公开(公告)号：US07595228B2

公开(公告)日：2009-09-29

申请号：US11233177

申请日：2005-09-23

申请人： Tomoyuki Abe ,  Yasuo Yamagishi

发明人： Tomoyuki Abe ,  Yasuo Yamagishi

IPC分类号： H01L21/70 ,  H01L21/98

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/13 ,  H01L24/16 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/10165 ,  H01L2224/1182 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73203 ,  H01L2224/81007 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K3/3436 ,  H05K3/3489 ,  H05K3/3494 ,  H05K3/4682 ,  H05K2203/0475 ,  H05K2203/111 ,  Y02P70/613 ,  H01L2224/0401

摘要： A method for manufacturing an electronic component-mounted board (X) includes a temperature raising step for heating an electronic component (30A), with a solder bump electrode (31) containing a solder material, to a first temperature higher than the melting point of the solder material, while also heating a wiring board (X′), with an electrode section (21) corresponding to the solder bump electrode (31), to a second temperature lower than the first temperature. The method further includes a joining step for joining the solder bump electrode (31) and the electrode section (21) by pressing the electronic component (30A) against the wiring board (X′), with the solder bump electrodes (31) and the electrode sections (21) abutting against each other.

摘要翻译： 一种电子部件安装板（X）的制造方法，包括：将包含焊料材料的焊料凸块电极（31）加热到高于熔点的第一温度的电子部件（30A）的升温工序， 焊料材料，同时将与焊料凸块电极（31）相对应的电极部分（21）加热到低于第一温度的第二温度的布线板（X'）。 该方法还包括通过用焊料凸块电极（31）和焊料凸块电极（31）将电子部件（30A）压靠在布线板（X'）上而将焊料凸块电极（31）和电极部分（21） 电极部分（21）彼此抵靠。

公开(公告)号：US07550366B2

公开(公告)日：2009-06-23

申请号：US11293663

申请日：2005-12-02

申请人： Tadatomo Suga ,  Mohammad Matiar Rahman Howlader ,  Tomoyuki Abe

发明人： Tadatomo Suga ,  Mohammad Matiar Rahman Howlader ,  Tomoyuki Abe

IPC分类号： H01L21/30

CPC分类号： H01L21/187 ,  H01L24/27 ,  H01L24/30 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/09701

摘要： A method for bonding of substrates has a steps of irradiating surfaces of the substrates respectively in a vacuum with both an inert gas beam and a metal beam thereby forming island shaped thin metal films on the surfaces of the substrates, and surface-activated bonding of the substrates through the island shaped thin metal films by contacting the surfaces of the substrates each other.

摘要翻译： 基板的接合方法具有分别在惰性气体束和金属梁两者的真空中照射基板的表面的步骤，从而在基板的表面上形成岛状薄金属膜，并且将表面激活的 通过使基板的表面彼此接触而穿过岛状薄金属膜的基板。

公开(公告)号：US20080192453A1

公开(公告)日：2008-08-14

申请号：US12099450

申请日：2008-04-08

申请人： Masateru Koide ,  Tomoyuki Abe

发明人： Masateru Koide ,  Tomoyuki Abe

IPC分类号： H05K1/14 ,  H05K3/36

CPC分类号： H05K3/4688 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/462 ,  H05K3/4641 ,  H05K2203/1189 ,  Y10T29/49126

摘要： According to an aspect of an embodiment, a multilayer interconnection substrate comprises a resin substrate layer comprising a first insulating layer made of a resin, and a first interconnection layer made of a conductive material, a ceramic substrate layer comprising a second insulating layer made of a ceramic, and a second interconnection layer made of a conductive material, a mechanically bonding layer mechanically bonding the resin substrate layer and the ceramic substrate layer which are laminated, and an electrically bonding member penetrating the mechanically bonding layer and electrically bonding the resin substrate layer and the ceramic substrate layer.

摘要翻译： 根据实施例的一个方面，多层互连基板包括树脂基板层，该树脂基板层包括由树脂制成的第一绝缘层和由导电材料制成的第一互连层，陶瓷基板层包括由 陶瓷和由导电材料制成的第二互连层，机械粘合层机械粘合树脂基板层和陶瓷基板层;以及电接合构件，其穿透机械接合层并电连接树脂基板层和 陶瓷基板层。

公开(公告)号：US20070232059A1

公开(公告)日：2007-10-04

申请号：US11474453

申请日：2006-06-26

申请人： Tomoyuki Abe

发明人： Tomoyuki Abe

IPC分类号： H01L21/4763 ,  H01L23/48

CPC分类号： H05K3/4614 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/3473 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0215 ,  H05K2201/10378 ,  H01L2924/00

摘要： A multilayer interconnection substrate is disclosed that includes a multilayer interconnection layer having at least a first interconnection layer and a second interconnection layer stacked with an insulating layer provided therebetween, and a connection via configured to electrically connect the first interconnection layer and the second interconnection layer. The connection via includes an internal conductor and a metal film covering the internal conductor. The internal conductor is an aggregate of metal particles.

