公开(公告)号：US20070224714A1

公开(公告)日：2007-09-27

申请号：US11587632

申请日：2005-04-13

申请人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

发明人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

IPC分类号： H01L33/00

CPC分类号： H01L33/22 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/30

摘要： A light emitting device chip is obtained by dicing a light emitting device wafer having a light emitting layer section 24 based on a double heterostructure in which a first-conductivity-type cladding layer 6, an active layer 5 and an second-conductivity-type cladding layer 4, each of which being composed of a compound semiconductor having a composition allowing lattice matching with GaAs, out of compound semiconductors expressed by formula (AlxGa1-x)yIn1-yP (where, 0≦x≦1, 0≦y≦1), are stacked in this order, and having the (100) surface appeared on the main surface thereof, and GaP transparent semiconductor layers 20, 90 stacked on the light emitting layer section 24 as being agreed with the crystal orientation thereof, so that the {100} surfaces appear on the side faces of the GaP transparent semiconductor layer. Accordingly, there can be provided a method of fabricating a light emitting device having the AlGaInP light emitting layer section and the GaP transparent semiconductor layers, less causative of failures such as edge chipping during the dicing.

摘要翻译： 通过基于双异质结构对具有发光层部分24的发光器件晶片进行切割来获得发光器件芯片，其中第一导电型包覆层6，有源层5和第二导电型包层 层（其由具有允许与GaAs晶格匹配的组成的化合物半导体）组成，由式（Al x Ga 1-x N）表示的化合物半导体中， 在1-y

（其中，0 <= x <= 1,0 <= y <= 1）中按顺序堆叠，并且具有（ 100）表面，以及与其晶体取向一致的层叠在发光层部分24上的GaP透明半导体层20,90，使得{100}表面出现在GaP的侧面 透明半导体层。 因此，可以提供一种制造具有AlGaInP发光层部分和GaP透明半导体层的发光器件的方法，其不利于在切割期间的边缘切屑等故障。

公开(公告)号：US20070216001A1

公开(公告)日：2007-09-20

申请号：US11604294

申请日：2006-11-27

申请人： Akio Nakamura

发明人： Akio Nakamura

IPC分类号： H01L23/02

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L29/0661 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/18161 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/05599 ,  H01L2224/05099

摘要： According to this invention, a semiconductor package includes: a plurality of semiconductor chips, each having through electrodes; and a semiconductor interposer, on which the plurality of semiconductor chips are mounted. Each of the semiconductor chips includes: a semiconductor substrate; a wiring layer formed on the semiconductor substrate; an opaque resin layer sealing the wiring layer and a side surface of the semiconductor chip; and conductive bumps to be connected to the through electrodes.

摘要翻译： 根据本发明，半导体封装包括：多个半导体芯片，每个具有贯通电极; 以及安装有多个半导体芯片的半导体插入件。 每个半导体芯片包括：半导体衬底; 形成在所述半导体基板上的布线层; 密封所述布线层和所述半导体芯片的侧表面的不透明树脂层; 以及要连接到通孔的导电凸块。

公开(公告)号：US20070210327A1

公开(公告)日：2007-09-13

申请号：US11712940

申请日：2007-03-02

申请人： Hitoshi Ikeda ,  Akio Nakamura

发明人： Hitoshi Ikeda ,  Akio Nakamura

IPC分类号： H01L33/00

CPC分类号： H01L33/0095 ,  H01L21/02395 ,  H01L21/02461 ,  H01L21/02463 ,  H01L21/02502 ,  H01L21/02543 ,  H01L21/0262 ,  H01L33/16 ,  H01L33/32

摘要： Aiming at providing a method of fabricating a light emitting device having an AlGaInP light emitting section, less causative of crack by cleavage, on the edge portions on the back surface of the device chip in process of dicing or breaking, a light emitting device wafer is diced along a dicing line inclined at an angle of 15° to 30°, both ends inclusive, away from a dicing line angle reference direction defined as the direction on the (100) main surface.

摘要翻译： 为了提供一种制造具有AlGaInP发光部分的发光器件的方法，在切割或断裂过程中，在器件芯片的背面上的边缘部分上，通过切割导致裂纹的原因较少，发光器件晶片为 沿着在（100）主表面上被定义为<110>方向的切割线角度基准方向的切割线切割成15°至30°的角度，两端包括两端。

公开(公告)号：US07268422B2

公开(公告)日：2007-09-11

申请号：US11249569

申请日：2005-10-14

申请人： Akio Nakamura

发明人： Akio Nakamura

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L23/34 ,  H01L29/40

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16235 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： What is invented is a semiconductor device (10) comprising a pellet (12) having a ground electrode (18), an outside signal terminal (15) connected to the pellet (12), so as to receive signal which is likely to include noise. Therein, said outside signal terminal (15) is surrounded with a ground terminal (17) connected to said ground electrode (18) in at least a half periphery.

