摘要:
A semiconductor memory device has a plurality of memory cells in an array, into which the memory cells data is writable, and which can subsequently be read. Each memory cell has a switching element with one terminal connected to a bit line of the array another terminal connected to at least one ferroelectric capacitor, and a control terminal connected to a word line. The cell may then be operated to detect the change in polarization of the ferroelectric capacitor when a voltage is applied which is not sufficient to cause a change of state of the ferroelectric capacitor. Alternatively, a ferroelectric capacitor and a capacitor other than a ferroelectric capacitor is connected to the switching element. In a further alternative, a plurality of ferroelectric capacitors are connected to the switching element, so that different data are writable into each.
摘要:
A welded metal container for a sheath 1 or 1A of gas insulated switch gear comprises a trunk pipe 2, 21 and a branch pipes 3, 31, 32 welded to the trunk pipe 2,21 by arc welding A or laser beam welding LB and flanges welded to the each end portion of the trunk pipe 2, 21 and branch pipes 3, 31, 32 by the laser beam welding. After the arc welding A, the ends of trunk pipe 1, 21 and branch pipes 3, 31, 32 are machined precisely and flanges 4a, 4b, 4c, 4d, 4f and 4g are welded to the end portions of the trunk pipe 2, 21 and branch pipes 3, 31, 32.
摘要:
A method for manufacturing a welded metal container by first arc welding a branch pipe to a trunk pipe. The arc welding of the pipes together causes both of the pipes to be thermally deformed. The end surfaces of the pipes are then cut by a laser cutting or mechanical cutting process so that the ends of the trunk pipe are in parallel and perpendicular to the end of the branch pipe. Subsequently flanges are laser welded to the ends of the pipes without further thermally deforming the pipes. The metal container made by this process can be used as a sheath for a gas insulated switch gear.
摘要:
A semiconductor integrated logic circuit is provided which includes a plurality of logic gates each having a first input terminal for respectively receiving first input signals, wherein each of the logic gates is coupled to a common node. In one embodiment, first and second switching elements are also coupled to the common node. The first and second switching elements are both coupled to a second input terminal for receiving a second input signal which is common to the plurality of logic gates, and both operate complementary to one another in response to the second input signal. This arrangement is particularly effective for decoders in semiconductor memory circuits which use a common NMOS to receive one input for a plurality of logic decoder gates. An improved read/write arrangement is also provided for semiconductor memory circuits which includes circuitry to prevent connection of a common read line to the data lines during the writing operation. This enhances the writing speed by removing the load of the common read line during writing.
摘要:
A high-speed memory employing the pipeline technique is disclosed, in which the minimum operating cycle time is reduced by use of a latch circuit for a small signal using a bipolar transistor. A small-signal latch circuit operating at a signal smaller than an output signal level is inserted between an amplifier circuit for amplifying the data held in a memory cell circuit and an output buffer circuit. A switch signal is also interposed between the latch circuit and the amplifier circuit, thereby shortening the cycle time.
摘要:
Disclosed is a semiconductor device, such as a semiconductor memory device, having structure wherein invasion of minority carriers from the semiconductor substrate into components of the device, formed on the substrate, can be avoided. The semiconductor memory device can be an SRAM or DRAM, for example, and includes a memory array and peripheral circuit on a substrate. In one aspect of the present invention, a buried layer of the same conductivity type as that of the substrate, but with a higher impurity concentration than that of the substrate, is provided beneath at least one of the peripheral circuit and memory array. A further region can extend from the buried layer, for example, to the surface of the semiconductor substrate, the buried layer and further region in combination acting as a shield to prevent minority carriers from penetrating to the device elements. As a second aspect of the present invention, first carrier absorbing areas (to absorb minority carriers) are located between the memory array and the switching circuit of the peripheral circuit, and second carrier absorbing areas are provided to surround input protective elements of the device. As a third embodiment of the present invention, a plurality of isolation regions of the same conductivity type are provided, with unequal voltages applied to these isolation regions, or unequal voltages applied to the substrate, on the one hand, and to these isolation regions, on the other.
摘要:
A method for rewriting four defect management areas on an optical disk according to an ECMA standard is performed by means of deleting an old data which has been recorded on the respective defect management areas and then sequentially writing down a new data on respective defect management areas.
摘要:
A semiconductor integrated circuit comprising first n-channel MISFETs constituting the memory cells of a storage system, second n-channel MISFETs constituting the peripheral circuits of the storage system, and third n-channel MISFETs constituting the output circuit among the peripheral circuits. The respective threshold voltages of the first n-channel MISFETs, the second n-channel MISFETs and the third n-channel MISFETs are decreased in that order when the respective gate lengths of those MISFETs are substantially the same.