摘要翻译： 公开了一种多层互连衬底，其包括具有至少第一互连层和层叠有设置在其间的绝缘层的第二互连层的多层互连层，以及经配置以电连接第一互连层和第二互连层的连接通孔。 连接通孔包括内部导体和覆盖内部导体的金属膜。 内部导体是金属颗粒的聚集体。

公开(公告)号：US20070222085A1

公开(公告)日：2007-09-27

申请号：US11483527

申请日：2006-07-11

申请人： Tomoyuki Abe ,  Shinya Iijima

发明人： Tomoyuki Abe ,  Shinya Iijima

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05085 ,  H01L2224/05567 ,  H01L2224/1134 ,  H01L2224/13012 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/73203 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor device includes a mount substrate and a semiconductor chip mounted upon the mount substrate via a metal bump, wherein metal bump includes an inner part joined to the semiconductor chip and an outer part covering the inner part, the outer part having an increased hardness as compared with the inner part.

摘要翻译： 半导体器件包括安装基板和通过金属凸块安装在安装基板上的半导体芯片，其中金属凸块包括连接到半导体芯片的内部部分和覆盖内部部分的外部部分，外部部件具有增加的硬度 与内部相比。

公开(公告)号：US07248222B2

公开(公告)日：2007-07-24

申请号：US11167568

申请日：2005-06-28

申请人： Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

发明人： Shinya Iijima ,  Tomoyuki Abe ,  Nobuyuki Hayashi ,  Yoji Ohashi ,  Toshihiro Shimura

IPC分类号： H01Q1/38

CPC分类号： G01S7/032 ,  G01S13/931 ,  H01L23/552 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1903 ,  H01L2924/19105 ,  H01L2924/3011

摘要： A high-frequency module includes a stiffener (a support substrate), a resin base member of which one surface is fixed to the stiffener, a first conductive pattern formed on said one surface of the resin base member, a second conductive pattern formed on the other surface of the resin base member for constituting a waveguide in combination with the first conductive pattern to pass a high-frequency signal through the resin base member and including a window for allowing the high-frequency signal to pass therethrough, a cap for covering a semiconductor element and for absorbing or reflecting the high-frequency signal, an adopter (a waveguide tube) fixed onto the second conductive pattern such that one open end thereof surrounds the window, and an antenna fixed to the other open end of the adaptor.

摘要翻译： 高频模块包括加强件（支撑基板），一个表面固定在加强件上的树脂基底部件，形成在树脂基底部件的一个表面上的第一导电图案，形成在第二导电图案上的第二导电图案 用于与第一导电图案组合的用于构成波导的树脂基底构件的另一表面，以使高频信号通过树脂基底，并且包括用于允许高频信号通过的窗口，用于覆盖 半导体元件，用于吸收或反射高频信号，固定在第二导电图案上的采用者（波导管），使得其一个开口端围绕窗口，以及固定到适配器的另一开口端的天线。

公开(公告)号：US20070077391A1

公开(公告)日：2007-04-05

申请号：US11339511

申请日：2006-01-26

申请人： Keishiro Okamoto ,  Mamoru Kurashina ,  Tomoyuki Abe

发明人： Keishiro Okamoto ,  Mamoru Kurashina ,  Tomoyuki Abe

IPC分类号： B32B5/26 ,  B32B3/12 ,  B32B7/02

CPC分类号： B32B5/26 ,  B32B3/02 ,  B32B5/024 ,  B32B7/02 ,  B32B27/08 ,  B32B27/12 ,  B32B27/281 ,  B32B2250/05 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/308 ,  B32B2307/734 ,  B32B2457/00 ,  H01L2924/0002 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0323 ,  H05K2201/068 ,  Y10T428/24149 ,  Y10T428/24942 ,  Y10T428/249923 ,  Y10T428/24994 ,  Y10T428/249945 ,  Y10T442/643 ,  Y10T442/659 ,  Y10T442/668 ,  Y10T442/696 ,  Y10T442/697 ,  H01L2924/00