摘要翻译： 所发明的是一种半导体器件（10），其包括具有接地电极（18）的颗粒（12），连接到颗粒（12）的外部信号端子（15），以便接收可能包括噪声的信号 。 其中，所述外部信号端子（15）由在至少半个周边连接到所述接地电极（18）的接地端子（17）包围。

公开(公告)号：US07242395B2

公开(公告)日：2007-07-10

申请号：US10677236

申请日：2003-10-03

申请人： Shigemi Kurashima ,  Nobuyoshi Shimizu ,  Akio Nakamura ,  Yuriko Nishiyama ,  Shinichiro Akieda ,  Takashi Arita

发明人： Shigemi Kurashima ,  Nobuyoshi Shimizu ,  Akio Nakamura ,  Yuriko Nishiyama ,  Shinichiro Akieda ,  Takashi Arita

IPC分类号： G09G5/00 ,  G06K11/06

CPC分类号： G06F3/046 ,  G06F1/1626 ,  G06F1/169 ,  G06F3/016 ,  G06F3/0488

摘要： An input device and a driving device able to be made thin and secure sufficiently large vibration amplitude are provided. The input device comprises an input panel, a current conducting element for conducting a driving current, and a magnetic field application unit for applying a magnetic field on the current conducting element. Both of the current conducting element and the magnetic field application unit are arranged in the peripheral region of the input panel. The magnetic field applied by the magnetic field application unit is parallel to the input panel and intersects the current conducting element. When the input panel is touched, a driving current is fed into the current conducting element, and a force is imposed on the current conducting element and the magnetic field application unit, making them move. This movement further drives the input panel to vibrate. Consequently, input operations can be recognized by feeling the vibration of the input panel.

摘要翻译： 可以提供一种输入装置和驱动装置，其能够被制成薄而牢固的足够大的振幅。 输入装置包括输入面板，用于传导驱动电流的导电元件，以及用于在电流传导元件上施加磁场的磁场施加单元。 电流导电元件和磁场施加单元均布置在输入面板的周边区域中。 由磁场施加单元施加的磁场平行于输入面板并与电流传导元件相交。 当触摸输入面板时，驱动电流被馈送到电流传导元件中，并且对导电元件和磁场施加单元施加力，使其移动。 该运动进一步驱动输入面板振动。 因此，可以通过感觉输入面板的振动来识别输入操作。

公开(公告)号：US20070147966A1

公开(公告)日：2007-06-28

申请号：US11567453

申请日：2006-12-06

申请人： Shigenori Emoto ,  Akio Nakamura

发明人： Shigenori Emoto ,  Akio Nakamura

IPC分类号： B23P15/28

CPC分类号： B23C3/06 ,  B23C5/12 ,  B23C5/2234 ,  B23C2200/367 ,  B23C2210/16 ,  B23C2210/503 ,  B23C2220/68 ,  B23C2260/68 ,  Y10T82/19 ,  Y10T407/1908 ,  Y10T407/1952 ,  Y10T407/22 ,  Y10T409/30952

摘要： The present invention provides a pin milling cutter formed by combining a cutter and an adapter to prevent errors in attaching a cutter to the adapter even when the cutter is similar but of a different type and even if the engagement section between the cutter and the adapter are the same. A mounting error prevention mechanism is provided on a main cutter unit and an adapter to prevent an erroneous combination of a cutter and adapter from fitting together normally. The mounting error prevention mechanism includes: a projection and a cavity corresponding to the main cutter unit and the adapter and providing a tapered fit; and a projection and a corresponding groove. The projection can be inserted into the groove only when the cutter and the adapter are combined correctly.

摘要翻译： 本发明提供一种销铣刀，其通过组合切割器和适配器而形成，以防止即使切割器类似但是不同类型的切割器也将切割器附接到适配器上的错误，并且即使切割器和适配器之间的接合部分是 一样。 在主切割器单元和适配器上设置安装错误防止机构，以防止切割器和适配器错误地组合在一起。 安装误差防止机构包括：突起和对应于主切割器单元和适配器的腔，并提供锥形配合; 以及一个凸起和相应的凹槽。 只有当切割器和适配器正确组合时，突起才能插入槽中。

公开(公告)号：US20070052106A1

公开(公告)日：2007-03-08

申请号：US10976914

申请日：2004-11-01

申请人： Kazumi Watase ,  Akio Nakamura ,  Minoru Fujisaku ,  Hiroki Naraoka ,  Takahiro Nakano

发明人： Kazumi Watase ,  Akio Nakamura ,  Minoru Fujisaku ,  Hiroki Naraoka ,  Takahiro Nakano

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L23/3114 ,  H01L23/544 ,  H01L24/10 ,  H01L24/13 ,  H01L2223/5448 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014

摘要： A first mark formed simultaneously with the process step for forming a layer of metal interconnects is partly exposed at two parallel side surfaces of the separated semiconductor device or one side surface thereof to have a rectangular shape. This allows the identification of the orientation and product information of the semiconductor device in a small semiconductor device.

