公开(公告)号：US11835388B2

公开(公告)日：2023-12-05

申请号：US16843244

申请日：2020-04-08

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Masaki Hirose ,  Katsumi Shibayama ,  Takashi Kasahara ,  Toshimitsu Kawai ,  Hiroki Oyama ,  Yumi Teramachi

IPC: G01J5/08 ,  G01J3/26 ,  G02B26/00 ,  G01J3/02 ,  G01J5/0802 ,  G01J5/20 ,  G02F1/21 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/0304 ,  G01J5/04 ,  H10N15/10

CPC classification number: G01J3/26 ,  G01J3/0213 ,  G01J3/0256 ,  G01J3/0291 ,  G01J5/0802 ,  G01J5/20 ,  G02B26/00 ,  G02F1/21 ,  H01L31/0203 ,  H01L31/02005 ,  H01L31/02327 ,  H01L31/03046 ,  G01J5/045 ,  G02F1/213 ,  H10N15/10

Abstract: A light detection device includes: a Fabry-Perot interference filter provided with a light transmission region; a light detector configured to detect light transmitted through the light transmission region; a package having an opening and accommodating the Fabry-Perot interference filter and the light detector; and a light transmitting unit arranged on an inner surface of the package so as to close an opening, the light transmitting unit including a band pass filter configured to transmit light incident on the light transmission region. When viewed from a direction parallel to the line, an outer edge of the Fabry-Pert interference filter is positioned outside an outer edge of the opening, and an outer edge of the light transmitting unit is positioned outside the outer edge of the Fabry-Perot interference filter.

公开(公告)号：US20230314229A1

公开(公告)日：2023-10-05

申请号：US18330371

申请日：2023-06-07

Applicant: PIXART IMAGING INC.

Inventor： CHIH-MING SUN ,  MING-HAN TSAI ,  CHENG-NAN TSAI

IPC: G01J5/02 ,  G01J5/04 ,  H04N5/33 ,  G01J5/06 ,  B81B7/00 ,  H04N23/57

CPC classification number: G01J5/0265 ,  G01J5/041 ,  H04N5/33 ,  G01J5/045 ,  G01J5/06 ,  B81B7/0064 ,  B81B7/0067 ,  H04N23/57 ,  B81B2201/0278

Abstract: A wearable device includes a case and a temperature sensing device. The case has a first opening. The temperature sensing device is disposed inside the case of the wearable device. The temperature sensing device includes a first substrate, a sensor chip, and a metal shielding structure. The sensor chip is disposed on the first substrate. The metal shielding structure surrounds the sensor chip, and has a second opening. The sensor chip faces towards the first opening and the second opening.

公开(公告)号：US20190196546A1

公开(公告)日：2019-06-27

申请号：US16231266

申请日：2018-12-21

Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.

Inventor： Anping WU

IPC: G06F1/16 ,  H01L23/552 ,  H04M1/725 ,  H01L31/101 ,  H05K5/02 ,  A45C11/00

CPC classification number: G06F1/1637 ,  A45C11/00 ,  A45C2011/002 ,  G01J1/0204 ,  G01J1/0219 ,  G01J1/0233 ,  G01J1/0271 ,  G01J1/0411 ,  G01J1/06 ,  G01J1/4204 ,  G01J1/4228 ,  G01J5/0215 ,  G01J5/025 ,  G01J5/0265 ,  G01J5/045 ,  G01J5/0806 ,  G01J2001/061 ,  G01S7/4813 ,  G01S17/026 ,  G06F1/1656 ,  H01L23/552 ,  H01L25/167 ,  H01L31/101 ,  H04M1/72563 ,  H05K5/0217

Abstract: An electronic device is provided, which includes an enclosure, an output component, a display screen and an optical sensor. The output component and the display screen are mounted on the enclosure. The output component includes a packaging shell, an infrared supplementary lighting lamp and a proximity infrared lamp; the packaging shell includes a packaging substrate; the infrared supplementary lighting lamp and the proximity infrared lamp are packaged in the packaging shell and born on the packaging substrate. The display screen is provided with a non-opaque entity region and includes a front surface capable of displaying a picture and a back surface back on to the front surface. The optical sensor is arranged on a side, where the back surface is positioned, of the display screen and corresponds to the non-opaque entity region.

公开(公告)号：US10002896B2

公开(公告)日：2018-06-19

申请号：US13379263

申请日：2010-06-21

Applicant: Wolfgang Reinert ,  Jochen Quenzer ,  Sebastien Tinnes ,  Cécile Roman

Inventor： Wolfgang Reinert ,  Jochen Quenzer ,  Sebastien Tinnes ,  Cécile Roman

IPC: H05K5/00 ,  C25D5/02 ,  H05K13/00 ,  H01L27/146 ,  G01J5/04 ,  G01J5/08

CPC classification number: H01L27/14618 ,  G01J5/045 ,  G01J5/0875 ,  H01L27/14649 ,  H01L27/14683 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Infrared radiation micro device, cover for such a device and method for its fabrication, the device comprising a substrate and a cover and an infrared radiation detecting, emitting or reflecting infrared micro unit, the infrared micro unit being arranged in a cavity defined between the substrate and the cover, the cover comprising an antireflective surface texture to enhance the transmissibility of infrared radiation, wherein a distance frame formed in an additive process on the substrate side of the cover and/or the cover side of the substrate is arranged between substrate and cover.

