POWER STORAGE SYSTEM AND POWER STORAGE DEVICE

    公开(公告)号:US20170163047A1

    公开(公告)日:2017-06-08

    申请号:US15434832

    申请日:2017-02-16

    Abstract: The versatility of a power feeding device is improved. A power storage system includes a power storage device and a power feeding device. The power storage device includes data for identifying the power storage device. The power storage device includes a power storage unit, a switch that controls whether power from the power feeding device is supplied to the power storage unit, and a control circuit having a function of controlling a conduction state of the switch in accordance with a control signal input from the power feeding device. The power feeding device includes a signal generation circuit having a function of identifying the power storage device by the data input from the power storage device, generating the control signal corresponding to the identified power storage device, and outputting the generated control signal to the power storage device.

    DRIVER CIRCUIT AND SEMICONDUCTOR DEVICE
    85.
    发明申请
    DRIVER CIRCUIT AND SEMICONDUCTOR DEVICE 审中-公开
    驱动电路和半导体器件

    公开(公告)号:US20160358950A1

    公开(公告)日:2016-12-08

    申请号:US15243209

    申请日:2016-08-22

    Abstract: The silicon nitride layer 910 formed by plasma CVD using a gas containing a hydrogen compound such as silane (SiH4) and ammonia (NH3) is provided on and in direct contact with the oxide semiconductor layer 905 used for the resistor 354, and the silicon nitride layer 910 is provided over the oxide semiconductor layer 906 used for the thin film transistor 355 with the silicon oxide layer 909 serving as a barrier layer interposed therebetween. Therefore, a higher concentration of hydrogen is introduced into the oxide semiconductor layer 905 than into the oxide semiconductor layer 906. As a result, the resistance of the oxide semiconductor layer 905 used for the resistor 354 is made lower than that of the oxide semiconductor layer 906 used for the thin film transistor 355.

    Abstract translation: 通过使用含有氢化合物如硅烷(SiH 4)和氨(NH 3)的气体的等离子体CVD形成的氮化硅层910设置在与用于电阻器354的氧化物半导体层905上并直接接触,并且氮化硅 在用于薄膜晶体管355的氧化物半导体层906上设置层910,氧化硅层909用作阻挡层。 因此,与氧化物半导体层906相比,在氧化物半导体层905中引入更高浓度的氢。结果,使用于电阻器354的氧化物半导体层905的电阻比氧化物半导体层的电阻低 906用于薄膜晶体管355。

    SEMICONDUCTOR DEVICE
    90.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20160163742A1

    公开(公告)日:2016-06-09

    申请号:US15016451

    申请日:2016-02-05

    Abstract: A semiconductor device includes an oxide layer, a source electrode layer in contact with the oxide layer, a first drain electrode layer in contact with the oxide layer, a second drain electrode layer in contact with the oxide layer, a gate insulating film in contact with the oxide layer, a first gate electrode layer overlapping with the source electrode layer and the first drain electrode layer and overlapping with a top surface of the oxide layer with the gate insulating film interposed therebetween, a second gate electrode layer overlapping with the source electrode layer and the second drain electrode layer and overlapping with the top surface of the oxide layer with the gate insulating film interposed therebetween, and a third gate electrode layer overlapping with a side surface of the oxide layer with the gate insulating film interposed therebetween.

    Abstract translation: 半导体器件包括氧化物层,与氧化物层接触的源极电极层,与氧化物层接触的第一漏极电极层,与氧化物层接触的第二漏极电极层,与氧化物层接触的栅极绝缘膜 所述氧化物层与所述源极电极层和所述第一漏极电极层重叠并与所述氧化物层的顶表面重叠的第一栅极电极层与所述栅极绝缘膜插入其间,与所述源极电极层重叠的第二栅电极层 所述第二漏极电极层与所述氧化物层的顶面重叠,并且所述栅极绝缘膜与所述第二漏极电极层重叠,并且所述第三栅极电极层与所述氧化物层的侧面重叠,并且所述栅极绝缘膜插入其间。

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