-
71.发明授权Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die 有权在凸块和半导体管芯之间的密封剂上形成具有RDL互连的晶片级封装的方法公开(公告)号：US07888181B2
公开(公告)日：2011-02-15
申请号：US12235000
申请日：2008-09-22
CPC分类号： H01L23/5389 , H01L21/565 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L24/19 , H01L24/24 , H01L25/105 , H01L25/50 , H01L2224/24226 , H01L2224/73267 , H01L2224/82005 , H01L2224/82031 , H01L2224/82039 , H01L2224/92244 , H01L2224/96 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00
摘要： A semiconductor device is made by providing a metal substrate for supporting the semiconductor device. Solder bumps are connected to the substrate. In one embodiment, a conductive material is deposited over the substrate and is reflowed to form the solder bumps. A semiconductor die is mounted to the substrate using a die attach adhesive. The semiconductor die has a plurality of contact pads formed over a surface of the semiconductor die. An encapsulant material is deposited over the solder bumps and the semiconductor die. The encapsulant is etched to expose the contact pads of the semiconductor die. A first redistribution layer (RDL) is formed over the encapsulant to connect each contact pad of the semiconductor die to one of the solder bumps. The substrate is removed to expose the die attach adhesive and a bottom surface of the solder bumps.
摘要翻译： 通过设置用于支撑半导体器件的金属基板来制造半导体器件。 焊接凸块连接到基板。 在一个实施例中，导电材料沉积在衬底上并被回流以形成焊料凸块。 使用芯片附着粘合剂将半导体管芯安装到基板上。 半导体管芯具有形成在半导体管芯的表面上的多个接触焊盘。 在焊料凸块和半导体管芯上沉积密封材料。 蚀刻密封剂以暴露半导体管芯的接触焊盘。 第一再分配层（RDL）形成在密封剂上方以将半导体管芯的每个接触焊盘连接到焊料凸块之一。 去除衬底以暴露芯片附着粘合剂和焊料凸块的底表面。
-
公开(公告)号：US20090008761A1
公开(公告)日：2009-01-08
申请号：US11773886
申请日：2007-07-05
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/3107 , H01L23/3128 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/4826 , H01L2224/4846 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48482 , H01L2224/49111 , H01L2224/49112 , H01L2224/49171 , H01L2224/49174 , H01L2224/4942 , H01L2224/49433 , H01L2224/73215 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/8518 , H01L2224/85186 , H01L2224/85399 , H01L2224/85986 , H01L2225/06506 , H01L2924/00014 , H01L2924/01033 , H01L2924/01076 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2924/00011 , H01L2224/4554
摘要： An integrated circuit package system includes: forming a flex bump over an integrated circuit device structure, the flex bump having both a base portion and an offset portion over the base portion; forming a first ball bond of a first internal interconnect over the offset portion; and encapsulating the integrated circuit device structure, the flex bump, and the first internal interconnect.
摘要翻译： 集成电路封装系统包括：在集成电路器件结构上形成柔性突起，所述柔性突起在基部上方具有基部和偏移部分; 在所述偏移部分上形成第一内部互连的第一球接合; 并封装集成电路器件结构，柔性突起和第一内部互连。
-
公开(公告)号：US07060536B2
公开(公告)日：2006-06-13
申请号：US10846171
申请日：2004-05-13
IPC分类号： H01L21/50
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/85207 , H01L2224/92247 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor package is provided. A leadframe including a die attach paddle, a number of inner leads, and a number of outer leads, and a number of extended lead tips on the number of outer leads. The inner edges of the number of extended lead tips are in substantial alignment with the inner edges of the number of inner leads. A die is attached to the die attach paddle. A number of bonding wires is used to connect the die to the number of inner leads and the extended lead tips on the number of outer leads, and an encapsulant is formed over the leadframe and the die.
