公开(公告)号：US08735190B2

公开(公告)日：2014-05-27

申请号：US13946007

申请日：2013-07-19

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Ching-Yi Chen ,  Yu-Sheng Tang ,  Hao-Yu Yang ,  Hsin-Hung Chen ,  Tzu-Wen Shih

IPC: H01L21/00

CPC classification number: H01L33/58 ,  F21K9/64 ,  F21V13/02 ,  F21V13/14 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

Abstract translation: 半导体结构包括具有多个管芯区域的模块，设置在衬底上的多个发光器件，使得每个管芯区域包括一个发光器件，以及在该模块上的透镜板，并且粘附到 基材用胶。 透镜板包括多个微透镜，每个微透镜各自对应于一个裸片区域，并且在每个裸片区域中，胶水通过相应的一个微透镜提供一个发光器件的气密封装。 此外，作为透镜板的一部分包括磷光体。

公开(公告)号：US08722436B2

公开(公告)日：2014-05-13

申请号：US14088780

申请日：2013-11-25

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chyi Shyuan Chern ,  Hsin-Hsien Wu ,  Chih-Kuang Yu ,  Hung-Yi Kuo

IPC: H01L21/00

CPC classification number: H01L33/62 ,  H01L23/49513 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/08 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating.

Abstract translation: 一种发光二极管（LED）封装的方法包括将多个LED管芯耦合到子安装座上的对应焊盘。 具有容纳LED管芯的凹入凹槽的模具装置放置在子安装座上。 子载体，LED管芯和模具装置在热回流过程中被加热以将LED管芯接合到接合焊盘。 每个凹槽在加热期间基本上限制相对于接合焊盘的LED管芯的移位。

公开(公告)号：US08716731B2

公开(公告)日：2014-05-06

申请号：US13084135

申请日：2011-04-11

Applicant: Chiao-Wen Yeh ,  Ru-Shi Liu

Inventor： Chiao-Wen Yeh ,  Ru-Shi Liu

IPC: H01L33/44

CPC classification number: H05B33/14 ,  C09K11/0883 ,  C09K11/7728 ,  H01L33/502

Abstract: The present disclosure provides an illuminating system including a light emitting diode (LED); and a tunable luminescent material disposed approximate the light-emitting diode, wherein the tunable luminescent material includes alkaline earth metal (AE) and silicon aluminum nitride doped by a rare earth element (RE), formulated as (AE)Si6−pAlpN8, wherein p is a parameter defining a relative aluminum content in weight and p is greater than zero.

Abstract translation: 本公开提供了一种包括发光二极管（LED）的照明系统; 以及配置在发光二极管附近的可调发光材料，其中可调谐发光材料包括由稀土元素（RE）掺杂的碱土金属（AE）和氮化硅铝，其被配制为（AE）Si6-pAlpN8，其中p 是定义重量相对铝含量的参数，p大于零。

公开(公告)号：US08714778B2

公开(公告)日：2014-05-06

申请号：US13927421

申请日：2013-06-26

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Yu-Sheng Tang ,  Yi-Tsuo Wu

IPC: F21V33/00 ,  F21V9/00 ,  H05B37/02

CPC classification number: H01L33/60 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13091 ,  H05B33/0869 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An embodiment of the disclosure includes a LED module. A substrate is provided. A light sensor is positioned in the substrate. A LED chip is attached to the substrate. The LED chip has a first side and a second side. The second side is covered by an opaque layer with an opening. The opening is substantially aligned with the light sensor. The light sensor receives a light output emitting from the LED chip through the opening.

Abstract translation: 本公开的实施例包括LED模块。 提供基板。 光传感器位于基板中。 LED芯片附着在基板上。 LED芯片具有第一面和第二面。 第二面被具有开口的不透明层覆盖。 开口基本上与光传感器对准。 光传感器通过开口接收从LED芯片发出的光输出。

公开(公告)号：US08702278B2

公开(公告)日：2014-04-22

申请号：US13326766

申请日：2011-12-15

Applicant: Jin-Hua Wang ,  Hsueh-Hung Fu ,  Pei-Wen Ko ,  Chih-Hsuan Sun

Inventor： Jin-Hua Wang ,  Hsueh-Hung Fu ,  Pei-Wen Ko ,  Chih-Hsuan Sun

IPC: F21V29/00

CPC classification number: F21V17/02 ,  F21K9/20 ,  F21K9/60 ,  F21V5/007 ,  F21V13/04 ,  F21V29/74 ,  F21V29/75 ,  F21V29/763 ,  F21V29/83 ,  F21W2131/103 ,  F21Y2101/00 ,  F21Y2113/00 ,  F21Y2115/10 ,  Y02B20/72

