公开(公告)号：US20180206333A1

公开(公告)日：2018-07-19

申请号：US15919620

申请日：2018-03-13

Applicant: International Business Machines Corporation

Inventor： Lei Shan

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/0231 ,  H05K1/183 ,  H05K1/184 ,  H05K3/305 ,  H05K3/3405 ,  H05K3/3494 ,  H05K2201/10015 ,  H05K2203/0156 ,  H05K2203/1394

Abstract: Embodiments are directed to a method of embedding a discrete component in a substrate. The method includes forming a cavity in the substrate. The method further includes inserting a discrete component into the cavity, wherein the discrete component comprises a top terminal and a bottom terminal. The method further includes positioning the discrete component within the cavity such that the top terminal is above the bottom terminal and below a front face of the substrate. The method further includes forming an intermediate conductive material within the cavity and over the top terminal. The method further includes forming a top conductive material over the intermediate conductive material such that the top conductive material is electrically coupled through the intermediate conductive material to the top terminal.

公开(公告)号：US10014112B2

公开(公告)日：2018-07-03

申请号：US15544136

申请日：2016-01-26

Applicant: Kyocera Corporation

Inventor： Yusuke Azuma ,  Hidenobu Seki

IPC: H01G4/30 ,  H05K1/18 ,  H01G4/248

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/224 ,  H01G4/232 ,  H01G4/248 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015

Abstract: The capacitor includes a dielectric body portion including ceramic layers and internal-electrode layers laminated in an alternating manner, and a cover portion provided in a periphery of the dielectric body portion. The cover portion includes pores. A part of the cover portion located in a position in a direction perpendicular to a lamination direction of the ceramic layers and the internal-electrode layers is a side surface cover portion. When the side surface cover portion is divided into three equal regions in a width direction, the regions being a dielectric body portion-side region, a central region, and a surface-side region, the number of the pores is higher in the dielectric body portion-side region than in the central region and the surface-side region.

公开(公告)号：US20180182700A1

公开(公告)日：2018-06-28

申请号：US15817267

申请日：2017-11-19

Applicant: Renesas Electronics Corporation

Inventor： Yoshiaki Sato ,  Shuuichi Kariyazaki ,  Kazuyuki Nakagawa

IPC: H01L23/498 ,  H01L23/64 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L21/48 ,  H01L21/56 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L22/32 ,  H01L23/3157 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/50 ,  H01L23/642 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19103 ,  H05K1/0231 ,  H05K1/0268 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10015 ,  H01L2924/00014

Abstract: A semiconductor device which provides improved reliability. The semiconductor device includes: a wiring substrate having a first surface and a second surface opposite to the first surface; a chip condenser built in the wiring substrate, having a first electrode and a second electrode; a first terminal and a second terminal disposed on the first surface; and a third terminal disposed on the second surface. The semiconductor device further includes: a first conduction path for coupling the first terminal and the third terminal; a second conduction path for coupling the first terminal and the first electrode; a third conduction path for coupling the third terminal and the first electrode; and a fourth conduction path for coupling the second terminal and the first electrode.

公开(公告)号：US20180182554A1

公开(公告)日：2018-06-28

申请号：US15644227

申请日：2017-07-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Jong Hwan PARK ,  Se Hun PARK

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/248 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes exposed through the third and fourth surfaces, and having first to sixth surfaces; first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces, and first and second band portions extending from the first and second connection portions to portions of the first and second surfaces and the fifth and sixth surfaces; first and second conductive resin layers covering portions of the first and second band portions; an insulating layer disposed on the first surface; and first and second terminal electrodes spaced apart from each other, covering portions of the insulating layer, and connected to the first and second external electrodes.

公开(公告)号：US20180171176A1

公开(公告)日：2018-06-21

申请号：US15895643

申请日：2018-02-13

Applicant: Motorola Mobility LLC

Inventor： Richard W. Brotzman ,  Ernest Sirois ,  Deborah Paskiewicz

IPC: C09D183/04 ,  H05K1/18

CPC classification number: C09D183/04 ,  C08G77/24 ,  C08G77/80 ,  C09D183/08 ,  H05K1/18 ,  H05K3/282 ,  H05K3/285 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2203/095

Abstract: A polysiloxane film comprises Si—O bonds and has a thickness of 0.3 to 1.5 microns. Adjacent electrodes coated with the polysiloxane film have a leakage current of at most 0.01 mA at 10 V after contact with water. An electrode coated with the polysiloxane film has a contact resistance of at least 0.01 ohms at 1.0 mm of pogo pin compression under a 1.0 N load. The polysiloxane film provides IPx7 protection from ingress of water.

公开(公告)号：US20180168045A1

公开(公告)日：2018-06-14

申请号：US15836860

申请日：2017-12-09

Applicant: CYNTEC CO., LTD.

