公开(公告)号：US5384181B1

公开(公告)日：2000-06-13

申请号：US13187093

申请日：1993-10-05

Applicant: WORLD PROPERTIES INC

Inventor： ARTHUR DAVID J ,  SWEI GWO S ,  HORN ALLEN F III ,  KILHENNY BRETT

IPC: C08K9/06 ,  H01B3/44 ,  H01L23/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  H05K3/46 ,  B32B9/00

CPC classification number: H05K1/0373 ,  C08K9/06 ,  H01B3/445 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/389 ,  H05K3/4626 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2995 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31663 ,  Y10T428/31692 ,  C08L27/12 ,  H01L2924/00

公开(公告)号：US5965245A

公开(公告)日：1999-10-12

申请号：US712509

申请日：1996-09-13

Applicant: Norio Okano ,  Kazuhito Kobayashi ,  Akishi Nakaso

Inventor： Norio Okano ,  Kazuhito Kobayashi ,  Akishi Nakaso

IPC: C08J5/24 ,  C08K7/02 ,  C09D5/25 ,  H05K1/03 ,  B32B9/00

CPC classification number: C08K7/02 ,  C08J5/24 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/0278 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249995 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/269 ,  Y10T428/2949 ,  Y10T428/31529

Abstract: A prepreg comprising a semi-cured thermosetting resin and electrically insulating whiskers or short fibers dispersed in said semi-cured thermosetting resin, and if necessary, a carrier film attached or bound to said prepreg is suitable for producing multilayer printed circuit boards of reduced thinness, high wiring density and high connection reliability with high productivity and low production cost.

Abstract translation: 一种预浸料，其包含半固化的热固性树脂和分散在所述半固化的热固性树脂中的电绝缘的晶须或短纤维，并且如果需要，附着或结合到所述预浸料的载体膜适用于制备薄的减薄的多层印刷电路板， 高布线密度和高连接可靠性，生产效率高，生产成本低。

公开(公告)号：US5209819A

公开(公告)日：1993-05-11

申请号：US547237

申请日：1990-07-03

Applicant: Yoshiharu Suzuki ,  Tomoyuki Aketa

Inventor： Yoshiharu Suzuki ,  Tomoyuki Aketa

IPC: C23C14/20 ,  C23C14/02 ,  H05K1/03 ,  H05K3/02 ,  H05K3/10 ,  H05K3/14 ,  H05K3/38

CPC classification number: H05K3/14 ,  H05K1/0373 ,  H05K3/02 ,  H05K3/381 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K2203/095 ,  H05K3/108 ,  H05K3/388

Abstract: A molding capable of forming a precision fine-line circuit by the substractive method is produced by an improvement that a molding prepared by molding a liquid-crystal polyester resin composition comprising a melt-processable polyester (liquid-crystal polyester) capable of forming an anisotropic molten phase and an inorganic filler added thereto is etched and then treated to form a metallic coating on the surface thereof by sputtering, ion plating or vacuum deposition.

公开(公告)号：US4997702A

公开(公告)日：1991-03-05

申请号：US475454

申请日：1990-02-06

Applicant: Samuel Gazit ,  Gary W. Adams

Inventor： Samuel Gazit ,  Gary W. Adams

IPC: B32B27/20 ,  H05K1/00 ,  H05K1/03

CPC classification number: H05K1/0373 ,  B32B27/20 ,  H05K1/0366 ,  H05K1/0393 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/057 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/2713

Abstract: A printed circuit board composed of an epoxy impregnated nonwoven web substrate laminated to electrically conductive sheets is presented. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems. The printed circuit board also has improved thermal properties achieved through the addition of up to 70% by weight of low coefficient of thermal expansion (CTE) particulate fillers and/or the use of thermally stable reinforcement fibers in the non-woven web.