Abstract: The present disclosure involves a street light. The street light includes a base, a lamp post coupled to the base, and a lamp head coupled to the lamp post. The lamp head includes a housing and a plurality of LED light modules disposed within the housing. The LED light modules are separate and independent from each other. Each LED light module includes an array of LED that serve as light sources for the lamp. Each LED light module also includes a heat sink that is thermally coupled to the LED. The heat sink is operable to dissipate heat generated by the LED during operation. Each LED light module also includes a thermally conductive cover having a plurality of openings. Each LED is aligned with and disposed within a respective one of the openings.

Abstract translation: 本公开涉及路灯。 路灯包括基座，连接到基座的灯柱和联接到灯柱的灯头。 灯头包括壳体和设置在壳体内的多个LED灯模块。 LED灯模块是独立的并且彼此独立。 每个LED灯模块包括用作灯的光源的LED阵列。 每个LED灯模块还包括热耦合到LED的散热器。 散热器可操作以在操作期间散发由LED产生的热量。 每个LED灯模块还包括具有多个开口的导热盖。 每个LED与相应的一个开口对齐并设置在其中。

公开(公告)号：US20140103372A1

公开(公告)日：2014-04-17

申请号：US14140973

申请日：2013-12-26

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Min Lin

IPC: H01L33/50

CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/505 ,  H01L2933/0041

Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.

Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，在胶带上设置多个LED。 粘合带设置在基板上。 在一些实施例中，衬底可以是玻璃衬底，硅衬底，陶瓷衬底和氮化镓衬底。 磷光体层被涂覆在多个LED上。 然后将磷光体层固化。 在荧光体层固化之后去除胶带和基材。 然后将替代胶带附接到多个LED。 然后在去除衬底之后，对多个LED进行切割处理。 然后可以将去除的衬底重新用于将来的LED封装工艺。

公开(公告)号：US20140091329A1

公开(公告)日：2014-04-03

申请号：US13629677

申请日：2012-09-28

Applicant: Hsiao-Wen Lee ,  Chi-Xiang Tseng ,  Yu-Sheng Tang ,  Jung-Tang Chu

Inventor： Hsiao-Wen Lee ,  Chi-Xiang Tseng ,  Yu-Sheng Tang ,  Jung-Tang Chu

IPC: H01L33/44

CPC classification number: H01L33/50 ,  F21K9/00 ,  F21K9/90 ,  F21S6/00 ,  F21V29/74 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board substrate. The lighting instrument includes a plurality of light-emitting diode (LED) dies disposed on the substrate. The LED dies are spaced apart from one another. Each LED die is covered with a respective individual phosphor coating that is coated around the LED die conformally. Due at least in part to the individual phosphor coatings, the LED dies and the lighting instrument may assume a substantially white appearance in an off state. The lighting instrument also includes an encapsulation structure disposed over the substrate. The encapsulation structure may be a diffuser cap that encapsulates the light-emitting dies within. A diffuser gel fills the space between the encapsulation structure and the LED dies.

Abstract translation: 本公开涉及一种照明器具。 照明器具包括板或基板，例如印刷电路板基板。 照明器具包括设置在基板上的多个发光二极管（LED）管芯。 LED管芯彼此间隔开。 每个LED管芯被相应的单独的磷光体涂层覆盖，所述磷光体涂层被保持在LED管周围。 至少部分地由于单独的磷光体涂层，LED管芯和照明器具可能在断开状态下呈现基本上白色的外观。 照明器具还包括设置在衬底上的封装结构。 封装结构可以是将发光管封装在其内的扩散器盖。 扩散器凝胶填充封装结构和LED管芯之间的空间。

公开(公告)号：US08680544B2

公开(公告)日：2014-03-25

申请号：US13307066

申请日：2011-11-30

Applicant: Chih-Lin Wang

Inventor： Chih-Lin Wang

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  F21K9/00 ,  F21S6/005 ,  F21V9/30 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure involves a lighting instrument. The lighting instrument includes a board or substrate, for example, a printed circuit board. The lighting instrument also includes a plurality of light-emitting devices disposed on the substrate. The light-emitting devices may be light-emitting diode (LED) dies. The LED dies belong to a plurality of different bins. The bins are categorized based on the light output performance of the LED dies. In some embodiments, the LED dies may be binned based on the wavelength or radiant flux of the light output. The LED dies are distributed on the substrate according to a predefined pattern based on their bins. In some embodiments, the LED dies are bin-mixed in an interleaving manner.

