公开(公告)号：US20060188019A1

公开(公告)日：2006-08-24

申请号：US11206141

申请日：2005-08-18

申请人： Chun-Hung Lin

发明人： Chun-Hung Lin

IPC分类号： H04N11/02 ,  H04B1/66 ,  H04N7/12 ,  H04N11/04

CPC分类号： H04N19/139 ,  H04N19/159 ,  H04N19/172 ,  H04N19/176 ,  H04N19/57

摘要： A method and system for adaptive motion estimation, which sets a search range in a previous frame in order to find a corresponding macroblock in the adaptive search range according to each macroblock of a current frame and to accordingly determine a corresponding motion vector. A motion vector is first determined by referring to a target macroblock of a current frame and reference macroblocks in a search range of a previous frame. Then, a compression mode is determined according to the target macroblock, the reference macroblocks and the motion vector, and a mode data is outputted corresponding to the compression mode. Finally, a search range is determined according to the mode data and the motion vector. Thus, the required computational amount and bandwidth can be saved and also the high-efficiency image compression is obtained.

摘要翻译： 一种用于自适应运动估计的方法和系统，其设置前一帧中的搜索范围，以便根据当前帧的每个宏块在自适应搜索范围内找到相应的宏块，并因此确定相应的运动矢量。 首先通过参考当前帧的目标宏块和前一帧的搜索范围内的参考宏块来确定运动矢量。 然后，根据目标宏块，参考宏块和运动矢量确定压缩模式，并且对应于压缩模式输出模式数据。 最后，根据模式数据和运动矢量确定搜索范围。 因此，可以节省所需的计算量和带宽，并且获得高效率的图像压缩。

公开(公告)号：US20060145843A1

公开(公告)日：2006-07-06

申请号：US11187237

申请日：2005-07-22

申请人： Chun-Hung Lin

发明人： Chun-Hung Lin

IPC分类号： G08B1/08 ,  H04L12/28

CPC分类号： G08B25/10 ,  G08B25/002 ,  G08B25/009

摘要： A method for environment detection to be implemented by a system, which includes a detection module and a control module, includes the steps of establishing a wireless communications link between the detection module and the control module, enabling the detection module to generate a warning signal that is transmitted wirelessly by the detection module when the detection module detects occurrence of an abnormal environment condition, and enabling the control module to receive the warning signal from the detection module through the wireless communications link and to process the warning signal accordingly. A system for realizing the method is also disclosed.

摘要翻译： 一种由包括检测模块和控制模块的系统实现的环境检测方法，包括以下步骤：在检测模块和控制模块之间建立无线通信链路，使得检测模块能够产生警告信号， 当检测模块检测到异常环境状况的发生时，被检测模块无线地发送，并且使控制模块能够通过无线通信链路从检测模块接收到警告信号，并相应地处理警告信号。 还公开了一种用于实现该方法的系统。

公开(公告)号：US20050197730A1

公开(公告)日：2005-09-08

申请号：US10791930

申请日：2004-03-03

申请人： Chih-Wei Hsu ,  Span Lu ,  Kuang-Huan Hsu ,  Chen-Yung Lin ,  Shui-Tien Lin ,  Chun-Hung Lin

发明人： Chih-Wei Hsu ,  Span Lu ,  Kuang-Huan Hsu ,  Chen-Yung Lin ,  Shui-Tien Lin ,  Chun-Hung Lin

IPC分类号： G06F17/50 ,  G06F19/00 ,  H01L21/00

CPC分类号： G05B19/41875 ,  Y02P90/22

摘要： Provided are a system and method for preventing contamination in a semiconductor manufacturing environment. The method includes comparing one or more attributes associated with a product, such as a substrate, with one or more attributes associated with an operation. If the comparison indicates that the product is not compatible with the operation, then the operation is suspended with respect to the product. If the comparison indicates that the product is compatible with the operation, then the operation is performed on the product.

