公开(公告)号：US09418876B2

公开(公告)日：2016-08-16

申请号：US13224575

申请日：2011-09-02

Applicant: Jing-Cheng Lin ,  Weng-Jin Wu ,  Shih Ting Lin ,  Cheng-Lin Huang ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Jing-Cheng Lin ,  Weng-Jin Wu ,  Shih Ting Lin ,  Cheng-Lin Huang ,  Szu Wei Lu ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L21/00 ,  H01L21/56 ,  H01L21/683 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/16 ,  H01L25/0652 ,  H01L2221/68327 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81193 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2224/81

Abstract: A method of fabricating a three-dimensional integrated circuit comprises attaching a wafer to a carrier, mounting a plurality of semiconductor dies on top of the wafer to form a wafer stack. The method further comprises forming a molding compound layer on top of the wafer, attaching the wafer stack to a tape frame and dicing the wafer stack to separate the wafer stack into a plurality of individual packages.

Abstract translation: 制造三维集成电路的方法包括将晶片附着到载体上，将多个半导体管芯安装在晶片的顶部上以形成晶片堆叠。 该方法还包括在晶片的顶部上形成模塑复合层，将晶片堆叠连接到胶带框架上，并切割晶片堆叠以将晶片堆叠分离成多个单独的封装。

公开(公告)号：US09333231B2

公开(公告)日：2016-05-10

申请号：US14043035

申请日：2013-10-01

Applicant: Jing Cheng ,  Chia-wen Chen ,  Steven Francis Schnittger ,  Ming Lu

Inventor： Jing Cheng ,  Chia-wen Chen ,  Steven Francis Schnittger ,  Ming Lu

IPC: A61K36/725 ,  A61K8/97 ,  A61K8/99 ,  A61Q19/00 ,  A61K36/752 ,  A61K36/756 ,  A61K36/804 ,  A61K36/8998 ,  A61K36/068 ,  A61K36/074 ,  A61K36/076 ,  A61K36/10 ,  A61K36/16 ,  A61K36/185 ,  A61K36/23 ,  A61K36/235 ,  A61K36/236 ,  A61K36/258 ,  A61K36/28 ,  A61K36/41 ,  A61K36/535 ,  A61K36/539 ,  A61K36/65 ,  A61K36/704 ,  A61K36/06 ,  A61K36/69

CPC classification number: A61K36/725 ,  A61K8/97 ,  A61K8/99 ,  A61K36/06 ,  A61K36/068 ,  A61K36/074 ,  A61K36/076 ,  A61K36/10 ,  A61K36/16 ,  A61K36/185 ,  A61K36/23 ,  A61K36/235 ,  A61K36/236 ,  A61K36/258 ,  A61K36/28 ,  A61K36/41 ,  A61K36/535 ,  A61K36/539 ,  A61K36/65 ,  A61K36/69 ,  A61K36/704 ,  A61K36/752 ,  A61K36/756 ,  A61K36/804 ,  A61K36/8998 ,  A61K2800/85 ,  A61Q19/00

Abstract: The present invention relates to topical compositions containing fermented extracts of Traditional Chinese Medicinal (TCM) ingredients for improving the appearance and skin condition of the user. The topical compositions of the present invention are tailored for different users of different skin compositions according to TCM principles. The fermented TCM extracts are characterized by reduced odor and/or color in comparison with unfermented TCM extracts and are therefore more suitable for use in cosmetic products.