Abstract translation: 提出了一种印刷电路板，其由层压在导电片上的环氧树脂浸渍非织造网基材组成。 印刷电路板的灵活性在于它可以弯曲成任何所需的多平面形状，并且在电气互连系统所要求的安装之后将保持该形状。 印刷电路板还具有通过添加高达70重量％的低热膨胀系数（CTE）颗粒填料和/或在无纺布网中使用热稳定的增强纤维而获得的改进的热性能。

公开(公告)号：US4894271A

公开(公告)日：1990-01-16

申请号：US190986

申请日：1988-05-06

Applicant: Kiyoshi Hani ,  Mutsuko Hayama ,  Yoshio Nishimoto ,  Hiroshi Hishiki ,  Minoru Kimura ,  Tatsushi Nakai

Inventor： Kiyoshi Hani ,  Mutsuko Hayama ,  Yoshio Nishimoto ,  Hiroshi Hishiki ,  Minoru Kimura ,  Tatsushi Nakai

IPC: B32B15/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/42 ,  H05K3/44

CPC classification number: B32B15/14 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/0251 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K3/427 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24934 ,  Y10T428/31678

Abstract: Method of printed circuit board manufacture, and resulting board. A plurality of prepreg sheets composed of ceramic paper and containing different quantities of a resin are laid on each side of a core metal sheet having a through hole. A copper foil is laid on the prepreg sheets on each side of the core. All of the layers are pressed together under heat to make a metal-core printed wiring board. The prepreg sheets form an insulating layer having a high heat-dissipating capacity on each side of the core and a reliable insulator in its through hole. The ceramic paper consists essentially of short ceramic fibers having a diameter not exceeding fiber microns and a length of 5 to 500 microns, and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for the ceramic fibers.

Abstract translation: 印刷电路板制造方法和所得板。 在具有通孔的芯金属片的每一侧上放置多个由陶瓷纸构成并含有不同量树脂的预浸料片。 在芯的每一侧上的预浸片上放置铜箔。 所有的层在加热下压在一起以制成金属芯印刷线路板。 预浸片形成在芯的每一侧具有高散热能力的绝缘层和在其通孔中的可靠的绝缘体。 陶瓷纸基本上由直径不超过纤维微米并且长度为5至500微米的短陶瓷纤维组成，并且包含3至10重量％的作为陶瓷纤维的粘合剂的微纤化纤维素纤维。

公开(公告)号：US4883702A

公开(公告)日：1989-11-28

申请号：US198657

申请日：1988-05-23

Applicant: Masatoshi Sato ,  Kensuke Ogawara ,  Noriaki Emura

Inventor： Masatoshi Sato ,  Kensuke Ogawara ,  Noriaki Emura

IPC: C08L81/04 ,  C08K7/08 ,  C08K7/14 ,  C08L81/02 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08K7/08 ,  C08K7/14 ,  C08K2201/016 ,  H05K1/0228 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251 ,  Y10T428/24355 ,  Y10T428/31533

Abstract: A polyphenylene sulfide composition useful for plating is disclosed, comprising a polyphenylene sulfide resin, glass fibers, and potassium titanate fibers. Molded articles of this composition, when plated after etching, provide a plated article which is excellent in appearance and peel strength. Thus these plated articles can be used in outer applications, such as electric parts and automobile parts.

Abstract translation: 公开了一种可用于电镀的聚苯硫醚组合物，其包含聚苯硫醚树脂，玻璃纤维和钛酸钾纤维。 该组合物的成型体在蚀刻后进行电镀时，提供外观和剥离强度优异的电镀品。 因此，这些电镀制品可以用于外部应用中，例如电气部件和汽车部件。

公开(公告)号：US4784893A

公开(公告)日：1988-11-15

申请号：US14742

申请日：1987-02-13

Applicant: Yoshio Nishimoto ,  Kiyoshi Hani ,  Shohei Etoh

Inventor： Yoshio Nishimoto ,  Kiyoshi Hani ,  Shohei Etoh

IPC: B32B7/02 ,  H05K1/03 ,  H05K1/05 ,  B32B3/00 ,  D21D3/00

CPC classification number: H05K1/0366 ,  B32B7/02 ,  H05K1/0386 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0269 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24934 ,  Y10T428/31993 ,  Y10T442/616 ,  Y10T442/656

Abstract: A heat conductive circuit board includes an insulating layer provided on a metal substrate, and an electrically conductive metal foil formed on the insulating layer, and the insulating layer is formed by impregnating an alumina paper with organic polymer. The alumina paper is made by subjecting a material containing alumina fiber as the principal components to a paper-making process. The insulating layer has excellent properties of heat transfer not only in the thickness direction but also in the surface direction, and thus, the heat conductive circuit board is excellent in heat dissipation properties.