摘要翻译： 提供一种用于防止半导体制造环境中的污染的系统和方法。 该方法包括将与产品（例如底物）相关联的一个或多个属性与与操作相关联的一个或多个属性进行比较。 如果比较表明该产品与该操作不兼容，则该操作将相对于该产品暂停。 如果比较表示产品与操作兼容，则对产品执行操作。

公开(公告)号：US20050169053A1

公开(公告)日：2005-08-04

申请号：US11096997

申请日：2005-03-31

申请人： Chun-Hung Lin ,  Chih-Hung Wang ,  Chun-Hao Kuo

发明人： Chun-Hung Lin ,  Chih-Hung Wang ,  Chun-Hao Kuo

IPC分类号： G06F12/06 ,  G06F11/16 ,  G06F12/00 ,  G06F12/02 ,  G06F12/08 ,  G06F13/00 ,  G11C7/10 ,  G11C11/34 ,  G11C16/00 ,  G11C16/06 ,  G11C29/00

CPC分类号： G06F12/0246 ,  G06F11/1068 ,  G06F11/1435 ,  G06F12/0292 ,  G06F2212/7203

摘要： A window-based flash memory storage system and a management and an access method therefor are proposed. The window-based flash memory storage system includes a window-based region and a redundant reserved region; wherein the window-based region is used to store a number of windows, each window being associated with a number of physical blocks. The redundant reserved region includes a dynamic-link area, a window-information area, a dynamic-link information area, and an boot-information area; wherein the dynamic-link area includes a plurality of dynamic allocation blocks, each being allocatable to any window. The window-information area is used to store a specific window-information set that is dedicated to a certain window within a specific range of data storage space. The dynamic-link information area is used to record the status of the allocation of the dynamic allocation blocks to the windows.

摘要翻译： 提出了一种基于窗口的闪存存储系统及其管理和访问方法。 基于窗口的闪存存储系统包括基于窗口的区域和冗余保留区域; 其中基于窗口的区域用于存储多个窗口，每个窗口与多个物理块相关联。 冗余保留区域包括动态链路区域，窗口信息区域，动态链路信息区域和引导信​​息区域; 其中所述动态链接区域包括多个动态分配块，每个动态分配块可分配给任何窗口。 窗口信息区域用于存储专用于数据存储空间的特定范围内的特定窗口的特定窗口信息集。 动态链接信息区域用于将动态分配块的分配状态记录到窗口。

公开(公告)号：US06854713B2

公开(公告)日：2005-02-15

申请号：US10394001

申请日：2003-03-24

申请人： Chun-Hung Lin ,  Chen-Der Tsai ,  Chin-Ching Wu ,  Jung-Chen Ho ,  Hann-Tsong Wang

发明人： Chun-Hung Lin ,  Chen-Der Tsai ,  Chin-Ching Wu ,  Jung-Chen Ho ,  Hann-Tsong Wang

IPC分类号： F16K1/42 ,  F16K7/16 ,  F16K7/12

CPC分类号： F16K7/16 ,  F16K1/425

摘要： The diaphragm valve uses a metal dish-type diaphragm set to control the inflow and outflow of fluid. The metal dish-type diaphragm set is above an air flow channel to control the stem above the metal dish-type diaphragm set, and the air will be blocked by pressing the metal dish-type diaphragm to make it fit the metal valve base in the air flow channel; this non-metal valve base is fixed in the air flow channel by a fixed shrunk ring with a taper cross section, and the in-between metal diaphragm in the metal dish-type diaphragm set is annular in the center to reduce the metallic friction between metal diaphragms, to increase application times and to lower the leakage rate of the diaphragm valve.

摘要翻译： 隔膜阀采用金属盘式隔膜套来控制流体的流入和流出。 金属盘式隔膜组件位于空气流通道上方，用于控制金属盘式隔膜组件上方的杆，空气将通过按压金属盘型隔膜而阻塞，使其与金属阀座底座相配合 气流通道; 该非金属阀座通过具有锥形横截面的固定收缩环固定在空气流动通道中，并且金属盘形隔膜组中的金属隔膜在中心是环形的，以减少金属间的金属摩擦 金属隔膜，以增加施工时间并降低隔膜阀的泄漏率。

