公开(公告)号：US20090324669A1

公开(公告)日：2009-12-31

申请号：US12374475

申请日：2007-07-25

申请人： Takahiro Ogawa ,  Anahid Jewett

发明人： Takahiro Ogawa ,  Anahid Jewett

IPC分类号： A61F13/00 ,  A61K31/195 ,  A61K31/59 ,  A61K38/39 ,  A61K33/42 ,  A61K31/56

CPC分类号： A61K31/197 ,  A61K31/573 ,  A61K35/32 ,  A61K38/00 ,  A61K45/06 ,  A61L24/0015 ,  A61L27/54 ,  A61L2300/112 ,  A61L2300/41 ,  A61L2300/414 ,  A61L2300/428 ,  A61L2300/43 ,  A61L2300/64 ,  A61L2430/02 ,  A61K2300/00

摘要： An osteogenic enhancer composition for bone and cartilage repair and methods of using the same are described.

摘要翻译： 描述了用于骨和软骨修复的成骨增强剂组合物及其使用方法。

公开(公告)号：US20090283701A1

公开(公告)日：2009-11-19

申请号：US11885474

申请日：2006-03-03

申请人： Takahiro Ogawa

发明人： Takahiro Ogawa

IPC分类号： G21K5/00

CPC分类号： A61F2/30767 ,  A61B17/68 ,  A61B17/80 ,  A61B17/866 ,  A61C8/0006 ,  A61F2/0077 ,  A61F2/186 ,  A61F2/2803 ,  A61F2/3094 ,  A61F2/32 ,  A61F2/36 ,  A61F2/38 ,  A61F2/4261 ,  A61F2/44 ,  A61F2002/183 ,  A61F2002/30031 ,  A61F2002/30062 ,  A61F2002/3084 ,  A61F2002/30906 ,  A61F2002/30925 ,  A61F2002/3097 ,  A61F2002/3625 ,  A61F2210/0004 ,  A61F2250/0056 ,  A61F2310/00011 ,  A61F2310/00017 ,  A61F2310/00023 ,  A61F2310/00029 ,  A61F2310/00041 ,  A61F2310/00047 ,  A61F2310/00059 ,  A61F2310/00071 ,  A61F2310/00089 ,  A61F2310/00095 ,  A61F2310/00107 ,  A61F2310/00131 ,  A61F2310/00149 ,  A61F2310/00155 ,  A61F2310/00179 ,  A61F2310/00293 ,  A61F2310/00329 ,  A61F2310/00353 ,  A61L24/02 ,  A61L24/046 ,  A61L24/06 ,  A61L27/50 ,  A61L31/14 ,  A61L2400/12 ,  A61L2400/18 ,  B23K26/355 ,  B82Y40/00 ,  Y10S977/901 ,  Y10S977/904 ,  C08L67/04 ,  C08L33/12

摘要： Provided herein is methods of treating a medical implant and methods of using the same.

摘要翻译： 本文提供了治疗医疗植入物的方法及其使用方法。

公开(公告)号：US07575636B2

公开(公告)日：2009-08-18

申请号：US11455777

申请日：2006-06-20

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Dai

IPC分类号： B05C3/02

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

摘要翻译： 本发明涉及通过将基板浸渍在处理液中而用于电镀基板或加工基板的基板处理装置。 本发明的基板处理装置包括：用于搬入和取出基板的装载/卸载区域; 用于清洁衬底的清洁区域; 以及用于电镀基板的电镀区域。 装载/卸载区域设置有具有多个干用设计的手的基板传送机器人，安装有用于容纳基板的盒的装载端口和用于将基板从面朝上翻转的干式设计的反转机 面对下来

公开(公告)号：US07508067B2

公开(公告)日：2009-03-24

申请号：US11546976

申请日：2006-10-13

申请人： Hiroaki Arai ,  Takahiro Ogawa ,  Mitsuhara Inagaki

发明人： Hiroaki Arai ,  Takahiro Ogawa ,  Mitsuhara Inagaki

IPC分类号： H01L23/34 ,  H01L23/10

CPC分类号： H01L23/473 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/72 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor insulation structure is disclosed for a semiconductor module, incorporating therein a semiconductor element, with which an electrically conductive structural body is held in pressured contact via an intervening insulation member. The semiconductor insulation structure includes a deformation preventing structure to avoid the insulation member from deforming when applied with load thereto. In one aspect, the deformation preventing structure includes a deformation resistant abutment surface, formed on the semiconductor module, and a readily deforming abutment surface formed on the electrically conductive structural body. In another aspect, the deformation preventing structure includes a reinforcement formed on a cooler and held in contact with the insulation member in an area placed in opposition to an outer circumferential periphery of the semiconductor module.

