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公开(公告)号:US12099867B2
公开(公告)日:2024-09-24
申请号:US15993061
申请日:2018-05-30
Applicant: Advanced Micro Devices, Inc.
Inventor: Sooraj Puthoor , Joseph Gross , Xulong Tang , Bradford Michael Beckmann
CPC classification number: G06F9/4881
Abstract: Systems, apparatuses, and methods for implementing a multi-kernel wavefront scheduler are disclosed. A system includes at least a parallel processor coupled to one or more memories, wherein the parallel processor includes a command processor and a plurality of compute units. The command processor launches multiple kernels for execution on the compute units. Each compute unit includes a multi-level scheduler for scheduling wavefronts from multiple kernels for execution on its execution units. A first level scheduler creates scheduling groups by grouping together wavefronts based on the priority of their kernels. Accordingly, wavefronts from kernels with the same priority are grouped together in the same scheduling group by the first level scheduler. Next, the first level scheduler selects, from a plurality of scheduling groups, the highest priority scheduling group for execution. Then, a second level scheduler schedules wavefronts for execution from the scheduling group selected by the first level scheduler.
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公开(公告)号:US12099609B2
公开(公告)日:2024-09-24
申请号:US17127554
申请日:2020-12-18
Applicant: Advanced Micro Devices, Inc.
Inventor: Hsiu-Ming Chu
IPC: G06F21/57 , G06F8/65 , G06F9/44 , G06F9/4401 , G06F11/14
CPC classification number: G06F21/572 , G06F8/65 , G06F9/4403 , G06F11/1417 , G06F2201/805 , G06F2221/033
Abstract: A computing system may implement a basic input/output system (BIOS) update method. The BIOS also includes identifying an installed central processing unit (CPU) of a computer system coupled to a BIOS chipset, selecting CPU firmware corresponding to the installed CPU from a plurality of CPU platform firmware stored on a first memory, and loading the CPU firmware into a shared portion of a second memory coupled to the BIOS chipset, where the shared portion of the second memory is configured to store the CPU firmware as secondary CPU firmware.
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公开(公告)号:US20240311199A1
公开(公告)日:2024-09-19
申请号:US18120646
申请日:2023-03-13
Applicant: Advanced MICRO DEVICES, INC.
Inventor: Nicolai Haehnle , Mark Leather , Brian Emberling , Michael John Bedy , Daniel Schneider
Abstract: A program code executing on a processing system includes one or more instructions each identifying a workload that includes a plurality of waves and each identifying resource allocations for the plurality of waves of the workgroup. In response to receiving an instruction identifying a workload and resource allocations for the plurality of waves of the workgroup, a processor allocates a first set of processing resources to a compute unit of the processor based on the resource allocations for the plurality of waves. The compute unit then performs operations for the workgroup using the allocated set of processing resources.
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公开(公告)号:US12094853B2
公开(公告)日:2024-09-17
申请号:US17963729
申请日:2022-10-11
Applicant: ADVANCED MICRO DEVICES, INC. , ATI TECHNOLOGIES ULC
Inventor: Bryan Black , Michael Z. Su , Gamal Refai-Ahmed , Joe Siegel , Seth Prejean
IPC: H01L23/48 , H01L23/00 , H01L25/065
CPC classification number: H01L25/0657 , H01L23/481 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/03 , H01L24/11 , H01L2224/0233 , H01L2224/02331 , H01L2224/0401 , H01L2224/05022 , H01L2224/05095 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05169 , H01L2224/05567 , H01L2224/0557 , H01L2224/05572 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/06181 , H01L2224/13022 , H01L2224/13025 , H01L2224/131 , H01L2224/17181 , H01L2225/06548 , H01L2924/00014 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H01L2224/131 , H01L2924/014 , H01L2924/00014 , H01L2224/05552 , H01L2924/351 , H01L2924/00 , H01L2924/14 , H01L2924/00
Abstract: A semiconductor chip with conductive vias and a method of manufacturing the same are disclosed. The method includes forming a first plurality of conductive vias in a layer of a first semiconductor chip The first plurality of conductive vias includes first ends and second ends. A first conductor pad is formed in ohmic contact with the first ends of the first plurality of conductive vias.
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公开(公告)号:US12093181B2
公开(公告)日:2024-09-17
申请号:US17852296
申请日:2022-06-28
Applicant: Advanced Micro Devices, Inc.
Inventor: Chintan S. Patel , Alexander J. Branover , Benjamin Tsien , Edgar Munoz , Vydhyanathan Kalyanasundharam
IPC: G06F12/08 , G06F12/0811 , G06F12/0864 , G06F12/0871
CPC classification number: G06F12/0871 , G06F12/0811 , G06F12/0864
Abstract: A technique for operating a cache is disclosed. The technique includes based on a workload change, identifying a first allocation permissions policy; operating the cache according to the first allocation permissions policy; based on set sampling, identifying a second allocation permissions policy; and operating the cache according to the second allocation permissions policy.
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公开(公告)号:US20240304241A1
公开(公告)日:2024-09-12
申请号:US18181054
申请日:2023-03-09
Applicant: Advanced Micro Devices, Inc.