公开(公告)号：US06211574B1

公开(公告)日：2001-04-03

申请号：US09292742

申请日：1999-04-16

申请人： Su Tao ,  Chun-Hung Lin ,  Tai-Chun Huang

发明人： Su Tao ,  Chun-Hung Lin ,  Tai-Chun Huang

IPC分类号： H01L2348

CPC分类号： H01L23/16 ,  H01L21/56 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/4899 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3862 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor package includes a semiconductor die mounted on an upper surface of a substrate. A number of wire bonds electrically connect between a number of bonding pads on the upper surface of the substrate and a number of bonding pads on an upper surface of the semiconductor die. A fixing portion surrounds the semiconductor die and covers a mediate portion of each wire bond. Encapsulating material is molded over the semiconductor die and the wire bonds to form an encapsulant. In an alternative embodiment, the fixing portion is provided on the upper surface of the substrate adjacent to a mold gate of the substrate where the wire sweeping is most likely to occur while molding. The fixing portion does not cover the semiconductor die to avoid thermal strain acting on the semiconductor die due to the different coefficients of thermal expansion between the fixing portion and the encapsulant.

摘要翻译： 半导体封装包括安装在基板的上表面上的半导体管芯。 多个引线键合电连接在衬底的上表面上的多个接合焊盘和半导体管芯的上表面上的多个接合焊盘之间。 固定部围绕半导体管芯并覆盖每个引线接合的中间部分。 封装材料被模制在半导体管芯上并且引线键合以形成密封剂。 在替代实施例中，固定部分设置在与基板的模具浇口相邻的基板的上表面上，其中在模制时最可能发生金属丝扫掠。 由于固定部和密封剂之间的热膨胀系数不同，固定部不覆盖半导体管芯，以避免作用在半导体管芯上的热应变。

公开(公告)号：US20230295627A1

公开(公告)日：2023-09-21

申请号：US18156231

申请日：2023-01-18

申请人： Shi-Lung Lin ,  Sam Lin ,  Chun-Hung Lin

发明人： Shi-Lung Lin ,  Sam Lin ,  Chun-Hung Lin

IPC分类号： C12N15/113 ,  C12N9/12 ,  C12Q1/686

CPC分类号： C12N15/113 ,  C12N9/127 ,  C12Q1/686 ,  C12N2310/141 ,  C12Y207/07048

摘要： This invention generally relates to a novel composition of RNA/mRNA medicines as well as vaccines produced by using replicase- and/or RNA-dependent RNA polymerase (RdRp)-mediated RNA cycling reaction (RCR). The present invention is useful for developing a variety of self-amplifying RNA/mRNA (samRNA) medicines and vaccines containing at least a replicase/RdRp-binding site in the 5′- or 3′-end, or both, of any desired RNA molecule, including but not limited to antisense RNA (aRNA), small interferring RNA (siRNA), short hairpin RNA (shRNA), microRNA (miRNA)/miRNA precursor, long non-coding RNA (lnRNA) and mRNA. These RNA molecules can be either in single-stranded or in double-stranded, or mixed, conformation. The samRNA so obtained is useful not only for producing RNA-based vaccines and/or medicines but also for generating the mRNA-associated proteins, peptides, and/or antibodies under a proper in-vitro or in-cell translation condition. The replicase/RdRp-binding sites used in samRNA are derived or modified from coronaviral (e.g. COVID-19) and/or hepatitis C viral (HCV) RNA-dependent RNA polymerases (RdRp) in either single-stranded or double-stranded compositions.

公开(公告)号：US09502360B2

公开(公告)日：2016-11-22

申请号：US13348449

申请日：2012-01-11

申请人： Chun-Hung Lin ,  Yu-Feng Chen ,  Han-Ping Pu ,  Hung-Jui Kuo

发明人： Chun-Hung Lin ,  Yu-Feng Chen ,  Han-Ping Pu ,  Hung-Jui Kuo

IPC分类号： H01L23/52 ,  H01L23/00 ,  H01L25/10 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC分类号： H01L23/562 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49822 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00

摘要： A stress compensation for use in packaging, and a method of forming, is provided. The stress compensation layer is placed on an opposing side of a substrate from an integrated circuit die. The stress compensation layer is designed to counteract at least some of the stress exerted structures on the die side of the substrate, such as stresses exerted by a molding compound that at least partially encapsulates the first integrated circuit die. A package may also be electrically coupled to the substrate.