Abstract translation: 本发明涉及含有用于改善使用者的外观和皮肤状况的中药（TCM）成分的发酵提取物的局部组合物。 根据TCM原理，本发明的局部组合物针对不同皮肤组合物的不同使用者而定制。 与未发酵的TCM提取物相比，发酵的TCM提取物的特征在于减少气味和/或颜色，因此更适合用于化妆品。

公开(公告)号：US09293366B2

公开(公告)日：2016-03-22

申请号：US12769251

申请日：2010-04-28

Applicant: Jing-Cheng Lin ,  Ku-Feng Yang

Inventor： Jing-Cheng Lin ,  Ku-Feng Yang

IPC: H01L29/40 ,  H01L21/768 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/481 ,  H01L21/76816 ,  H01L21/76879 ,  H01L21/76898 ,  H01L23/49827 ,  H01L23/5226 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13025 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14181 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2224/05552

Abstract: A device includes a substrate, and a plurality of dielectric layers over the substrate. A plurality of metallization layers is formed in the plurality of dielectric layers, wherein at least one of the plurality of metallization layers comprises a metal pad. A through-substrate via (TSV) extends from the top level of the plurality of the dielectric layers to a bottom surface of the substrate. A deep conductive via extends from the top level of the plurality of dielectric layers to land on the metal pad. A metal line is formed over the top level of the plurality of dielectric layers and interconnecting the TSV and the deep conductive via.

Abstract translation: 一种器件包括衬底和在衬底上的多个电介质层。 多个金属化层形成在多个电介质层中，其中多个金属化层中的至少一个包括金属焊盘。 贯穿衬底通孔（TSV）从多个电介质层的顶层延伸到衬底的底表面。 深导电通孔从多个电介质层的顶层延伸到金属焊盘上。 金属线形成在多个电介质层的顶层上并且互连TSV和深导电通孔。

公开(公告)号：US09153462B2

公开(公告)日：2015-10-06

申请号：US12964097

申请日：2010-12-09

Applicant: Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou

Inventor： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/68728

Abstract: A device and system for thin wafer cleaning is disclosed. A preferred embodiment comprises a spin chuck having at least three holding clamps. A thin wafer with a wafer frame is mounted on the spin chuck through a tape layer. When the holding clamps are unlocked, there is no interference with the removal and placement of the wafer frame. On the other hand, when the holding clamps are locked, the holding clamps are brought into contact with the outer edge of the wafer frame so as to prevent the wafer frame from moving laterally. Furthermore, the shape of the holding clamps in a locked position is capable of preventing the wafer frame from moving vertically.

Abstract translation: 公开了用于薄晶片清洁的装置和系统。 优选实施例包括具有至少三个保持夹具的旋转卡盘。 具有晶片框架的薄晶片通过带层安装在旋转卡盘上。 当保持夹具解锁时，不会干扰晶片框架的移除和放置。 另一方面，当保持夹具被锁定时，保持夹具与晶片框架的外边缘接触，以防止晶片框架横向移动。 此外，保持夹具处于锁定位置的形状能够防止晶片框架垂直移动。

公开(公告)号：US20150093461A1

公开(公告)日：2015-04-02

申请号：US14043035

申请日：2013-10-01

Applicant: JING CHENG ,  CHIA-WEN CHEN ,  STEVEN FRANCIS SCHNITTGER ,  MING LU

Inventor： JING CHENG ,  CHIA-WEN CHEN ,  STEVEN FRANCIS SCHNITTGER ,  MING LU

IPC: A61K36/725 ,  A61K36/65 ,  A61K36/185 ,  A61K36/236

CPC classification number: A61K36/725 ,  A61K8/97 ,  A61K8/99 ,  A61K36/06 ,  A61K36/068 ,  A61K36/074 ,  A61K36/076 ,  A61K36/10 ,  A61K36/16 ,  A61K36/185 ,  A61K36/23 ,  A61K36/235 ,  A61K36/236 ,  A61K36/258 ,  A61K36/28 ,  A61K36/41 ,  A61K36/535 ,  A61K36/539 ,  A61K36/65 ,  A61K36/69 ,  A61K36/704 ,  A61K36/752 ,  A61K36/756 ,  A61K36/804 ,  A61K36/8998 ,  A61K2800/85 ,  A61Q19/00

Abstract: The present invention relates to topical compositions containing fermented extracts of Traditional Chinese Medicinal (TCM) ingredients for improving the appearance and skin condition of the user. The topical compositions of the present invention are tailored for different users of different skin compositions according to TCM principles. The fermented TCM extracts are characterized by reduced odor and/or color in comparison with unfermented TCM extracts and are therefore more suitable for use in cosmetic products.