摘要翻译： 提供半导体封装。 引线框架包括管芯连接板，多个内部引线和多个外部引线，以及多个外部引线的多个延伸的引线端。 延伸引线头的数量的内边缘与内引线数量的内边缘基本对准。 模具附接到管芯附接板上。 多个接合线用于将管芯连接到外引线数目的内引线数量和延长引线端头，并且在引线框架和管芯上形成密封剂。
-
公开(公告)号：US09129971B2
公开(公告)日：2015-09-08
申请号：US12985559
申请日：2011-01-06
IPC分类号： H01L23/31 , H01L23/48 , H01L23/538 , H01L21/683 , H01L23/498 , H01L23/00 , H01L25/10 , H01L25/00 , H01L21/56
CPC分类号： H01L23/5389 , H01L21/565 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L24/19 , H01L24/24 , H01L25/105 , H01L25/50 , H01L2224/24226 , H01L2224/73267 , H01L2224/82005 , H01L2224/82031 , H01L2224/82039 , H01L2224/92244 , H01L2224/96 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00
摘要： A semiconductor device includes a semiconductor die having contact pads disposed over a surface of the semiconductor die, a die attach adhesive layer disposed under the semiconductor die, and an encapsulant material disposed around and over the semiconductor die. The semiconductor device further includes bumps disposed in the encapsulant material around a perimeter of the semiconductor die. The bumps are partially enclosed by the encapsulant material. The semiconductor device further comprises first vias disposed in the encapsulant. The first vias expose surfaces of the contact pads. The semiconductor device further includes a first redistribution layer (RDL) disposed over the encapsulant and in the first vias, and a second RDL disposed under the encapsulant material and the die attach adhesive layer. The first RDL electrically connects each contact pad of the semiconductor die to one of the bumps, and the second RDL is electrically connected to one of the bumps.
摘要翻译： 半导体器件包括具有设置在半导体管芯的表面上的接触焊盘的半导体管芯，设置在半导体管芯下方的管芯附着粘合剂层，以及设置在半导体管芯周围和上方的密封材料。 半导体器件还包括围绕半导体管芯的周边设置在密封剂材料中的凸块。 凸起部分被密封剂材料封闭。 半导体器件还包括设置在密封剂中的第一通孔。 第一个通孔暴露接触垫的表面。 半导体器件还包括设置在密封剂和第一通孔中的第一再分配层（RDL），以及设置在密封剂材料下方的第二RDL和管芯附着粘合剂层。 第一RDL将半导体管芯的每个接触焊盘电连接到凸块中的一个，并且第二RDL电连接到凸块之一。
-
公开(公告)号：US08395251B2
公开(公告)日：2013-03-12
申请号：US11382983
申请日：2006-05-12
IPC分类号： H01L23/043
CPC分类号： H01L23/49555 , H01L23/3107 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2924/00014 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package to package stacking system is provided including providing a first integrated circuit package, having a configured leadframe, providing a second integrated circuit package, having the configured leadframe, and forming an integrated circuit package pair by electrically connecting the configured leadframe of the first integrated circuit package to the configured leadframe of the second integrated circuit package.
摘要翻译： 提供集成电路封装到封装堆叠系统，包括提供第一集成电路封装，具有构造的引线框架，提供具有所配置的引线框架的第二集成电路封装，以及通过电连接所配置的引线框，形成集成电路封装对 第一集成电路封装到第二集成电路封装的配置的引线框架。
-
公开(公告)号：US20100140766A1
公开(公告)日：2010-06-10
申请号：US12709073
申请日：2010-02-19
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49551 , H01L23/3107 , H01L23/4951 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L29/0657 , H01L2224/16 , H01L2224/16245 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.
摘要翻译： 提供一种用于制造大型封装结构的方法，其中引线框架的至少多个引线脚的至少部分引线电绝缘。 模具位于电绝缘引线上。 裸片与至少多个引线笔电连接。
-
公开(公告)号：US07700404B2
公开(公告)日：2010-04-20
申请号：US11536544
申请日：2006-09-28
IPC分类号： H01L23/48
CPC分类号： H01L23/49551 , H01L23/3107 , H01L23/4951 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L29/0657 , H01L2224/16 , H01L2224/16245 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.
