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    LED chips having fluorescent substrates with microholes and methods for fabricating
    72.
    发明授权
    LED chips having fluorescent substrates with microholes and methods for fabricating 有权
    具有带微孔的荧光基板的LED芯片及其制造方法

    公开(公告)号：US09196799B2

    公开(公告)日：2015-11-24

    申请号：US12229366

    申请日：2008-08-22

    申请人： Ashay Chitnis ,  Bernd Keller

    发明人： Ashay Chitnis ,  Bernd Keller

    IPC分类号： H01L33/00 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62 ,  H01L23/31 ,  H01L33/38

    CPC分类号： H01L33/44 ,  H01L23/3114 ,  H01L33/38 ,  H01L33/505 ,  H01L33/508 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Methods for fabricating semiconductor devices such as LED chips at the wafer level, and LED chips and LED chip wafers fabricated using the methods. An LED chip wafer according to the present invention comprises a plurality of LEDs on a wafer and a plurality of pedestals, each of which is on one of the LEDs. A fluorescent substrate or preform (“preform”) is provided covering at least some of the LEDs, the preform comprising holes with the pedestals arranged within the holes. During operation of the covered ones of said LEDs at least some light from the LEDs passes through the preform and is converted. LED chips are provided that are singulated from this LED chip wafer. One embodiment of a method for fabricating LED chips from a wafer comprises depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on the growth wafer. Pedestals are formed on the LEDs and a fluorescent preform is formed with holes. The fluorescent preform is bonded over at least some of the plurality of LEDs so that at least some light from the covered ones of said LEDs passes through the preform and is converted. The pedestals are arranged in the holes so that an electrical signal is applied to the LEDs through the pedestals.

    摘要翻译： 用于制造晶片级的半导体器件如LED芯片的方法，以及使用该方法制造的LED芯片和LED芯片晶片。 根据本发明的LED芯片晶片包括晶片上的多个LED和多个基座，每个基座位于一个LED上。 提供了覆盖至少一些LED的荧光基板或预制件（“预制件”），预成型件包括具有布置在孔内的基座的孔。 在所述LED的被覆盖的操作期间，来自LED的至少一些光通过预型件并被转换。 提供从该LED芯片晶片分离的LED芯片。 从晶片制造LED芯片的方法的一个实施例包括在LED生长晶片上沉积LED外延层，以在生长晶片上形成多个LED。 在LED上形成基座，荧光预制件形成有孔。 所述荧光预制件被粘结在所述多个LED中的至少一些上，使得来自所述LED的被覆盖的LED的至少一些光通过所述预型件并被转换。 基座布置在孔中，使得电信号通过基座施加到LED。

    Multiple component solid state white light
    73.
    发明授权
    Multiple component solid state white light 有权
    多组分固态白光

    公开(公告)号：US08901585B2

    公开(公告)日：2014-12-02

    申请号：US12845629

    申请日：2010-07-28

    申请人： Eric Joseph Tarsa ,  Michael Dunn ,  Bernd Keller

    发明人： Eric Joseph Tarsa ,  Michael Dunn ,  Bernd Keller

    IPC分类号： H01L21/00 ,  H01L25/075 ,  H01L33/50

    CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2933/0091 ,  Y10S362/80 ,  H01L2924/00

    摘要： A white light emitting lamp is disclosed comprising a solid state ultra violet (UV) emitter that emits light in the UV wavelength spectrum. A conversion material is arranged to absorb at least some of the light emitting from the UV emitter and re-emit light at one or more different wavelengths of light. One or more complimentary solid state emitters are included that emit at different wavelengths of light than the UV emitter and the conversion material. The lamp emits a white light combination of light emitted from the complimentary emitters and from the conversion material, with the white light having high efficacy and good color rendering. Other embodiments of white light emitting lamp according to the present invention comprises a solid state laser instead of a UV emitter. A high flux white emitting lamp embodiment according to the invention comprises a large area light emitting diode (LED) that emits light at a first wavelength spectrum and includes a conversion material. A plurality of complimentary solid state emitters surround the large area LED, with each emitter emitting light in a spectrum different from the large area LED and conversion material such that the lamp emits a balanced white light. Scattering particles can be included in each of the embodiments to scatter the light from the emitters, conversion material and complimentary emitters to provide a more uniform emission.