Inventor: Richard T. Schultz , Kerrie Vercant Underhill
IPC: G11C11/419 , H01L23/528 , H01L29/06 , H01L29/417 , H01L29/423 , H01L29/786 , H10B10/00
CPC classification number: G11C11/419 , H01L23/5283 , H01L29/0673 , H01L29/41733 , H01L29/42392 , H01L29/78696 , H10B10/125
Abstract: An apparatus and method for efficiently creating layout for memory bit cells are described. In various implementations, a memory bit cell uses pairs of transistors that are vertically stacked gate all around (GAA) transistors with gate terminals forming a T-shape with respect to one another and a single gate contact that overlaps only one active layer of the two active layers of the pair. Transistors of such a pair of field effect transistors (FETs) are referred to as TFETs. With respect to one another, the active layers of TFETs use opposite doping polarities and conduct current in an orthogonal direction. A non-overlapping distance between top and bottom active layers of a pair of TFETs is at least a width of a drain/source contact. The orthogonal current flow of the top and bottom active layers simplifies local connections that reduces the resistance and capacitance of the signal routes.
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公开(公告)号:US12086422B2
公开(公告)日:2024-09-10
申请号:US18320819
申请日:2023-05-19
Applicant: Advanced Micro Devices, Inc.
Inventor: Michael W. LeBeane , Khaled Hamidouche , Hari S. Thangirala , Brandon Keith Potter
IPC: G06F3/06 , G06F12/02 , G06F12/0802
CPC classification number: G06F3/0619 , G06F3/0656 , G06F3/067 , G06F12/0223 , G06F12/0802 , G06F2212/152
Abstract: A framework disclosed herein extends a relaxed, scoped memory model to a system that includes nodes across a commodity network and maintains coherency across the system. A new scope, cluster scope, is defined, that allows for memory accesses at scopes less than cluster scope to operate on locally cached versions of remote data from across the commodity network without having to issue expensive network operations. Cluster scope operations generate network commands that are used to synchronize memory across the commodity network.
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公开(公告)号:US12080632B2
公开(公告)日:2024-09-03
申请号:US17489182
申请日:2021-09-29
Applicant: Advanced Micro Devices, Inc.
Inventor: Deepak Vasant Kulkarni , Rahul Agarwal , Rajasekaran Swaminathan , Chintan Buch
IPC: H01L23/495 , H01L23/14 , H10B12/00
CPC classification number: H01L23/4951 , H01L23/145 , H10B12/50
Abstract: Apparatuses, systems and methods for efficiently generating a package substrate. A semiconductor fabrication process (or process) fabricates each of a first glass package substrate and a second glass package substrate with a redistribution layer on a single side of a respective glass wafer. The process flips the second glass package substrate upside down and connects the glass wafers of the first and second glass package substrates together using a wafer bonding technique. In some implementations, the process uses copper-based wafer bonding. The resulting bonding between the two glass wafers contains no air gap, no underfill, and no solder bumps. Afterward, the side of the first glass package substrate opposite the glass wafer is connected to at least one integrated circuit. Additionally, the side of the second glass package substrate opposite the glass wafer is connected to a component on the motherboard through pads on the motherboard.
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公开(公告)号:US12073919B2
公开(公告)日:2024-08-27
申请号:US17359445
申请日:2021-06-25
Applicant: Advanced Micro Devices, Inc.
Inventor: Arijit Banerjee , John J. Wuu , Russell Schreiber
IPC: G11C8/16 , G06F30/392 , G11C11/418 , G11C11/419
CPC classification number: G11C8/16 , G06F30/392 , G11C11/418 , G11C11/419
Abstract: An apparatus and method for providing efficient floor planning, power, and performance tradeoffs of memory accesses. A dual read port and single write port memory bit cell uses two asymmetrical read access circuits for conveying stored data on two read bit lines. The two read bit lines are pre-charged to different voltage reference levels. The layout of the memory bit cell places the two read bit lines on an opposed edge from the single write bit line. The layout uses a dummy gate placed over both p-type diffusion and n-type diffusion between the edges. The layout has a same number of p-type transistors as n-type transistors despite using asymmetrical read access circuits. The layout also has a contacted gate pitch that is one more than the number of p-type transistors.
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公开(公告)号:US12073114B2
公开(公告)日:2024-08-27
申请号:US17491058
申请日:2021-09-30
Applicant: Advanced Micro Devices, Inc.
Inventor: Hideki Kanayama , Eric M. Scott
IPC: G06F3/06
CPC classification number: G06F3/0659 , G06F3/0604 , G06F3/0622 , G06F3/0635 , G06F3/0679
Abstract: A memory controller includes a command queue with multiple entry stacks, each with a plurality of entries holding memory access commands, one or more parameter indicators each holding a respective characteristic common to the plurality of entries, and a head indicator designating a current entry for arbitration. An arbiter has a single command input for each entry stack. A command queue loader circuit receives incoming memory access commands and loads entries of respective entry stacks with memory access commands having the respective characteristic of each of the one or more parameter indicators in common.
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