公开(公告)号：US20120235764A1

公开(公告)日：2012-09-20

申请号：US13365491

申请日：2012-02-03

Applicant: Sae Kyoung KANG ,  Joon Ki LEE ,  Joon Young HUH ,  Jyung Chan LEE

Inventor： Sae Kyoung KANG ,  Joon Ki LEE ,  Joon Young HUH ,  Jyung Chan LEE

IPC: H01P3/08 ,  H05K3/10 ,  H03H7/38

CPC classification number: H01P3/006 ,  H01P5/028 ,  H05K1/0219 ,  H05K1/0227 ,  H05K1/0253 ,  H05K1/147 ,  H05K2201/058 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/10121 ,  Y10T29/49155

Abstract: Disclosed is a structure for impedance matching by applying a CPW structure to an impedance discontinuous portion on a data signal line or using a micro-strip open stub so as to be used for high-speed transmission by a flexible PCB. According to the present invention, it is possible to fabricate a flexible PCB capable of performing low-priced and high-speed transmission.

Abstract translation: 公开了通过将CPW结构应用于数据信号线上的阻抗不连续部分或使用微带开路短截线来进行阻抗匹配的结构，以便用于通过柔性PCB的高速传输。 根据本发明，可以制造能够执行低价和高速传输的柔性PCB。

公开(公告)号：US20120061023A1

公开(公告)日：2012-03-15

申请号：US12878297

申请日：2010-09-09

Applicant: Philip R. Germann ,  Mark J. Jeanson

Inventor： Philip R. Germann ,  Mark J. Jeanson

IPC: B32B37/22 ,  B65H69/06

CPC classification number: B23K31/00 ,  B23K20/04 ,  B23K2103/16 ,  B32B37/0076 ,  B32B43/00 ,  B32B2457/08 ,  H05K3/328 ,  H05K3/368 ,  H05K3/4691 ,  H05K2201/058 ,  H05K2201/09109

Abstract: A method and apparatus are provided for implementing interleaved-dielectric joining of multi-layer laminates. First and second multi-layer laminates are provided, each having with a laminated portion and an unlaminated portion. The first and second multi-layer laminates are joined together at the unlaminated portions by interleaving a plurality of dielectric layers of the first and second multi-layer laminates. Respective conductors carried by adjacent dielectric layers are connected. The interleaved unlaminated portions are laminated together with heat and pressure, to create a larger laminate of the joined first and second multi-layer laminates.

Abstract translation: 提供了一种用于实现多层层压体的交错电介质接合的方法和装置。 提供第一和第二多层层叠体，每层具有层压部分和未层压部分。 第一和第二多层层叠体通过交织第一和第二多层层压体的多个介电层而在未层压部分连接在一起。 连接由相邻电介质层承载的各导线。 交织的未层压部分通过热和压力层压在一起，以形成接合的第一和第二多层层压体的较大层压体。

公开(公告)号：US08111519B2

公开(公告)日：2012-02-07

申请号：US13015725

申请日：2011-01-28

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H05K7/00

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/19107 ,  H05K1/142 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  H05K2201/09481 ,  Y10T29/417 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T428/24322 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer.

Abstract translation: 多层基板的混合结构包括第一多层基板和第二多层基板。 第一多层基板交替地堆叠第一金属层，第一介电层并具有VIA。 第一金属层的边界区域与相应的第一介电层的边界区域连接。 边界区域与相邻的第一金属层和相邻的第一介电层分离。 第二多层基板交替堆叠第二金属层和第二电介质层。 第二金属层的边界区域与相应的第二电介质层的边界区域连接。 边界区域与相邻的第二金属层和相邻的第二介电层分离。 VIA位于第一电介质层的边界区，并且每个VIA具有导电体，以将一个第一金属层与一个第二金属层连接。

公开(公告)号：US07738244B2

公开(公告)日：2010-06-15

申请号：US11898547

申请日：2007-09-13

Applicant: Satoshi Noguchi ,  Hiroyasu Maeta ,  Tomokatsu Kinugawa

Inventor： Satoshi Noguchi ,  Hiroyasu Maeta ,  Tomokatsu Kinugawa

IPC: H05K5/00 ,  H05K7/00

CPC classification number: H05K1/147 ,  G02F1/13452 ,  H05K1/0215 ,  H05K9/0054 ,  H05K9/0067 ,  H05K2201/058

Abstract: A display device of the invention includes a liquid crystal display panel 1, an FPC 5, a box-formed storing case 4, and an FPC 7. The liquid crystal display panel 1 is provided with an ITO film 18 on its front side. The FPC 5 is attached to the liquid crystal display panel 1, has at least a ground line 5a, and is connected to an external device 40. The storing case 4 includes at least a rear side case (metal case) 3 electrically connected to the ITO film 18, as well as stores the liquid crystal display panel 1. The FPC 7 electrically connects the ground lines 5a of the FPC 5 and the rear side case 3. With the above-mentioned configuration, a display device can be provided wherein static protection on the front side of the display panel is easily provided.