摘要翻译： 公开了一种用于半导体模块的半导体绝缘结构，其中结合有半导体元件，通过该半导体元件，导电结构体经由中间绝缘构件保持压力接触。 半导体绝缘结构包括防变形结构，以避免绝缘构件在施加负载时变形。 在一个方面，变形防止结构包括形成在半导体模块上的抗变形抵接表面和形成在导电结构体上的容易变形的邻接表面。 在另一方面，变形防止结构包括形成在冷却器上并在与半导体模块的外周边相对置的区域中与绝缘构件保持接触的加强件。

公开(公告)号：US20080218978A1

公开(公告)日：2008-09-11

申请号：US12074158

申请日：2008-02-29

申请人： Takahiro Ogawa ,  Takahito Yamanaka

发明人： Takahiro Ogawa ,  Takahito Yamanaka

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： The IC fixing component includes a locking case accommodating the IC in such a manner that a side of the IC out of a face-to-face contact with the heat dissipation plate is brought into a face-to-face contact with the locking case so as to be covered and a through hole and a rotation stop protrusion inserted into a rotation limiting hole. After the IC has been accommodated in the locking case, the screw member inserted through the through hole is screwed into a screw hole of the heat dissipation plate so that the side of the IC out of face-to-face contact with the locking case is pressed by the locking case thereby to be brought into a face-to-face contact with the heat dissipation plate.

摘要翻译： IC固定部件包括容纳IC的锁定壳体，使得IC的与散热板的面对面接触的一侧与锁定壳体进行面对面接触， 以及插入到旋转限制孔中的通孔和旋转止动突起。 在IC被容纳在锁定壳体中之后，插入通孔的螺钉构件被拧入散热板的螺纹孔中，使得与锁定壳体面对面接触的IC侧是 由锁定壳体按压而与散热板进行面对面的接触。

公开(公告)号：US20080068367A1

公开(公告)日：2008-03-20

申请号：US11901429

申请日：2007-09-17

申请人： Takahiro Ogawa

发明人： Takahiro Ogawa

IPC分类号： G09G5/00

CPC分类号： H02M3/33523 ,  G09G3/296 ,  G09G2330/026 ,  G09G2330/028

摘要： The present invention discloses a power supply circuit initiating an oscillation on a primary side of the power supply circuit upon receipt of a startup signal, comprising: a detecting module receiving an output voltage from the power supply circuit for detecting whether the output voltage is below a predetermined voltage; a power supply switching module turning OFF a main power supply of the power supply circuit when the detecting module determines the output voltage to be below the predetermined voltage; and a detection invalidating module invalidating the detecting of the detecting module from the receipt of the predetermined startup signal to the output voltage becomes above or equal the predetermined voltage.

摘要翻译： 本发明公开了一种在接收到启动信号时在电源电路的初级侧启动振荡的电源电路，包括：检测模块，接收来自电源电路的输出电压，用于检测输出电压是否低于 预定电压; 当检测模块确定输出电压低于预定电压时，电源切换模块关闭电源电路的主电源; 检测无效模块使检测模块从接收到预定的启动信号到输出电压的检测无效，变得高于或等于预定电压。

公开(公告)号：US20070277930A1

公开(公告)日：2007-12-06

申请号：US11663071

申请日：2005-09-14

申请人： Toshi Yokoyama ,  Seiji Katsuoka ,  Takahiro Ogawa ,  Kaoru Yamada ,  Kazuaki Maeda

发明人： Toshi Yokoyama ,  Seiji Katsuoka ,  Takahiro Ogawa ,  Kaoru Yamada ,  Kazuaki Maeda

IPC分类号： H01L21/304 ,  H01L21/683

CPC分类号： H01L21/67051 ,  H01L21/67207

摘要： A substrate cleaning apparatus does not need positioning of a transport system on start-up of the apparatus and can reduce the installation area of the apparatus. The substrate cleaning apparatus includes a base-integrated frame (1) in which are mounted a substrate transport device (2) for transporting a substrate, at least one substrate processing unit (3) for processing the substrate, a substrate loading port (5) for placing a substrate-housing cassette (4) on it, and a processing liquid supply apparatus (6) for supplying a processing liquid to the substrate processing unit, wherein maintenance of the substrate processing unit (3) can be performed from the backside of the apparatus.

