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    Methods of forming thin-profile battery circuits and constructions, and methods of forming button-type battery circuits and constructions
    62.
    发明授权
    Methods of forming thin-profile battery circuits and constructions, and methods of forming button-type battery circuits and constructions 有权
    形成薄型电池电路和结构的方法，以及形成钮扣式电池电路和结构的方法

    公开(公告)号：US06240625B1

    公开(公告)日：2001-06-05

    申请号：US09429736

    申请日：1999-10-27

    Applicant: Mark E. Tuttle

    Inventor： Mark E. Tuttle

    IPC: H01M642

    CPC classification number: H01M2/1066 ,  H01M2/1044 ,  H01M2/204 ,  H01M6/42 ,  H02J7/0024 ,  H04B1/3883 ,  H05K3/321 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/49114

    Abstract: Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced electrical contact pads thereon. At least two thin-profile batteries are conductively bonded together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections.

    Abstract translation: 描述了薄型电池电路和结构，特别是按钮式电池电路及其构成及其形成方法。 在一个实施方案中，提供了具有外表面的衬底，其上具有一对间隔的电接触焊盘。 至少两个薄型电池在具有最低电池和最上面的电池的堆叠中导电地结合在一起。 电池包括相应的正极和负极。 最下面的电池具有一个正极或负极端子，其粘合地粘合到一对电接触焊盘中的一个，而最上面的电池具有与该对电接触焊盘中的另一个电连接的正或负端子中的一个。 电池可以并联或串联电连接。

    Thermal trip arrangements
    63.
    发明授权
    Thermal trip arrangements 失效
    热行程安排

    公开(公告)号：US06175480B1

    公开(公告)日：2001-01-16

    申请号：US09341366

    申请日：1999-07-09

    Applicant: Harry Karmazyn

    Inventor： Harry Karmazyn

    IPC: H02H504

    CPC classification number: H01H37/761 ,  H01C7/10 ,  H01H2037/046 ,  H01H2037/763 ,  H02H9/042 ,  H05K1/0201 ,  H05K1/184 ,  H05K3/3442 ,  H05K2201/10181 ,  H05K2201/10643 ,  H05K2203/159 ,  H05K2203/176

    Abstract: A varistor with no connecting legs extending from it, is mounted in a slot formed in a printed circuit board. The printed circuit board carries the normal circuit tracks. The physical and electrical connection between the printed circuit board and the varistor is achieved by the use of solder. When the varistor overheats to a temperature beyond a predetermined temperature, the solder melts and the varistor is separated from the printed circuit board. A leaf spring which is biased when the varistor is inserted into the slot pushes the varistor out of the slot when the solder melts. Alternatively, when the solder melts gravity causes the varistor to fall out of the printed circuit board.

    Abstract translation: 没有连接脚从其延伸的变阻器安装在形成在印刷电路板中的槽中。 印刷电路板承载正常电路轨道。 印刷电路板和压敏电阻之间的物理和电气连接通过使用焊料实现。 当压敏电阻过热到超过预定温度的温度时，焊料熔化，并且变阻器与印刷电路板分离。 当压敏电阻插入插槽时被偏置的板簧在焊料熔化时将压敏电阻推出槽。 或者，当焊料熔化重力时，压敏电阻从印刷电路板掉出。

    Electrical circuit package for greeting cards
    65.
    发明授权
    Electrical circuit package for greeting cards 失效
    贺卡电路包

    公开(公告)号：US4611262A

    公开(公告)日：1986-09-09

    申请号：US609164

    申请日：1984-05-11

    Applicant: Michael D. Galloway ,  William H. Rose ,  David T. Shaffer

    Inventor： Michael D. Galloway ,  William H. Rose ,  David T. Shaffer

    IPC: H05K1/18 ,  H05K3/20 ,  H05K3/32 ,  H05K3/40 ,  H05K5/00 ,  H05K5/02

    CPC classification number: H05K3/326 ,  H05K5/0086 ,  H05K1/182 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10037 ,  H05K2201/10083 ,  H05K2201/1059 ,  H05K2201/10643 ,  H05K3/202 ,  H05K3/4092 ,  Y10S428/901 ,  Y10T29/49105

    Abstract: An electrical circuit package comprise a stamped and formed lead frame to which is molded a dielectric housing member which includes openings having exposed electrical contacts, the housing member providing support for the lead frame. Some of the exposed contacts in the openings serve to support electrical components in the openings and to make electrical contact therewith while other of the exposed contacts in the openings electrically engage the electrical components and maintain them in the openings. Further exposed contacts electrically engage another electrical component and the housing member and the further exposed contacts maintain the other electrical component in the housing member. An electrical switch is part of the lead frame.

    Abstract translation: 电路封装包括冲压和成形的引线框架，模制成绝缘壳体构件，绝缘壳体构件包括具有暴露的电触点的开口，壳体构件为引线框架提供支撑。 开口中的一些暴露的触点用于支撑开口中的电气部件并与其电接触，而开口中的其他暴露的触点电接合电气部件并将它们保持在开口中。 进一步暴露的接触件电接合另一个电气部件和壳体部件，并且另外暴露的触头将另一电气部件保持在壳体部件中。 电气开关是引线框架的一部分。

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