Abstract translation: 本发明的显示装置包括液晶显示面板1，FPC5，箱形储存盒4和FPC 7.液晶显示面板1在其前侧设置有ITO膜18。 FPC5安装在液晶显示面板1上，至少具有地线5a，并与外部装置40连接。存储箱4至少包括与电连接的液晶显示面板 ITO膜18，并且存储液晶显示面板1. FPC 7将FPC5的接地线5a与后侧壳体3电连接。通过上述结构，可以提供一种显示装置，其中静电 容易提供显示面板正面的保护。

公开(公告)号：US07637745B1

公开(公告)日：2009-12-29

申请号：US12344222

申请日：2008-12-25

Applicant: Lung Dai ,  Tao Wang

Inventor： Lung Dai ,  Tao Wang

IPC: H01R39/00

CPC classification number: H05K1/147 ,  H04M1/0216 ,  H05K1/148 ,  H05K5/0226 ,  H05K2201/058

Abstract: A communication system electrically connecting circuits in a hinged cover and base of an electronic device includes an arched first flat cable wrapping around and rotatable with respect to a hinge assembly, a straight second flat cable electrically connected to the first flat cable and disposed in the base, an arched third flat cable wrapping around the first flat cable electrically connected to and rotatable with respect to the first flat cable, and a straight fourth flat cable electrically connected to the third flat cable and disposed in the cover. Also provided is an electronic device including a base, a cover, a hinge assembly pivotally connecting the cover to the base, and the communication system.

Abstract translation: 将电子装置的铰接盖和基座中的电路电连接的通信系统包括围绕铰链组件环绕并可旋转的拱形第一扁平电缆，电连接到第一扁平电缆并设置在基座中的直的第二扁平电缆 围绕第一扁平电缆缠绕的弓形的第三扁平电缆，电连接到第一扁平电缆并且可相对于第一扁平电缆可旋转;以及直的第四扁平电缆，电连接到第三扁平电缆并且设置在盖中。 还提供了一种电子设备，其包括基座，盖，将盖枢转地连接到基座的铰链组件和通信系统。

公开(公告)号：US20090310287A1

公开(公告)日：2009-12-17

申请号：US12344222

申请日：2008-12-25

Applicant: LUNG DAI ,  TAO WANG

Inventor： LUNG DAI ,  TAO WANG

IPC: H05K7/00

CPC classification number: H05K1/147 ,  H04M1/0216 ,  H05K1/148 ,  H05K5/0226 ,  H05K2201/058

Abstract: A communication system electrically connecting circuits in a hinged cover and base of an electronic device includes an arched first flat cable wrapping around and rotatable with respect to a hinge assembly, a straight second flat cable electrically connected to the first flat cable and disposed in the base, an arched third flat cable wrapping around the first flat cable electrically connected to and rotatable with respect to the first flat cable, and a straight fourth flat cable electrically connected to the third flat cable and disposed in the cover. Also provided is an electronic device including a base, a cover, a hinge assembly pivotally connecting the cover to the base, and the communication system.

Abstract translation: 将电子装置的铰接盖和基座中的电路电连接的通信系统包括围绕铰链组件环绕并可旋转的拱形第一扁平电缆，电连接到第一扁平电缆并设置在基座中的直的第二扁平电缆 围绕第一扁平电缆缠绕的弓形的第三扁平电缆，电连接到第一扁平电缆并且可相对于第一扁平电缆可旋转;以及直的第四扁平电缆，电连接到第三扁平电缆并且设置在盖中。 还提供了一种电子设备，其包括基座，盖，将盖枢转地连接到基座的铰链组件和通信系统。

公开(公告)号：US20090080111A1

公开(公告)日：2009-03-26

申请号：US11902253

申请日：2007-09-20

Applicant: MingGao Yao ,  YiRu Xie

Inventor： MingGao Yao ,  YiRu Xie

IPC: G11B5/60

CPC classification number: G11B5/4853 ,  G11B5/483 ,  H05K3/328 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/10234

Abstract: The present bonded structure uses metal ball to bond or weld the respective bonding surfaces of electrical pads which are arranged to face the same direction. The structure can be controlled visually and thus enables a high connection quality of no short circuit. In addition, the bonding operation of the bonded structure is carried out without using pressure, thus it will not damage surroundings of the electrical components. Accordingly, the manufacture yield is significantly improved and the cost is prominently reduced. The present invention also discloses a bonding method and a head gimbal assembly and a head stack assembly and a drive unit using the bonded structure.

