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公开(公告)号：US20170231095A1
公开(公告)日：2017-08-10
申请号：US15163045
申请日：2016-05-24
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chia-Yang Chen , Ying-Wei Lu , Jyun-Yuan Jhang , Ming-Fan Tsai
IPC: H05K1/18
CPC classification number: H05K1/185 , G06K19/07777 , H01L25/00 , H01L2224/16225 , H01L2224/48091 , H01L2924/1815 , H05K1/165 , H05K1/186 , H05K3/0014 , H05K3/107 , H05K3/207 , H05K3/4602 , H05K3/465 , H05K2201/09118 , H05K2201/10098 , H05K2203/1327 , H01L2924/00014
Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.
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公开(公告)号：US20170187117A1
公开(公告)日：2017-06-29
申请号：US15455664
申请日：2017-03-10
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Heng-Cheng Chu , Cheng-Yu Chiang
CPC classification number: H01Q9/0421 , H01Q1/38 , H01Q1/40
Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.
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公开(公告)号：US09673151B2
公开(公告)日：2017-06-06
申请号：US14837604
申请日：2015-08-27
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Hao-Ju Fang , Hsin-Lung Chung , Cho-Hsin Chang , Tsung-Hsien Tsai , Chia-Yang Chen , Chun-Chi Ke
IPC: H01L23/552 , H01L21/48 , H01L21/54 , H01L21/56 , H01L21/78 , H01L23/16 , H01L23/31 , H01L25/065 , H01L23/498
CPC classification number: H01L23/552 , H01L21/4853 , H01L21/54 , H01L21/561 , H01L21/563 , H01L21/78 , H01L23/16 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/49811 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45099
Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.
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公开(公告)号：US20160300660A1
公开(公告)日：2016-10-13
申请号：US14718126
申请日：2015-05-21
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chi-Pin Tsai , Ming-Fan Tsai , Jyun-Yuan Jhang , Chi-Liang Shih
CPC classification number: H01F27/022 , H01F17/062 , H01F2027/2814 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/15311 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
Abstract: An electronic device is provided, which includes: a magnetically conductive element having at least a through hole; a conductor structure formed on the magnetically conductive element and in the through hole; and a base body encapsulating the magnetically conductive element and the conductor structure, thereby allowing the electronic device to generate a higher magnetic flux and thus cause an increase in inductance.
Abstract translation: 提供一种电子器件，其包括：具有至少一个通孔的导磁元件; 形成在所述导磁元件和所述通孔中的导体结构; 以及基体，其密封导电元件和导体结构，从而允许电子器件产生较高的磁通量，从而引起电感的增加。
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公开(公告)号：US20150263421A1
公开(公告)日：2015-09-17
申请号：US14290121
申请日：2014-05-29
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Chih-Hsien Chiu , Tsung-Hsien Tsai , Chi-Pin Tsai , Chih-Ming Cheng
CPC classification number: H01Q1/526 , H01L23/552 , H01L23/66 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/3025 , H01Q1/42 , H01Q9/42 , H01Q23/00 , Y10T29/49018 , H01L2924/00014
Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure provided on the substrate, wherein the antenna structure has at least a supporting portion and an extending portion supported by the supporting portion over the substrate and surrounding the electronic element; and a shielding structure provided on the substrate and overlapping with the antenna structure, thereby saving the surface area of the substrate so as to meet the miniaturization requirement of the electronic package.
Abstract translation: 提供电子封装，其包括：基板; 至少设置在所述基板上的电子元件; 设置在所述基板上的天线结构，其中所述天线结构至少具有支撑部分和由所述支撑部分支撑在所述基板上并围绕所述电子元件的延伸部分; 以及设置在基板上并与天线结构重叠的屏蔽结构，从而节省了基板的表面积，以满足电子封装的小型化要求。
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Patent Agency Ranking
公开(公告)号：US20150162661A1
公开(公告)日：2015-06-11
申请号：US14151184
申请日：2014-01-09
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Chih-Hsien Chiu , Heng-Cheng Chu , Cheng-Yu Chiang
IPC: H01Q9/04
CPC classification number: H01Q9/0421 , H01Q1/38 , H01Q1/40
Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.
Abstract translation: 提供了一种电子部件，其包括具有相对的第一和第二表面的基板和与基板结合的天线结构。 所述天线结构具有至少第一延伸部分，设置在所述基板的第一表面上，至少第二延伸部分设置在所述基板的第二表面上，以及多个连接部分，设置在所述基板中，用于将所述第一延伸部分 部分和第二延伸部分。 连接部分中的任一相邻部分通过第一延伸部分和第二延伸部分中的一个连接。 这样，天线结构变成三维的。 本发明不需要在基板上设置用于设置天线结构的附加区域，从而减小基板的宽度以满足电子部件的小型化要求。
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公开(公告)号：US12230590B2
公开(公告)日：2025-02-18
申请号：US18097847
申请日：2023-01-17
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Chih-Hsien Chiu , Ko-Wei Chang
Abstract: An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
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公开(公告)号：US12100641B2
公开(公告)日：2024-09-24
申请号：US18223221
申请日：2023-07-18
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Chih-Hsien Chiu , Siang-Yu Lin , Wen-Jung Tsai , Chia-Yang Chen , Chien-Cheng Lin
IPC: H01L23/42 , H01L21/56 , H01L23/16 , H01L23/31 , H01L23/367
CPC classification number: H01L23/42 , H01L21/561 , H01L23/16 , H01L23/3128 , H01L23/367
Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.
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公开(公告)号：US20230360997A1
公开(公告)日：2023-11-09
申请号：US18223221
申请日：2023-07-18
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Chih-Hsien Chiu , Siang-Yu Lin , Wen-Jung Tsai , Chia-Yang Chen , Chien-Cheng Lin
IPC: H01L23/42 , H01L23/31 , H01L21/56 , H01L23/16 , H01L23/367
CPC classification number: H01L23/42 , H01L23/3128 , H01L21/561 , H01L23/16 , H01L23/367
Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.
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80.发明公开公开(公告)号：US20230282972A1
公开(公告)日：2023-09-07
申请号：US17748957
申请日：2022-05-19
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Shao-Tzu Tang , Chih-Hsien Chiu , Wen-Jung Tsai , Ko-Wei Chang , Chia-Chu LAI
Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.
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