公开(公告)号：US08936966B2

公开(公告)日：2015-01-20

申请号：US13369083

申请日：2012-02-08

Applicant: Jui-Pin Hung ,  Jing-Cheng Lin

Inventor： Jui-Pin Hung ,  Jing-Cheng Lin

IPC: H01L21/00

CPC classification number: H01L24/97 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/563 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/3185 ,  H01L24/11 ,  H01L24/19 ,  H01L24/94 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/83

Abstract: Methods of packaging semiconductor devices are disclosed. In one embodiment, a packaging method for semiconductor devices includes providing a workpiece including a plurality of first dies, and coupling a plurality of second dies to the plurality of first dies. The plurality of second dies and the plurality of first dies are partially packaged and separated. Top surfaces of the second dies are coupled to a carrier, and the partially packaged plurality of second dies and plurality of first dies are fully packaged. The carrier is removed, and the fully packaged plurality of second dies and plurality of first dies are separated.

Abstract translation: 公开了封装半导体器件的方法。 在一个实施例中，用于半导体器件的封装方法包括提供包括多个第一裸片的工件，以及将多个第二裸片耦合到多个第一裸片。 多个第二模具和多个第一模具被部分地包装和分离。 第二管芯的顶表面耦合到载体，并且部分封装的多个第二管芯和多个第一管芯被完全封装。 移除载体，分离完全封装的多个第二模具和多个第一模具。

公开(公告)号：US08900530B2

公开(公告)日：2014-12-02

申请号：US11666032

申请日：2004-11-22

Applicant: Dong Wang ,  Kun Zou ,  Jianxing Ye ,  Yelei Sun ,  Hui Zhu ,  Xianhua Wang ,  Jing Cheng

Inventor： Dong Wang ,  Kun Zou ,  Jianxing Ye ,  Yelei Sun ,  Hui Zhu ,  Xianhua Wang ,  Jing Cheng

IPC: B01L3/02

CPC classification number: B01L3/0265 ,  B01L2400/0487 ,  B01L2400/0666 ,  Y10T436/2575

Abstract: The present invention relates to a micro-volume liquid ejection system, including an air pressure module, a micro-ejection unit which is connected with the air pressure module by a conduit, and a control circuit which is connected with the air pressure module and the micro-ejection unit respectively. The air is used as the pressure medium, resulting in improved cleaning process and reduced sample waste. The present invention includes an electric control circuit to pick up sample, eject sample and clean the conduits automatically, and enables handling of a multiplicity of samples. The present invention can be used for transferring or dispensing micro volume liquid including biological liquid on a nL and μL scale.

Abstract translation: 微体积液体喷射系统技术领域本发明涉及一种微体积液体喷射系统，包括空气压力模块，通过导管与空气压力模块连接的微型喷射单元，以及与空气压力模块连接的控制电路， 微型喷射装置。 空气用作压力介质，从而改善清洗过程并减少样品废物。 本发明包括一个电子控制电路，用于拾取样品，抽出样品并自动清洁导管，并能够处理多个样品。 本发明可用于以nL和μL标度转移或分配包括生物液体的微量体积液体。

公开(公告)号：US08896136B2

公开(公告)日：2014-11-25

申请号：US12827563

申请日：2010-06-30

Applicant: Chen-Yu Tsai ,  Shih-Hui Wang ,  Chien-Ming Chiu ,  Chia-Ho Chen ,  Fang Wen Tsai ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Chen-Yu Tsai ,  Shih-Hui Wang ,  Chien-Ming Chiu ,  Chia-Ho Chen ,  Fang Wen Tsai ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L23/544 ,  H01L29/40 ,  H01L23/48 ,  H01L23/52 ,  H01L21/76 ,  H01L21/00 ,  H01L21/4763 ,  H01L21/44 ,  H01L21/683

CPC classification number: H01L23/481 ,  H01L21/30604 ,  H01L21/6835 ,  H01L21/76831 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2223/54426 ,  H01L2224/13

Abstract: In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.