Abstract translation: 本发明的接合结构使用金属球来接合或焊接被设置为面向相同方向的电焊盘的各个接合表面。 该结构可以视觉控制，从而实现无短路的高连接质量。 此外，接合结构的接合操作在不使用压力的情况下进行，因此不会损坏电气部件的周围环境。 因此，制造成品率显着提高，成本显着降低。 本发明还公开了一种接合方法和头部万向节组件以及使用该结合结构的磁头组合组件和驱动单元。

公开(公告)号：US07497692B2

公开(公告)日：2009-03-03

申请号：US11820283

申请日：2007-06-19

Applicant: Tomishige Tai ,  Hiroshi Akimoto ,  Katsumi Arai ,  Takahiro Hidate ,  Mitsuo Koguchi

Inventor： Tomishige Tai ,  Hiroshi Akimoto ,  Katsumi Arai ,  Takahiro Hidate ,  Mitsuo Koguchi

IPC: H01R11/30 ,  H01R13/60

CPC classification number: H05K3/365 ,  H01R11/30 ,  H01R13/6205 ,  H05K2201/058 ,  H05K2201/083

Abstract: In a magnetic connector acquiring connection with a mating connector by magnetic force, a base member has a particular surface to be faced to the mating connector upon connection. An electrode terminal is fixed to the base member and adapted to be electrically connected to the mating connector. The base member has a magnetic force generating portion having a plurality of magnetic poles for producing the magnetic force. N and the S poles of the magnetic poles are alternately arranged along the particular surface in a predetermined direction. Thus, the connector is properly positioned relative to the mating connector by the magnetic force.

Abstract translation: 在磁性连接器中通过磁力获得与配合连接器的连接时，基座部件具有在连接时面向配合连接器的特定表面。 电极端子固定到基座构件上，并且适于与配合连接器电连接。 基座部件具有具有用于产生磁力的多个磁极的磁力产生部。 N和磁极的S极沿预定方向沿特定表面交替布置。 因此，连接器通过磁力相对于配合连接器正确定位。

公开(公告)号：US20090044969A1

公开(公告)日：2009-02-19

申请号：US12219343

申请日：2008-07-21

Applicant: Jun Ishii ,  Yasunari Ooyabu ,  Takeshi Tanaka ,  Toshiki Naito

Inventor： Jun Ishii ,  Yasunari Ooyabu ,  Takeshi Tanaka ,  Toshiki Naito

IPC: H05K1/14

CPC classification number: H05K3/363 ,  H05K1/056 ,  H05K1/117 ,  H05K1/142 ,  H05K2201/058 ,  H05K2201/09145 ,  H05K2201/09381 ,  H05K2203/167

Abstract: A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface.

Abstract translation: 布线电路板包括第一布线电路板和布置成与同一平面中的第一布线电路板相对的第二布线电路板。 面向第二布线电路板的第一布线电路板的第一相对表面和面对第一布线电路板的第二布线电路板的第二相对表面包括沿不同方向延伸的至少两种类型的配合表面，以便相互配合 具有第二相对表面的第一相对表面。

公开(公告)号：US20080291380A1

公开(公告)日：2008-11-27

申请号：US12153502

申请日：2008-05-20

Applicant: Takayuki Sakikubo

Inventor： Takayuki Sakikubo

IPC: G02F1/133 ,  H05K1/02

CPC classification number: H05K3/363 ,  H05K1/0269 ,  H05K2201/058 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/166

Abstract: A first electrode pad which is connected to a prescribed wiring and is exposed without being covered with a protection film, is formed in a flexible print circuit (FPC). The first electrode pad is set up to be bonded with a second electrode pad which is included in the other FPC. A positioning pattern which is made of the same material as the first electrode pad, and which is used as a marker to position the other flexible print circuit when the first electrode pad and the second electrode pad are bonded together, is extended from the first electrode pad.

Abstract translation: 在柔性印刷电路（FPC）中形成有连接到规定布线并暴露而不被保护膜覆盖的第一电极焊盘。 第一电极焊盘被设置成与另一个FPC中包括的第二电极焊盘接合。 由与第一电极焊盘相同材料制成的定位图案，当第一电极焊盘和第二电极焊盘接合在一起时，用作将另一柔性印刷电路定位的标记的定位图案从第一电极 垫。