摘要翻译： 与用于形成金属互连层的工艺步骤同时形成的第一标记部分地暴露在分离的半导体器件的两个平行的侧表面或其一个侧表面上以具有矩形形状。 这允许在小型半导体器件中识别半导体器件的取向和产品信息。

公开(公告)号：US06977428B2

公开(公告)日：2005-12-20

申请号：US10712090

申请日：2003-11-14

申请人： Akio Nakamura

发明人： Akio Nakamura

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/02

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16235 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： What is invented is a semiconductor device (10) comprising a pellet (12) having a ground electrode (18), an outside signal terminal (15) connected to the pellet (12), so as to receive signal which is likely to include noise. Therein, said outside signal terminal (15) is surrounded with a ground terminal (17) connected to said ground electrode (18) in at least a half periphery.

摘要翻译： 所发明的是一种半导体器件（10），其包括具有接地电极（18）的颗粒（12），连接到颗粒（12）的外部信号端子（15），以便接收可能包括噪声的信号 。 其中，所述外部信号端子（15）由在至少半个周边连接到所述接地电极（18）的接地端子（17）包围。

公开(公告)号：US20050180082A1

公开(公告)日：2005-08-18

申请号：US11052768

申请日：2005-02-09

申请人： Akio Nakamura ,  Satoshi Sakurai ,  Shigemi Kurashima ,  Nobuo Yatsu ,  Shinichiro Akieda

发明人： Akio Nakamura ,  Satoshi Sakurai ,  Shigemi Kurashima ,  Nobuo Yatsu ,  Shinichiro Akieda

IPC分类号： G06F3/041 ,  G06F3/03 ,  G06F3/033 ,  H01F7/08 ,  H01H13/85 ,  H01H51/22

CPC分类号： H01H13/85 ,  H01H2215/05

摘要： A plane plate vibration device includes a plane plate, a coil portion having a first coil and a second coil, the first coil being wound on a circumference of the plane plate in parallel with the plane plate, the second coil being wound along inside of the first coil in parallel with the plane plate, and magnetic field generating mechanisms that are provided in parallel with the plane plate and generate magnetic fields in directions perpendicular to directions of currents respectively flowing through the first coil and the second coil. The currents flow through the first coil and the second coil in reverse directions, the directions of magnetic fields perpendicular to the currents respectively flowing through the first coil and the second coil give forces in the same direction, and the plane plate vibrates in a direction of thickness by adjusting the currents respectively flowing through the first coil and the second coil.

摘要翻译： 平板振动装置包括平板，具有第一线圈和第二线圈的线圈部，所述第一线圈与所述平板平行地卷绕在所述平板的圆周上，所述第二线圈沿着所述平板卷绕， 与平板平行的第一线圈和与平板平行设置的磁场产生机构，并且在垂直于分别流过第一线圈和第二线圈的电流方向产生磁场。 电流以相反的方向流过第一线圈和第二线圈，垂直于分别流过第一线圈和第二线圈的电流的磁场方向在相同方向上产生力，平板沿着 通过调节分别流过第一线圈和第二线圈的电流来确定厚度。

公开(公告)号：US20050168077A1

公开(公告)日：2005-08-04

申请号：US11047987

申请日：2005-02-02

申请人： Shinichiro Akieda ,  Akio Nakamura

发明人： Shinichiro Akieda ,  Akio Nakamura

IPC分类号： H02K33/18 ,  H02K41/00 ,  H02K41/03

CPC分类号： H02K41/03 ,  H02K2201/18 ,  Y10T74/20201

摘要： An actuator including magnets arranged on a plane on a plane, coils respectively arranged to face the magnets and move relatively with facing the magnets when a current is applied thereto, a moving member connected to either the magnets or coils, a guide member that guides the moving member to move in a given two-dimensional range; and a hit prevention mechanism to prevent the moving member from hitting a movable limit in the given two-dimensional range. The hit prevention mechanism is provided at the movable limit (edge) in the two-dimensional range. It is thus possible to prevent the moving member from hitting the movable limit. This can prevent damage or any hitting sound. The actuator can be used in a comfortable manner and stably for a long period.

摘要翻译： 一种致动器，包括布置在平面上的磁体，线圈分别布置为面对磁体并且当施加电流时面向磁体相对移动，连接到磁体或线圈的移动构件，将移动构件引导到 在给定的二维范围内移动; 以及防止移动构件在给定的二维范围内击中可移动极限的防撞机构。 在二维范围内的可动极限（边缘）设置防撞机构。 因此可以防止移动构件撞击可动极限。 这可以防止损坏或任何打击声。 致动器可以舒适地使用并且可以长时间稳定地使用。