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    Wiring board
    71.
    发明授权
    Wiring board 有权
    接线板

    公开(公告)号：US08933556B2

    公开(公告)日：2015-01-13

    申请号：US12895126

    申请日：2010-09-30

    Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

    Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

    IPC: H01L23/053 ,  H01L23/12 ,  H05K1/11 ,  H05K3/46 ,  H05K3/40

    CPC classification number: H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H05K1/0298 ,  H05K1/092 ,  H05K1/116 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/0094 ,  H05K3/4069 ,  H05K3/4611 ,  H05K3/4623 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09854 ,  Y10T156/1056

    Abstract: A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from the first surface toward the second surface. The first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor made of a plating in the first hole. The second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor made of a conductive paste in the second hole. The third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor made of a plating in the third hole. The first, second and third conductors are positioned along the same axis and are electrically continuous with each other.

    Abstract translation: 布线板包括具有第一表面和第二表面并且包括第一，第二和第三绝缘层从第一表面朝向第二表面的顺序的层叠体。 第一绝缘层具有穿过第一绝缘层的第一孔，并且包括在第一孔中由电镀制成的第一导体。 第二绝缘层具有穿过第二绝缘层的第二孔，并且包括在第二孔中由导电膏制成的第二导体。 第三绝缘层具有穿过第三绝缘层的第三孔，并且包括在第三孔中由电镀制成的第三导体。 第一，第二和第三导体沿着相同的轴定位并且彼此电连续。

    Method of manufacturing wiring board
    74.
    发明授权
    Method of manufacturing wiring board 有权
    制造布线板的方法

    公开(公告)号：US08522429B2

    公开(公告)日：2013-09-03

    申请号：US13187995

    申请日：2011-07-21

    Applicant: Michimasa Takahashi ,  Masakazu Aoyama

    Inventor： Michimasa Takahashi ,  Masakazu Aoyama

    IPC: H01K3/10

    CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536

    Abstract: A method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

    Abstract translation: 一种形成布线板的方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的边缘，以及形成在第一衬底或第二衬底中的至少一个衬底中的至少一个通孔。 夹在第一基板和第二基板之间的基底基板的一部分的厚度大于未被夹在第一基板和第二基板之间的基底部分的厚度。

    Flex-rigid wiring board and method of manufacturing the same
    76.
    发明授权
    Flex-rigid wiring board and method of manufacturing the same 有权
    挠性刚性接线板及其制造方法

    公开(公告)号：US08476531B2

    公开(公告)日：2013-07-02

    申请号：US13238429

    申请日：2011-09-21

    Applicant: Michimasa Takahashi ,  Masakazu Aoyama

    Inventor： Michimasa Takahashi ,  Masakazu Aoyama

    IPC: H05K1/00

    CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  Y10T29/49124 ,  Y10T29/49165

    Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

    Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括形成在柔性基板上的柔性基板和导体图案，邻近柔性基板设置的非柔性基板，覆盖柔性基板和非柔性基板的绝缘层，以及 暴露柔性板的一个或多个部分，形成在绝缘层上的导体图案，以及将柔性板的导体图案和导体图案连接在绝缘层上的镀层。

    Flex-rigid wiring board and method of manufacturing the same
    77.
    发明授权
    Flex-rigid wiring board and method of manufacturing the same 有权
    挠性刚性接线板及其制造方法

    公开(公告)号：US08399775B2

    公开(公告)日：2013-03-19

    申请号：US12403220

    申请日：2009-03-12

    Applicant: Michimasa Takahashi ,  Masakazu Aoyama

    Inventor： Michimasa Takahashi ,  Masakazu Aoyama

    IPC: H05K1/00

    CPC classification number: H05K3/4691 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/055 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49124

    Abstract: A flex-rigid wiring board includes a first rigid substrate, a second rigid substrate arranged at a distance from the first rigid substrate to provide a space between the first and second rigid substrates and a flexible substrate. The flexible substrate includes a first tip portion connected to the first rigid substrate, and a second tip portion connected to the second rigid substrate such that the first and second rigid substrates are connected to each other by way of the flexible substrate. At least one bending portion is formed between the first and second tip portions of the flexible substrate, each of the at least one bending portions is provided in the space between the first and second rigid substrates.

    Abstract translation: 柔性刚性布线板包括第一刚性基板，布置在与第一刚性基板相距一定距离处的第二刚性基板，以在第一和第二刚性基板之间提供空间和柔性基板。 柔性基板包括连接到第一刚性基板的第一末端部分和连接到第二刚性基板的第二末端部分，使得第一和第二刚性基板通过柔性基板相互连接。 在柔性基板的第一和第二末端部分之间形成至少一个弯曲部分，所述至少一个弯曲部分中的每一个设置在第一和第二刚性基板之间的空间中。

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    78.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    接线板及其制造方法

    公开(公告)号：US20130025914A1

    公开(公告)日：2013-01-31

    申请号：US13538095

    申请日：2012-06-29

    Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi

    Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi

    IPC: H05K1/14 ,  H05K3/36

    CPC classification number: H05K3/4694 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/09145 ,  H05K2201/2072 ,  Y10T29/49126

    Abstract: A wiring board has wiring board has a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion and having a conductor electrically connected to the conductor in the first rigid wiring board, and an insulation layer formed over the first rigid wiring board and the second rigid wiring board. The first rigid wiring board has a wall surface defining the accommodation portion and having a concavo-convex shaped portion, and the second rigid wiring board has a side surface facing against the wall surface of the first rigid wiring board and having a concavo-convex shaped portion such that the concavo-convex shaped portion of the side surface of the second rigid wiring board engages with the concavo-convex shaped portion of the wall surface of the first rigid wiring board.

    Abstract translation: 布线基板具有布线基板，具有具有收容部和导体的第一刚性布线基板，容纳在收纳部中的第二刚性布线基板，具有与第一刚性布线基板中的导体电连接的导体，绝缘层 形成在第一刚性布线板和第二刚性布线板上。 第一刚性布线板具有限定容纳部分并具有凹凸形状部分的壁表面，并且第二刚性布线板具有面对第一刚性布线板的壁表面的侧表面，并且具有凹凸形状 使得第二刚性布线板的侧面的凹凸形状部分与第一刚性布线板的壁表面的凹凸形状部分接合。

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    80.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    接线板及其制造方法

    公开(公告)号：US20130014982A1

    公开(公告)日：2013-01-17

    申请号：US13483587

    申请日：2012-05-30

    Applicant: Hiroshi SEGAWA ,  Nobuyuki NAGANUMA ,  Michimasa TAKAHASHI ,  Teruyuki ISHIHARA

    Inventor： Hiroshi SEGAWA ,  Nobuyuki NAGANUMA ,  Michimasa TAKAHASHI ,  Teruyuki ISHIHARA

    IPC: H05K1/14 ,  H05K3/36

    CPC classification number: H05K1/141 ,  H05K1/142 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/368 ,  H05K2201/09972 ,  H05K2203/1189 ,  Y10T29/49126

    Abstract: A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.

    Abstract translation: 布线基板具有第一布线基板，其具有第一阻焊层，第二布线基板与第一布线基板连接，位于形成于第一布线基板的第一阻焊层的第一开口部， 连接到第一布线板并且位于形成在第一布线板的第一阻焊层中的第二开口部分中，使得第二布线板和第三布线板位于第一布线板的同一侧。 第一布线板的第一开口部分和第一布线板的第二开口部分形成在第一阻焊层中容纳第二和第三布线板的公共开口部分或分离容纳第二布线板的单独开口部分， 第一阻焊层中的第三布线板。

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