Abstract translation: 导热电路板包括设置在金属基板上的绝缘层和形成在绝缘层上的导电金属箔，并且通过用有机聚合物浸渍氧化铝纸形成绝缘层。 氧化铝纸通过将含有氧化铝纤维的材料作为主要成分进行制造。 绝缘层不仅在厚度方向上而且在表面方向上具有优异的热传递性，因此导热电路板的散热特性优异。

公开(公告)号：US4647508A

公开(公告)日：1987-03-03

申请号：US755067

申请日：1985-07-15

Applicant: Samuel Gazit ,  Thomas S. Kneeland

Inventor： Samuel Gazit ,  Thomas S. Kneeland

IPC: B32B15/08 ,  H05K1/00 ,  H05K1/03 ,  H05K3/38 ,  B32B27/08

CPC classification number: H05K3/386 ,  B32B15/08 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0251 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31649 ,  Y10T428/31699 ,  Y10T428/31721 ,  Y10T428/31928

Abstract: A flexible circuit laminate is presented comprising a microglass reinforce fluoropolymer layer sandwiched between a fluoropolymer coated polyimide and a copper conductive pattern. The glass reinforced fluoropolymer acts as a high bond strength adhesive between the fluoropolymer coated polyimide and copper conductive pattern. The glass reinforced fluoropolymer also contributes to improved dimensional stability as well as improved electrical performance. Preferably, the microglass content is between about 4 to about 30 weight percent, and more preferably about 20 weight percent glass.

Abstract translation: 提出了一种柔性电路层压板，其包括夹在含氟聚合物涂覆的聚酰亚胺和铜导电图案之间的微玻璃增强氟聚合物层。 玻璃增强的氟聚合物在含氟聚合物涂覆的聚酰亚胺和铜导电图案之间起到高粘合强度的粘合剂的作用。 玻璃增强的氟聚合物还有助于提高尺寸稳定性以及改善的电性能。 优选地，微玻璃含量在约4至约30重量％之间，更优选约20重量％的玻璃。

公开(公告)号：US4268337A

公开(公告)日：1981-05-19

申请号：US93095

申请日：1979-11-09

Applicant: Jyoji Ibata ,  Hisaaki Fukui ,  Takeo Yuasa ,  Michio Katoh

Inventor： Jyoji Ibata ,  Hisaaki Fukui ,  Takeo Yuasa ,  Michio Katoh

IPC: B32B15/08 ,  H05K1/03 ,  B29D7/02 ,  B29D7/20 ,  B32B31/20 ,  B32B31/28

CPC classification number: B32B15/08 ,  H05K1/036 ,  H05K2201/0209 ,  H05K2201/0251

Abstract: A sheet molding material comprising (1) an interlayer containing a photopolymerizable resin and a photocuring agent for the photopolymerizable resin, and (2) a surface layer of a thermosetting resin containing a heat curing agent for the thermosetting resin on both surfaces of the interlayer (1); and a process for the production of the sheet molding material.

Abstract translation: 一种片材成型材料，其包含（1）含有光聚合性树脂的中间层和光聚合性树脂的光固化剂，（2）在所述中间层的两面上含有热固性树脂用热固化剂的热固性树脂的表面层 1）; 以及用于生产片状模制材料的方法。

公开(公告)号：US09827590B2

公开(公告)日：2017-11-28

申请号：US14824839

申请日：2015-08-12

Applicant: International Business Machines Corporation

Inventor： Sarah K. Czaplewski ,  Joseph Kuczynski ,  Jason Wertz ,  Jing Zhang

IPC: C03C25/26 ,  C03C25/24 ,  C03C25/40 ,  C03B37/02 ,  C03C25/10 ,  B05D3/00 ,  D03D15/00 ,  D03D1/00 ,  C03C25/28 ,  H05K1/03 ,  C09C1/30 ,  C03B19/10

CPC classification number: B05D3/002 ,  B05D2203/35 ,  C01P2004/61 ,  C03B19/1065 ,  C03C25/1095 ,  C03C25/255 ,  C03C25/28 ,  C03C25/40 ,  C09C1/3072 ,  C09C1/3081 ,  C09C1/309 ,  D03D1/0082 ,  D03D15/0011 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/038 ,  H05K2201/0251 ,  H05K2201/029

Abstract: Embodiments generally relate to devices and methods for production of fibers and threads for use in electronic device manufacturing. Described here, fibers can be produced and manipulated using a dual-surfaced sizing material. The dual-surfaced sizing material has a surface which binds a fiber and a surface which binds a resin. Thus, the dual-surfaced sizing material can be left attached to the fibers without adversely affecting the resin binding in later production steps.