摘要翻译： 提供一种用于制造大型封装结构的方法，其中引线框架的至少多个引线脚的至少部分引线电绝缘。 模具位于电绝缘引线上。 裸片与至少多个引线笔电连接。
-
78.发明申请Semiconductor Device and Method of Forming a Wafer Level Package with Bump Interconnection 有权半导体器件和形成具有凹凸互连的晶片级封装的方法公开(公告)号：US20100072618A1
公开(公告)日：2010-03-25
申请号：US12235000
申请日：2008-09-22
CPC分类号： H01L23/5389 , H01L21/565 , H01L21/6835 , H01L23/3128 , H01L23/49827 , H01L24/19 , H01L24/24 , H01L25/105 , H01L25/50 , H01L2224/24226 , H01L2224/73267 , H01L2224/82005 , H01L2224/82031 , H01L2224/82039 , H01L2224/92244 , H01L2224/96 , H01L2225/1035 , H01L2225/1058 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/00
摘要： A semiconductor device is made by providing a metal substrate for supporting the semiconductor device. Solder bumps are connected to the substrate. In one embodiment, a conductive material is deposited over the substrate and is reflowed to form the solder bumps. A semiconductor die is mounted to the substrate using a die attach adhesive. The semiconductor die has a plurality of contact pads formed over a surface of the semiconductor die. An encapsulant material is deposited over the solder bumps and the semiconductor die. The encapsulant is etched to expose the contact pads of the semiconductor die. A first redistribution layer (RDL) is formed over the encapsulant to connect each contact pad of the semiconductor die to one of the solder bumps. The substrate is removed to expose the die attach adhesive and a bottom surface of the solder bumps.
摘要翻译： 通过设置用于支撑半导体器件的金属基板来制造半导体器件。 焊接凸块连接到基板。 在一个实施例中，导电材料沉积在衬底上并被回流以形成焊料凸块。 使用芯片附着粘合剂将半导体管芯安装到基板上。 半导体管芯具有形成在半导体管芯的表面上的多个接触焊盘。 在焊料凸块和半导体管芯上沉积密封材料。 蚀刻密封剂以暴露半导体管芯的接触焊盘。 第一再分配层（RDL）形成在密封剂上方以将半导体管芯的每个接触焊盘连接到焊料凸块之一。 去除衬底以暴露芯片附着粘合剂和焊料凸块的底表面。
-
公开(公告)号：US07479692B2
公开(公告)日：2009-01-20
申请号：US11558413
申请日：2006-11-09
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L23/49548 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： An integrated circuit package system is provided including forming a paddle, forming a ring with a recess in the paddle, mounting a device in the recess, forming a slot in the ring, and mounting a heat sink in the slot over the device.
摘要翻译： 提供了一种集成电路封装系统，包括形成桨叶，在桨中形成具有凹槽的环，将器件安装在凹槽中，在环中形成槽，以及将散热器安装在器件上的槽中。
-
公开(公告)号：US20080237816A1
公开(公告)日：2008-10-02
申请号：US11694921
申请日：2007-03-30
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L21/565 , H01L23/3107 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/14 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit package system is provided including forming a lead frame includes forming a mold gate, providing a first surface, and providing a second surface opposite the first surface; and forming angled gate sides facing each other in the mold gate between the first surface and the second surface.
摘要翻译： 提供一种集成电路封装系统，包括形成引线框架，包括形成模具门，提供第一表面，并提供与第一表面相对的第二表面; 以及在所述第一表面和所述第二表面之间的模具浇口中形成彼此相对的成角度的浇口侧。
-
-
-
-
-
-
-
-
-
搜索结果
102 条记录 (耗时 0.03 秒)