    摘要翻译： 公开了一种白光发射灯，其包括在UV波长光谱中发射光的固态紫外（UV）发射器。 转换材料被布置成吸收从UV发射器发射的光中的至少一些，并且在一个或多个不同波长的光下重新发射光。 包括一个或多个互补固态发射器，其发射在不同于UV发射器和转换材料的波长的光。 灯发出从互补发射器和转换材料发出的光的白光组合，白光具有高效率和良好的显色性。 根据本发明的白光发射灯的其它实施例包括固态激光器而不是UV发射器。 根据本发明的高通量白光发光灯实施例包括发射第一波长光谱的光并包括转换材料的大面积发光二极管（LED）。 多个互补固态发射器围绕大面积的LED，每个发射器发射的光与大面积的LED和转换材料不同，使得灯发出平衡的白光。 可以在每个实施例中包括散射颗粒以散射来自发射器，转换材料和互补发射体的光，以提供更均匀的发射。

    Leadframe-based packages for solid state emitting devices
    79.
    发明授权
    Leadframe-based packages for solid state emitting devices 有权
    用于固态发射器件的基于引线框架的封装

    公开(公告)号：US07960819B2

    公开(公告)日：2011-06-14

    申请号：US11486244

    申请日：2006-07-13

    申请人： Ban P. Loh ,  Bernd Keller ,  Nicholas W. Medendorp, Jr.

    发明人： Ban P. Loh ,  Bernd Keller ,  Nicholas W. Medendorp, Jr.

    IPC分类号： H01L23/495

    CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A modular package for a light emitting device includes a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region. The leadframe may further include an electrical lead extending away from the central region. The electrical lead has a bottom surface and has a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead. The second thickness may be less than the first thickness. The package further includes a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region. The package body may be at least partially provided beneath the bottom surface of the lead and adjacent the bottom surface of the central region. Methods of forming modular packages and leadframes are also disclosed.

    摘要翻译： 用于发光器件的模块化封装包括具有顶表面的引线框架，并且包括具有底表面的中心区域，并且在引线框架的顶表面和中心区域的底表面之间具有第一厚度。 引线框还可以包括远离中心区延伸的电引线。 电引线具有底表面并且具有从引线框架的顶表面到电引线的底表面的第二厚度。 第二厚度可以小于第一厚度。 所述封装还包括围绕所述中心区域并且暴露所述中心区域的底表面的所述引线框上的封装体。 封装体可以至少部分地设置在引线的底表面下方并且邻近中心区域的底表面。 还公开了形成模块化封装和引线框架的方法。

    METHOD FOR COATING SEMICONDUCTOR DEVICE USING DROPLET DEPOSITION
    80.
    发明申请
    METHOD FOR COATING SEMICONDUCTOR DEVICE USING DROPLET DEPOSITION 有权
    使用浸渍沉积法涂覆半导体器件的方法

    公开(公告)号：US20090321769A1

    公开(公告)日：2009-12-31

    申请号：US12491162

    申请日：2009-06-24

    申请人： Bernd Keller ,  Ban P. Loh

    发明人： Bernd Keller ,  Ban P. Loh

    IPC分类号： H01L33/00 ,  B05B7/24

    CPC分类号： B41J3/407 ,  H01L21/6715 ,  H01L33/505 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2933/0041

    摘要： Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.

    摘要翻译： 在液体介质中使用波长转换或荧光体颗粒的液滴涂覆半导体器件的方法和系统。 多个喷嘴将受控量的基质材料输送到半导体器件的表面，其中每个所述喷嘴具有用于基质材料通过的开口。 开口具有其中荧光体颗粒的直径小于或近似等于开口直径的一半的直径。 荧光体颗粒也基本上是球形或圆形。 喷嘴通常布置在打印头上，该打印头利用喷墨打印技术来覆盖具有基质材料层的半导体器件。 该方法和系统特别适用于用一层磷光体材料覆盖LED。