摘要： A stack of 50 layers of a first pitch-base carbon fiber sheet is formed, two sets of stack each having two second pitch-base carbon fiber sheets stacked therein are fabricated. At this time, the second carbon fiber sheets have a thermal expansion coefficient larger than that of the first carbon fiber sheet. Next, the stack of the first carbon fiber sheet is then held between two sets of stack of the second carbon fiber sheets. The stack of the first and second carbon fiber sheets are then impregnated with an epoxy-base resin composition and the resin is solidified. As a result a prepreg composed of the first and second carbon fiber sheets and the resin component composed of the epoxy-base resin composition is obtained. Thereafter, interconnections and the like are then formed on the prepreg, to thereby complete a multilevel interconnection board.

摘要翻译： 形成50层第一沥青基碳纤维片的叠层，制成两组堆叠在其中的两个第二沥青基碳纤维片。 此时，第二碳纤维片的热膨胀系数大于第一碳纤维片的热膨胀系数。 接下来，将第一碳纤维片的叠层保持在两组第二碳纤维片之间。 然后将第一和第二碳纤维片材的叠层用环氧树脂基树脂组合物浸渍，并使树脂固化。 结果得到由第一和第二碳纤维片材构成的预浸料和由环氧基树脂组合物构成的树脂组分。 此后，在预浸料坯上形成互连等，从而完成多层互连板。

公开(公告)号：US20060051895A1

公开(公告)日：2006-03-09

申请号：US11233177

申请日：2005-09-23

申请人： Tomoyuki Abe ,  Yasuo Yamagishi

发明人： Tomoyuki Abe ,  Yasuo Yamagishi

IPC分类号： H01L21/48 ,  H01L21/50 ,  H01L21/4763

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/13 ,  H01L24/16 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/10165 ,  H01L2224/1182 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73203 ,  H01L2224/81007 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K3/3436 ,  H05K3/3489 ,  H05K3/3494 ,  H05K3/4682 ,  H05K2203/0475 ,  H05K2203/111 ,  Y02P70/613 ,  H01L2224/0401

摘要： A method for manufacturing an electronic component-mounted board (X) includes a temperature raising step for heating an electronic component (30A), with a solder bump electrode (31) containing a solder material, to a first temperature higher than the melting point of the solder material, while also heating a wiring board (X′), with an electrode section (21) corresponding to the solder bump electrode (31), to a second temperature lower than the first temperature. The method further includes a joining step for joining the solder bump electrode (31) and the electrode section (21) by pressing the electronic component (30A) against the wiring board (X′), with the solder bump electrodes (31) and the electrode sections (21) abutting against each other.

摘要翻译： 一种电子元件安装板（X）的制造方法，其特征在于，具备将包含焊锡材料的焊料凸块电极（31）加热至高于熔点的第一温度的电子部件（30A）的升温工序 的焊料，同时将与焊料凸块电极（31）对应的电极部分（21）加热到低于第一温度的第二温度的布线板（X'）。 该方法还包括一个接合步骤，用焊料凸块电极（31）和焊料凸块电极（31）将焊料凸块电极（31）和电极部分（21）压接在电路板（30A） 电极部分（21）彼此抵靠。

公开(公告)号：US20050112748A1

公开(公告)日：2005-05-26

申请号：US10490381

申请日：2001-10-03

申请人： Takeshi Endo ,  Tomoyuki Abe ,  Hiroaki Miki ,  Tadaomi Takenawa

发明人： Takeshi Endo ,  Tomoyuki Abe ,  Hiroaki Miki ,  Tadaomi Takenawa

IPC分类号： A61K38/00 ,  A61P25/00 ,  A61P25/28 ,  A61P43/00 ,  C12N9/16 ,  C12N9/22 ,  A61K38/46 ,  A61K48/00

CPC分类号： C12N9/16 ,  A61K38/00

摘要： Small GTPase RhoT having an amino acid sequence represented by SEQ ID NO: 1, or an amino acid sequence derived from this amino acid sequence by the substitution, deletion, addition, or insertion of one or more amino acid residues; its gene; and drugs containing the same. RhoT has an excellent effect of forming and/or extending neurites.

摘要翻译： 具有由SEQ ID NO：1表示的氨基酸序列的小GTP酶RhoT或通过取代，缺失，添加或插入一个或多个氨基酸残基而衍生自该氨基酸序列的氨基酸序列; 其基因; 和含有相同的药物。 RhoT具有形成和/或延伸神经突的极好效果。