically conducting layer is formed to cover at least part of the piezoelectric epitaxial layer.

Abstract translation: 微机械装置包括单晶微加工微机械结构。 微机械结构的至少一部分能够进行机械运动。 压电外延层覆盖能够执行机械运动的微机械结构的所述部分的至少一部分。 微机械结构和压电外延层由不同的材料组成。 形成至少一个导电层以覆盖至少部分压电外延层。

公开(公告)号：US20040218877A1

公开(公告)日：2004-11-04

申请号：US10835344

申请日：2004-04-29

Inventor： Huikai Xie

IPC: G02B006/36 ,  G06F009/40

CPC classification number: G02B26/0866 ,  B81B3/0018 ,  B81B2201/038 ,  B81B2201/06 ,  G02B6/3512 ,  G02B6/3526 ,  G02B6/3534 ,  G02B6/3584

Abstract: A MEMS vertical displacement device capable of moving one or more vertically displaceable platforms relative to a base. In particular, the vertical displacement device may be capable of moving a vertically displaceable platform so that the vertically displaceable platform remains generally parallel to a base. The vertically displaceable platform may be, but is not limited to, a microlens, a micromirror, micro-grating, or other device. The vertical displacement device may also be included in optical coherence and confocal imaging systems.

Abstract translation: 能够相对于基座移动一个或多个可垂直移位的平台的MEMS垂直位移装置。 特别地，垂直位移装置可以能够移动可垂直移动的平台，使得垂直移位的平台保持大致平行于基部。 可垂直移位的平台可以是但不限于微透镜，微镜，微光栅或其他器件。 垂直位移装置也可以包括在光学相干和共焦成像系统中。

公开(公告)号：US11970391B2

公开(公告)日：2024-04-30

申请号：US17618198

申请日：2019-12-13

Applicant: Shenzhen Institutes of Advanced Technology

Inventor： Tianzhun Wu ,  Zhaoling Huang ,  Qi Zeng

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00166 ,  B81B3/0072 ,  B81B2201/06 ,  B81B2203/0172 ,  B81B2203/04 ,  B81C2201/0114 ,  B81C2201/0185 ,  B81C2201/0187 ,  B81C2201/0194

Abstract: A method for preparing a flexible electrode is provided. The method comprises sequentially forming a flexible base layer and an intermediate conductive layer on a carrier plate; treating an elastomeric template having an electrode pattern with an acid, followed by transferring and printing the electrode pattern onto the intermediate conductive layer to form an electrode inducing layer; forming a titanium dioxide-polydopamine composite layer in a gap of the electrode inducing layer; forming a platinum electrode layer on the titanium dioxide-polydopamine composite layer; removing the carrier plate. The invention solves the problems of slow formation of a polydopamine film and slow formation of a platinum electrode layer. A flexible electrode is further provided.