摘要翻译： 基板清洗装置不需要在装置起动时定位运输系统，并且可以减少装置的安装面积。 基板清洗装置包括基底一体化框架（1），其中安装有用于输送基板的基板输送装置（2），用于处理基板的至少一个基板处理单元（3），基板装载口（5） 用于将衬底容纳盒（4）放置在其上，以及处理液体供应装置（6），用于向衬底处理单元提供处理液体，其中可以从衬底处理单元（3）的背面执行维护 该装置。

公开(公告)号：US20070226992A1

公开(公告)日：2007-10-04

申请号：US11730309

申请日：2007-03-30

申请人： Hiroyuki Kaneko ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Hiroyuki Kaneko ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： H05K13/04 ,  B24B49/00

CPC分类号： H01L21/68728 ,  B24B37/345 ,  B24B41/06 ,  H01L21/67219 ,  H01L21/68707 ,  Y10S134/902 ,  Y10T29/53091 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53196

摘要： A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.

摘要翻译： 使用基板保持旋转机构来保持和旋转待处理的基板。 根据本发明的基板保持旋转机构包括至少三个主轴，分别安装在主轴上的用于保持基板周边的夹紧辊，用于使至少一个夹紧辊旋转的旋转装置，至少一个基座部件 所述主轴中的至少一个被安装，以及适于允许所述基座构件旋转的旋转机构。

公开(公告)号：US20060243205A1

公开(公告)日：2006-11-02

申请号：US11455777

申请日：2006-06-20

申请人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Daj

发明人： Seiji Katsuoka ,  Masahiko Sekimoto ,  Toshio Yokoyama ,  Teruyuki Watanabe ,  Takahiro Ogawa ,  Kenichi Kobayashi ,  Mitsuru Miyazaki ,  Yasuyuki Motoshima ,  Akira Owatari ,  Naoki Daj

IPC分类号： B05C3/02 ,  B05C13/00

CPC分类号： H01L21/67161 ,  C23C18/1628 ,  C23C18/1893 ,  C25D7/123 ,  C25D17/001 ,  C25D17/08 ,  H01L21/67051 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/6723 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/67781 ,  H01L21/68707 ,  H01L21/68721 ,  Y10S134/902 ,  Y10T279/11

摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

公开(公告)号：US20060214599A1

公开(公告)日：2006-09-28

申请号：US11442412

申请日：2006-05-25

申请人： Takahiro Ogawa

发明人： Takahiro Ogawa

IPC分类号： G09G3/10 ,  H04N3/12

CPC分类号： H02M1/32 ,  G09G2330/04 ,  H02M3/33507

摘要： At a primary power-supply board 40, a Vsus power supply and a Vadd power supply of prescribed voltages are derived and outputted to a plasma display panel 11. Secondary power supplies Vsub1, Vsub2, and Vsub3 are derived from prescribed voltage levels of a transformer 42 for deriving Vsus and Vadd power supplies at the primary power-supply board 40. The secondary power supplies Vsub1, Vsub2, and Vsub3 are outputted to a secondary power-supply board 20 which is a board different from the primary power-supply board 40. Vset, Ve, and Vscan power supplies which can be used by the plasma display panel 11 are derived by regulating the secondary power supplies Vsub1, Vsub2, and Vsub3. Thus, since the primary power-supply board 40 and the secondary power-supply board 20 are provided separately, the secondary power-supply board 20 alone can be replaced to cope with the changes of the plasma display panel 11.

摘要翻译： 在主电源板40处，导出规定电压的V SUB电源和V SUB电源，并将其输出到等离子体显示面板11.次级电源 从变压器42的规定的电压电平导出供给V Sub1，V Sub2，V Sub3，以及V Sub3 < SUB>和V SUB在主电源板40上添加电源。次级电源V SUB1，V SUB22和V < SUB> sub3 被输出到与主电源板40不同的板的辅助电源板20上。V＆lt;＆lt;＆lt; 和等离子体显示面板11可以使用的V SUB扫描电源是通过调节辅助电源V Sub1，V Sub2 ，和V sub 3 3。 因此，由于主电源板40和二次电源板20分开设置，所以可以更换二次电源板20以应对等离子体显示面板11的变化。