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    Resonator with a staggered electrode configuration
    86.
    发明授权
    Resonator with a staggered electrode configuration 有权
    具有交错电极配置的谐振器

    公开(公告)号：US09379686B2

    公开(公告)日：2016-06-28

    申请号：US14196355

    申请日：2014-03-04

    Applicant: QUALCOMM Incorporated

    Inventor： Changhan Hobie Yun ,  Chengjie Zuo ,  Jonghae Kim ,  Mario Francisco Velez ,  Daeik Daniel Kim ,  Rick Allen Wilcox

    IPC: H03H9/13 ,  H03H9/15 ,  H03H9/54 ,  H03H9/02 ,  H03H9/46 ,  H03H3/02

    CPC classification number: H03H9/02448 ,  H03H3/02 ,  H03H9/02133 ,  H03H9/02228 ,  H03H9/02244 ,  H03H9/132 ,  H03H9/133 ,  H03H9/15 ,  H03H9/462 ,  H03H9/54 ,  H03H2003/027

    Abstract: An integrated circuit device includes a piezoelectric substrate having a first surface and a second surface opposite the first surface. The device also includes a first electrode and a second electrode on the first surface of the piezoelectric substrate, the first electrode having a first width and the second electrode having a second width. The device further includes a third electrode and a fourth electrode on the second surface of the piezoelectric substrate, the third electrode having a third width that is substantially the same as the second width, and the fourth electrode having a fourth width that is substantially the same as the first width. The first and third electrodes operate as part of a first portion of a microelectromechanical systems (MEMS) resonator, and the second and fourth electrodes operate as part of a second portion of the MEMS resonator.

    Abstract translation: 集成电路装置包括具有第一表面和与第一表面相对的第二表面的压电基片。 该装置还包括在压电基片的第一表面上的第一电极和第二电极，第一电极具有第一宽度，第二电极具有第二宽度。 该装置还包括在压电基片的第二表面上的第三电极和第四电极，第三电极具有与第二宽度基本相同的第三宽度，第四电极具有基本相同的第四宽度 作为第一宽度。 第一和第三电极作为微机电系统（MEMS）谐振器的第一部分的一部分工作，第二和第四电极作为MEMS谐振器的第二部分的一部分工作。

    METAL-INSULATOR-METAL (MIM) CAPACITORS ARRANGED IN A PATTERN TO REDUCE INDUCTANCE, AND RELATED METHODS
    87.
    发明申请
    METAL-INSULATOR-METAL (MIM) CAPACITORS ARRANGED IN A PATTERN TO REDUCE INDUCTANCE, AND RELATED METHODS 审中-公开
    金属绝缘体金属（MIM）电容器，以减少电感的形态和相关方法

    公开(公告)号：US20160181233A1

    公开(公告)日：2016-06-23

    申请号：US14580900

    申请日：2014-12-23

    Applicant: QUALCOMM Incorporated

    Inventor： Changhan Hobie Yun ,  Je-Hsiung Jeffrey Lan ,  Daeik Daniel Kim ,  David Francis Berdy ,  Chengjie Zuo ,  Jonghae Kim ,  Niranjan Sunil Mudakatte ,  Mario Francisco Velez ,  Robert Paul Mikulka

    IPC: H01L27/01 ,  H01L49/02

    CPC classification number: H01L28/40 ,  H01G4/33 ,  H01G4/38 ,  H01L27/016 ,  H01L27/0805 ,  H01L2224/18

    Abstract: Metal-insulator-metal (MIM) capacitors arranged in a pattern to reduce inductance, and related methods, are disclosed. In one aspect, circuits are provided that employ MIM capacitors coupled in series. The MIM capacitors are arranged in a pattern, wherein a MIM capacitor is placed so as to be electromagnetically adjacent to at least two MIM capacitors, and so that a current of the MIM capacitor flows in a direction opposite or substantially opposite of a direction in which a current of each adjacent MIM capacitor flows. The magnetic field generated at metal connections of each MIM capacitor rotates in an opposite direction of the magnetic field of each electromagnetically adjacent MIM capacitor, and thus a larger proportion of magnetic fields cancel out one another rather than combining, reducing equivalent series inductance (ESL) compared to linear arrangement of MIMs.

    Abstract translation: 公开了以图案排列以降低电感的金属绝缘体金属（MIM）电容器及相关方法。 在一个方面，提供了采用串联耦合的MIM电容器的电路。 MIM电容器以图案布置，其中MIM电容器放置成与至少两个MIM电容器电磁相邻，并且使得MIM电容器的电流沿与其中的MIM方向相反或基本上相反的方向流动 每个相邻MIM电容器的电流流动。 在每个MIM电容器的金属连接处产生的磁场沿与每个电磁相邻的MIM电容器的磁场相反的方向旋转，因此较大比例的磁场彼此抵消而不是组合，从而减小了等效串联电感（ESL） 与MIM的线性排列相比。

    Toroid inductor in an integrated device
    90.
    发明授权
    Toroid inductor in an integrated device 有权
    环形电感在集成器件中

    公开(公告)号：US09324779B2

    公开(公告)日：2016-04-26

    申请号：US14063934

    申请日：2013-10-25

    Applicant: QUALCOMM Incorporated

    Inventor： Young Kyu Song ,  Daeik Daniel Kim ,  Jonghae Kim ,  Xiaonan Zhang ,  Ryan David Lane ,  Mario Francisco Velez ,  Chengjie Zuo ,  Changhan Hobie Yun

    IPC: H01L49/02 ,  H01L23/522 ,  H01L23/64

    CPC classification number: H01L28/10 ,  H01L23/5227 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

    Abstract: Some novel features pertain to an integrated device that includes a substrate, a first cavity through the substrate, and a toroid inductor configured around the first cavity of the substrate. The toroid inductor includes a set of windings configured around the first cavity. The set of windings includes a first set of interconnects on a first surface of the substrate, a set of though substrate vias (TSVs), and a second set of interconnects on a second surface of the substrate. The first set of interconnects is coupled to the second set of interconnects through the set TSVs. In some implementations, the integrated device further includes an interconnect material (e.g., solder ball) located within the first cavity. The interconnect material is configured to couple a die to a printed circuit board. In some implementations, the interconnect material is part of the toroid inductor.

    Abstract translation: 一些新颖的特征涉及包括衬底，通过衬底的第一腔和围绕衬底的第一腔配置的环形电感器的集成器件。 环形电感器包括围绕第一腔配置的一组绕组。 该组绕组包括在衬底的第一表面上的第一组互连，一组通过衬底通孔（TSV）和在衬底的第二表面上的第二组互连。 第一组互连通过集合TSV耦合到第二组互连。 在一些实施方案中，集成器件还包括位于第一腔内的互连材料（例如，焊球）。 互连材料被配置为将管芯耦合到印刷电路板。 在一些实施方案中，互连材料是环形电感器的一部分。

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