Abstract:
A tracking servo control apparatus and method in which the distance between a main beam and a side beam is adjustable by a rotatable grating, so as to perform a tracking servo control operation in accordance with a differential push-pull (DPP) method for both the DVD-ROM (Read Only Memory) and the DVD-RAM (Random Access Memory) having different track pitches.
Abstract:
A synchronous dynamic random access memory capable of accessing data in a memory cell array therein in synchronism with a system clock from an external system such as a central processing unit (CPU). The synchronous DRAM receives an external clock and includes a plurality of memory banks each including a plurality of memory cells and operable in either an active cycle or a precharge cycle, a circuit for receiving a row address strobe signal and latching a logic level of the row address strobe signal in response to the clock, an address input circuit for receiving an externally generated address selecting one of the memory banks, and a circuit for receiving the latched logic level and the address from the address input circuit and for outputting an activation signal to the memory bank selected by the address and an inactivation signals to unselected memory banks when the latched logic level is a first logic level, so that the selected memory bank responsive to the activation signal operates in the active cycle while the unselected memory banks responsive to the inactivation signals operate in the precharge cycle.
Abstract:
A semiconductor memory device for processing data in synchronization with a system clock applied from the exterior includes a circuit for generating a write latency control signal, a circuit for generating one active information enlarged signal from a plurality of active information signals generated in response to a column related control signal supplied from the exterior, and a circuit for holding internal operations of a column address counter, a burst length counter and a data transfer switching circuit for a prescribed time in which the active information enlarged signal is in an active state.
Abstract:
A data output buffer is used for a synchronous semiconductor memory device carrying out a data read/write operation in synchronism with an externally supplied clock. The semiconductor memory device includes a first shift register having a plurality of clock stages for transmitting a RAS signal in response to the clock; a circuit for extracting a data output margin signal from a predetermined stage among the stages of the first shift circuit; first latch circuits each receiving the data output margin signal, for generating a plurality of first latency signals having information on the RAS signal by combining row address signals and the signals extracted from the respective clock stages of the first shift circuit; a second shift circuit having a plurality of clock stages for transmitting a CAS signal in response to the clock; second latch circuits each receiving the data output margin signal, for generating a plurality of second latency signals having information on the CAS signal by combining column address signals and the signals extracted from the respective clock stages of the second shift circuit; and a latency combination circuit receiving the first and second latency signals, for generating a data output control signal to the data output buffer, so that the data output buffer can generate data output even during a RAS precharge cycle.
Abstract:
Semiconductor devices configured to test connectivity of micro bumps including one or more micro bumps and a boundary scan test block for testing connectivity of the micro bumps by scanning data input to the micro bumps and outputting the scanned data. The semiconductor device may include a first chip including solder balls and at least one or more switches electrically coupled with the respective solder balls, and a second chip stacked on top of the first chip and electrically coupled with the switches in direct access mode, including micro bumps that input/output signals transmitted from/to the solder balls.
Abstract:
A semiconductor integrated circuit device includes a semiconductor chip having a memory cell array region surrounded with a peripheral circuit region and includes a plurality of bonding pads disposed at least in one row on only one side of the semiconductor chip. The circuit device may include first leads group disposed adjacent to the bonding pad side and a second leads group disposed opposite the first leads group. The second leads group may be formed over a portion of the semiconductor chip (lead-on-chip structure). A plurality of bonding wires connect the first and second leads group with the plurality of bonding pads respectively.
Abstract:
Disclosed is a method of controlling a deep power down mode in a multi-port semiconductor memory having a plurality of ports connected to a plurality of processors. Control of the deep power down mode in the multi-port semiconductor memory is performed such that activation/deactivation of the deep power down mode are determined in accordance with signals applied through various ports in the plurality of ports.
Abstract:
A semiconductor memory device is disclosed. The semiconductor device includes a memory cell array, a clock signal generator configured to receive an external clock signal from the outside of the memory device and output an internal clock signal, and a data output unit configured to receive an internal data signal from the memory cell array and output a read data signal in response to the internal clock signal. The semiconductor memory device also includes a read data strobe unit configured to output a read data strobe signal having a cycle time of n times (n is an integer equal to or more than 2) a cycle time of the internal clock signal, based on the internal clock signal.
Abstract:
A stacked semiconductor memory device is provided which includes a first memory chip including a first transmission line, a second transmission line, and a logic circuit configured to execute a logic operation on a first signal of the first transmission line and a second signal of the second transmission line. The stacked semiconductor memory device further includes a second memory chip stacked over the first memory chip, an inter-chip connection unit electrically coupled between the second memory chip and the first transmission line of the first memory chip, and a dummy inter-chip connection unit electrically coupled to the second transmission line of the first memory chip and electrically isolated from the second memory chip.
Abstract:
A multi-port semiconductor memory device having variable access paths and a method therefor are provided. The semiconductor memory device includes a plurality of input/output ports; a memory array divided into a plurality of memory areas; and a select control unit to variably control access paths between the memory areas and the input/output ports so that each memory area is accessed through at least one of the input/output ports.