Inventor： BAU-RU LU ,  CHUN HSIEN LU ,  DA-JUNG CHEN

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/11

CPC classification number: H01F27/022 ,  H01F17/04 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2823 ,  H01F27/32 ,  H01F27/36 ,  H01F41/00 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: An electronic module is disclosed, wherein the electronic module comprises: a module board and a connection board, wherein a plurality of first electronic devices are disposed over a top surface of the module board, and a plurality of second electronic devices are disposed on a bottom surface of the module board, wherein a plurality of first contact points are disposed on the bottom surface of the module board and electrically connected to a plurality of second contact points on a top surface of the connection board, wherein a plurality of third contact points are on a bottom surface of the connection board for connecting with an external circuit.

公开(公告)号：US20180160539A1

公开(公告)日：2018-06-07

申请号：US15877554

申请日：2018-01-23

Applicant: AVX Corporation

Inventor： Glenn Vaillancourt ,  Ken Moulton ,  Scott McCarthy ,  Jason Laforge

IPC: H05K1/18 ,  H01G9/08 ,  H05K3/30 ,  H01G9/26 ,  H01G9/15 ,  H01G9/028 ,  H01G9/07 ,  H01G9/052 ,  H01G9/042

CPC classification number: H05K1/181 ,  H01G9/012 ,  H01G9/028 ,  H01G9/042 ,  H01G9/0425 ,  H01G9/048 ,  H01G9/0525 ,  H01G9/07 ,  H01G9/08 ,  H01G9/15 ,  H01G9/26 ,  H05K3/303 ,  H05K2201/10015

Abstract: A module containing a plurality of active capacitors and a sacrificial capacitor is provided. The active capacitors and sacrificial capacitor are aligned along a horizontal direction so that the side surfaces of their cases are parallel to each other. The particular arrangement of the active capacitors and sacrificial capacitor results in a module configuration where the anode terminations for the active capacitors and an external component of the lead frame for the sacrificial capacitor are coplanar so that the module can be mounted to a circuit board via the anode terminations and the external component of the lead frame in a mechanically and electrically stable manner. Further, the center of gravity of the module in the length and/or width directions can be located at a midpoint of the overall module length and/or width, which enhances the stability of the module when mounted to a circuit board.

公开(公告)号：US20180160527A1

公开(公告)日：2018-06-07

申请号：US15829143

申请日：2017-12-01

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Youngkwang KIM

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  G02F1/1345

CPC classification number: H05K1/0268 ,  G02B6/0055 ,  G02B6/0083 ,  G02B6/0088 ,  G02F1/1309 ,  G02F1/133308 ,  G02F1/1345 ,  G02F1/13452 ,  G02F1/1368 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/13332 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/147 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10136 ,  H05K2201/10522

Abstract: A display device is capable of detecting defects of a PCB, the display device including: a display panel on which a driving integrated circuit is mounted; a printed circuit board disposed on at least one edge of the display panel and connected to the driving integrated circuit; signal lines disposed on the printed circuit board; and an inspection portion connected to signal lines. The inspection portion includes: a power line connected to one point of at least two signal lines of signal lines to apply an inspection signal, the at least two signal lines including a first signal line and a second signal line; a first resistor connected to the first signal line; a second resistor connected to the second signal line; and a signal detection line connected to the first resistor and the second resistor to detect a change value of the inspection signal.

公开(公告)号：US20180153041A1

公开(公告)日：2018-05-31

申请号：US15881690

申请日：2018-01-26

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： MING-GOO CHIEN ,  SHIH-SHAN LIU

IPC: H05K1/18 ,  H01G2/10 ,  G02F1/01

CPC classification number: H05K1/181 ,  G02F1/0126 ,  G02F2202/14 ,  H01G2/06 ,  H01G2/10 ,  H01G2/103 ,  H01G2/106 ,  H01G9/08 ,  H05K2201/10015

Abstract: The instant disclosure provides a color-changeable capacitor package structure and a color-changeable capacitor casing structure thereof, and a circuit board assembly. The color-changeable capacitor casing structure includes a metal casing, a first covering layer and a second covering layer. The metal casing has an outer surface and an inner surface, and the metal casing has a receiving space for receiving a capacitor. The first covering layer is formed on the outer surface of the metal casing, the second covering layer is formed on the first covering layer, and one of the first covering layer and the second covering layer is a color display layer for showing a color that is changeable by receiving a light source.

公开(公告)号：US09986633B2

公开(公告)日：2018-05-29

申请号：US15184125

申请日：2016-06-16

Applicant: International Business Machines Corporation

Inventor： Lei Shan

IPC: H05K3/30 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/0231 ,  H05K1/183 ,  H05K1/184 ,  H05K3/305 ,  H05K3/3405 ,  H05K3/3494 ,  H05K2201/10015 ,  H05K2203/0156 ,  H05K2203/1394

Abstract: Embodiments are directed to a method of embedding a discrete component in a substrate. The method includes forming a cavity in the substrate. The method further includes inserting a discrete component into the cavity, wherein the discrete component comprises a top terminal and a bottom terminal. The method further includes positioning the discrete component within the cavity such that the top terminal is above the bottom terminal and below a front face of the substrate. The method further includes forming an intermediate conductive material within the cavity and over the top terminal. The method further includes forming a top conductive material over the intermediate conductive material such that the top conductive material is electrically coupled through the intermediate conductive material to the top terminal.