Abstract translation: 本公开涉及一种照明器具。 照明器具包括板或基板，例如印刷电路板。 照明器具还包括设置在基板上的多个发光器件。 发光装置可以是发光二极管（LED）管芯。 LED管芯属于多个不同的箱体。 基于LED芯片的光输出性能分类。 在一些实施例中，可以基于光输出的波长或辐射通量来分组LED管芯。 LED芯片根据其基于预定义的图案分布在基板上。 在一些实施例中，LED管芯以交错方式进行二进制混合。

公开(公告)号：US20140077224A1

公开(公告)日：2014-03-20

申请号：US13616415

申请日：2012-09-14

Applicant: Zhen-Yu Li ,  Chung-Pao Lin ,  Hsing-Kuo Hsia ,  Hao-Chung Kuo ,  Cindy Huichun Shu ,  Hsin-Chieh Huang

Inventor： Zhen-Yu Li ,  Chung-Pao Lin ,  Hsing-Kuo Hsia ,  Hao-Chung Kuo ,  Cindy Huichun Shu ,  Hsin-Chieh Huang

IPC: H01L29/12 ,  H01L33/02 ,  H01L21/20 ,  H01L29/165

CPC classification number: H01L33/0075 ,  B82Y20/00 ,  H01L21/02035 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/268 ,  H01L21/30604 ,  H01L29/0657 ,  H01L29/2003 ,  H01L29/205 ,  H01L29/66462 ,  H01L33/0025 ,  H01L33/0066 ,  H01L33/12 ,  H01L33/20 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0218 ,  H01S5/34333

Abstract: The present disclosure involves an apparatus. The apparatus includes a substrate having a front side a back side opposite the front side. The substrate includes a plurality of openings formed from the back side of the substrate. The openings collectively define a pattern on the back side of the substrate from a planar view. In some embodiments, the substrate is a silicon substrate or a silicon carbide substrate. Portions of the silicon substrate vertically aligned with the openings have vertical dimensions that vary from about 100 microns to about 300 microns. A III-V group compound layer is formed over the front side of the silicon substrate. The III-V group compound layer is a component of one of: a light-emitting diode (LED), a laser diode (LD), and a high-electron mobility transistor (HEMT).

Abstract translation: 本公开涉及一种装置。 该装置包括具有前侧与前侧相对的后侧的基板。 基板包括从基板的背面形成的多个开口。 这些开口从平面图中共同地在基板的背面上限定图案。 在一些实施例中，衬底是硅衬底或碳化硅衬底。 与开口垂直对准的硅衬底的部分具有约100微米至约300微米的垂直尺寸。 在硅衬底的正面上形成III-V族化合物层。 III-V族化合物层是发光二极管（LED），激光二极管（LD）和高电子迁移率晶体管（HEMT）之一的组分。

公开(公告)号：US08609446B2

公开(公告)日：2013-12-17

申请号：US13267025

申请日：2011-10-06

Applicant: Chyi Shyuan Chern ,  Hsin-Hsien Wu ,  Chih-Kuang Yu ,  Hung-Yi Kuo

Inventor： Chyi Shyuan Chern ,  Hsin-Hsien Wu ,  Chih-Kuang Yu ,  Hung-Yi Kuo

IPC: H01L21/00

CPC classification number: H01L33/62 ,  H01L23/49513 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/08 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating.

Abstract translation: 一种发光二极管（LED）封装的方法包括将多个LED管芯耦合到子安装座上的对应焊盘。 具有容纳LED管芯的凹入凹槽的模具装置放置在子安装座上。 子载体，LED管芯和模具装置在热回流过程中被加热以将LED管芯接合到接合焊盘。 每个凹槽在加热期间基本上限制相对于接合焊盘的LED管芯的移位。