Abstract translation: 根据实施例，结构包括具有第一区域和第二区域的基板; 穿过基板的第一区域的贯穿基板通孔（TSV）; 在所述衬底的所述第二区域上方的隔离层，所述隔离层具有凹部; 以及在所述隔离层的所述凹部中的导电材料，所述隔离层设置在所述凹部中的所述导电材料和所述基板之间。

公开(公告)号：US08846499B2

公开(公告)日：2014-09-30

申请号：US12858211

申请日：2010-08-17

Applicant: Ying-Ching Shih ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

Inventor： Ying-Ching Shih ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC: H01L21/30

CPC classification number: G07F17/3213 ,  B32B17/10 ,  B32B37/1207 ,  B32B37/182 ,  B32B37/185 ,  B32B2457/14 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A composite carrier structure for manufacturing semiconductor devices is provided. The composite carrier structure utilizes multiple carrier substrates, e.g., glass or silicon substrates, coupled together by interposed adhesive layers. The composite carrier structure may be attached to a wafer or a die for, e.g., backside processing, such as thinning processes. In an embodiment, the composite carrier structure comprises a first carrier substrate having through-substrate vias formed therethrough. The first substrate is attached to a second substrate using an adhesive such that the adhesive may extend into the through-substrate vias.

Abstract translation: 提供了一种用于制造半导体器件的复合载体结构。 复合载体结构利用多个载体衬底，例如玻璃或硅衬底，通过插入的粘合剂层耦合在一起。 复合载体结构可以附接到晶片或模具，用于例如背面处理，例如变薄处理。 在一个实施例中，复合载体结构包括具有贯穿其中形成的贯通基板通孔的第一载体基板。 使用粘合剂将第一衬底附接到第二衬底，使得粘合剂可以延伸到贯穿衬底通孔中。

公开(公告)号：US08829676B2

公开(公告)日：2014-09-09

申请号：US13170973

申请日：2011-06-28

Applicant: Chen-Hua Yu ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Jui-Pin Hung ,  Shin-Puu Jeng

Inventor： Chen-Hua Yu ,  Jing-Cheng Lin ,  Nai-Wei Liu ,  Jui-Pin Hung ,  Shin-Puu Jeng

IPC: H01L23/485

CPC classification number: H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/73267 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/214

Abstract: A package includes a device die having a substrate. A molding compound contacts a sidewall of the substrate. A metal pad is over the substrate. A passivation layer has a portion covering an edge portion of the metal pad. A metal pillar is over and contacting the metal pad. A dielectric layer is over the passivation layer. A package material formed of a molding compound or a polymer is over the dielectric layer. The dielectric layer includes a bottom portion between the passivation layer and the package material, and a sidewall portion between a sidewall of the metal pillar and a sidewall of the package material. A polymer layer is over the package material, the molding compound, and the metal pillar. A post-passivation interconnect (PPI) extends into the polymer layer. A solder ball is over the PPI, and is electrically coupled to the metal pad through the PPI.

Abstract translation: 封装包括具有基板的器件裸片。 模塑料与基材的侧壁接触。 金属焊盘在基板上。 钝化层具有覆盖金属焊盘的边缘部分的部分。 金属支柱已经过去并与金属垫接触。 介电层位于钝化层的上方。 由模塑料或聚合物形成的包装材料在电介质层的上面。 电介质层包括位于钝化层和封装材料之间的底部，以及在金属柱的侧壁和封装材料的侧壁之间的侧壁部分。 聚合物层在包装材料，模塑料和金属支柱之上。 后钝化互连（PPI）延伸到聚合物层中。 焊球在PPI上方，并通过PPI电耦合到金属焊盘。