摘要翻译： 提供了用于包装的应力补偿，以及形成方法。 应力补偿层从集成电路管芯放置在衬底的相对侧上。 应力补偿层被设计成抵抗基板的模具侧上的应力施加结构中的至少一些，例如由至少部分地封装第一集成电路管芯的模制化合物施加的应力。 封装还可以电耦合到衬底。

公开(公告)号：US09418947B2

公开(公告)日：2016-08-16

申请号：US13406031

申请日：2012-02-27

申请人： Yu-Feng Chen ,  Chun-Hung Lin ,  Han-Ping Pu ,  Ming-Da Cheng ,  Kai-Chiang Wu

发明人： Yu-Feng Chen ,  Chun-Hung Lin ,  Han-Ping Pu ,  Ming-Da Cheng ,  Kai-Chiang Wu

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03334 ,  H01L2224/0384 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05075 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05571 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13078 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2924/206 ,  H01L2924/00 ,  H01L2224/05552

摘要： The described embodiments of mechanisms of forming connectors for package on package enable smaller connectors with finer pitch, which allow smaller package size and additional connections. The conductive elements on one package are partially embedded in the molding compound of the package to bond with contacts or metal pads on another package. By embedding the conductive elements, the conductive elements may be made smaller and there are is gaps between the conductive elements and the molding compound. A pitch of the connectors can be determined by adding a space margin to a maximum width of the connectors. Various types of contacts on the other package can be bonded to the conductive elements.

摘要翻译： 所描述的形成用于封装封装的连接器的机构的实施例使得具有更细间距的较小连接器能够实现更小的封装尺寸和附加的连接。 一个封装上的导电元件部分地嵌入封装的模制化合物中，以与另一封装上的触点或金属焊盘结合。 通过嵌入导电元件，可以使导电元件更小，并且在导电元件和模塑料之间存在间隙。 可以通过将连接器的最大宽度添加空间余量来确定连接器的间距。 另一个封装上的各种类型的触点可以结合到导电元件上。

公开(公告)号：US08510564B2

公开(公告)日：2013-08-13

申请号：US12852209

申请日：2010-08-06

申请人： David J. Nicholson ,  David Lewis Fisher ,  Michael D. Ritche ,  Chun-Hung Lin ,  Christopher B. Dove ,  Kavitha Radhakrishnan

发明人： David J. Nicholson ,  David Lewis Fisher ,  Michael D. Ritche ,  Chun-Hung Lin ,  Christopher B. Dove ,  Kavitha Radhakrishnan

IPC分类号： H04L9/32

CPC分类号： H04L63/0815 ,  H04L63/0876 ,  H04L63/126

摘要： Embodiments are directed to establishing the integrity of a portion of data on at least one level of a plurality of network stack levels and automatically continuing an established federation relationship between at least two federation computer systems. In an embodiment, a first federation computer system receives a digital signature corresponding to a computer system signed by a digital signature which includes the computer system's identity and other federation relationship information configured to establish a trusted federation relationship between a first federation computer system and a second federation computer system. The first federation computer system attempts to validate the received digital signature at a first level of a network stack and determines that the validation at the first network stack layer was unsuccessful. The first federation computer system then validates the received digital signature at a second, different level of the network stack.

摘要翻译： 实施例涉及在多个网络堆栈级别的至少一个级别上建立数据的一部分的完整性，并且自动地在至少两个联合计算机系统之间继续建立的联合关系。 在一个实施例中，第一联合计算机系统接收与由数字签名签名的计算机系统相对应的数字签名，数字签名包括计算机系统的身份和其他联合关系信息，其被配置为在第一联合计算机系统和第二联合计算机系统之间建立信任的联合关系 联合计算机系统。 第一联合计算机系统尝试在网络堆栈的第一级验证接收到的数字签名，并确定第一网络堆栈层的验证不成功。 第一联合计算机系统然后在网络堆栈的第二个不同级别验证所接收的数字签名。