公开(公告)号：US09966493B2

公开(公告)日：2018-05-08

申请号：US13553290

申请日：2012-07-19

Applicant: Hartmut Rudmann ,  Markus Rossi

Inventor： Hartmut Rudmann ,  Markus Rossi

IPC: H01L31/16 ,  G02B13/00 ,  H01L27/146 ,  G02B3/00 ,  G01J1/02 ,  G01J5/04 ,  G01J5/02 ,  G01J5/08 ,  G01J5/20 ,  G01J5/00 ,  G01J1/42 ,  H01L31/0232 ,  H01L25/16 ,  B29D11/00 ,  G01J1/06 ,  H01L31/167 ,  G01J1/04

CPC classification number: H01L31/16 ,  B29D11/00298 ,  B29D11/00307 ,  G01J1/0209 ,  G01J1/0233 ,  G01J1/0271 ,  G01J1/0411 ,  G01J1/06 ,  G01J1/42 ,  G01J5/00 ,  G01J5/022 ,  G01J5/0235 ,  G01J5/024 ,  G01J5/0265 ,  G01J5/045 ,  G01J5/0806 ,  G01J5/20 ,  G01J2001/061 ,  G02B3/0031 ,  G02B3/0056 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14687 ,  H01L31/02325 ,  H01L31/167 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

公开(公告)号：US09939323B2

公开(公告)日：2018-04-10

申请号：US13793265

申请日：2013-03-11

Applicant: Illinois Tool Works Inc.

Inventor： Thomas W. Smith

IPC: G01J5/34 ,  G01J5/04 ,  G01J5/08 ,  G01J1/02

CPC classification number: G01J5/34 ,  G01J1/0266 ,  G01J5/045 ,  G01J5/0871

Abstract: Sensors, systems including sensors, and methods of using such sensors and systems are provided. In one aspect, a sensor includes a sensor element at least partially positioned within the housing. The sensor element includes a plurality of interconnected segments with each segment comprising a pyroelectric crystal and wherein the sensor may generate a single, unitary signal upon exposure of any segment to infrared radiation.

公开(公告)号：US20180011232A1

公开(公告)日：2018-01-11

申请号：US15633863

申请日：2017-06-27

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Toshimitsu KAWAI ,  Katsumi SHIBAYAMA ,  Takashi KASAHARA ,  Masaki HIROSE ,  Hiroki OYAMA ,  Yumi TERAMACHI

IPC: G02B5/28 ,  G01J1/04

CPC classification number: G02B5/285 ,  G01J1/0488 ,  G01J5/023 ,  G01J5/0235 ,  G01J5/024 ,  G01J5/041 ,  G01J5/045 ,  G01J5/06 ,  G01J5/0862 ,  G02B5/288 ,  G02B26/001

Abstract: A Fabry-Perot interference filter includes: a substrate having a first surface and a second surface facing each other; a first layer structure disposed on the first surface; and a second layer structure disposed on the second surface, wherein the first layer structure is provided with a first mirror portion and a second mirror portion facing each other with an air gap therebetween, and a distance between the first mirror portion and the second mirror portion is varied, and the second layer structure is formed with a separation region separating at least a part of the second layer structure into one side and another side in a direction along the second surface.

公开(公告)号：US09831371B2

公开(公告)日：2017-11-28

申请号：US15048177

申请日：2016-02-19

Applicant: Commissariat A L'Energie Atomique et aux Energies Alternatives

Inventor： Geoffroy Dumont ,  Laurent Carle ,  Pierre Imperinetti ,  Stephane Pocas ,  Jean-Jacques Yon

IPC: H01L31/09 ,  G01J5/04 ,  G01J5/02 ,  G01J5/20 ,  H01L31/0203 ,  H01L31/0224 ,  H01L37/00

CPC classification number: H01L31/09 ,  G01J5/0225 ,  G01J5/045 ,  G01J5/20 ,  H01L31/0203 ,  H01L31/0224 ,  H01L37/00

Abstract: A device for detecting electromagnetic radiation is provided, including a substrate; at least one thermal detector placed on the substrate; and an encapsulating structure encapsulating the detector, including a thin encapsulating layer of a material that is transparent to said radiation, extending around and above the detector so as to define with the substrate a cavity in which the detector is located; wherein the thin encapsulating layer comprises a peripheral wall that encircles the detector, and that has a cross section, in a plane parallel to the plane of the substrate, of square or rectangular shape, corners of which are rounded.

公开(公告)号：US09570633B2

公开(公告)日：2017-02-14

申请号：US14570949

申请日：2014-12-15

Applicant: XINTEC INC.

Inventor： Chien-Hung Liu

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/02 ,  H01L35/34 ,  H01L35/02 ,  H01L23/31 ,  H01L23/498 ,  H01L23/053 ,  H01L23/00

CPC classification number: H01L35/08 ,  G01J5/024 ,  G01J5/045 ,  G01J5/20 ,  H01L21/78 ,  H01L23/053 ,  H01L23/3178 ,  H01L23/3185 ,  H01L23/498 ,  H01L24/33 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/1876 ,  H01L35/02 ,  H01L35/10 ,  H01L35/34 ,  H01L2224/11

Abstract: A semiconductor package includes a substrate, at least one support, a cover, and a plate. The substrate has at least one light sensor or thermal sensor, a first surface, and a second surface opposite to the first surface. The light sensor or the thermal sensor is disposed on the first surface. The second surface has an opening to expose the light sensor (or the thermal sensor). The support is disposed on the first surface. The cover is disposed on the support, such that the cover is above the light sensor (or the thermal sensor) to form a first space between the cover and the light sensor (or the thermal sensor). The plate is placed on the second surface to cover the opening, such that a second space is formed between the plate and the light sensor (or the thermal sensor).

Abstract translation: 半导体封装包括基板，至少一个支撑件，盖板和板。 衬底具有至少一个光传感器或热传感器，第一表面和与第一表面相对的第二表面。 光传感器或热传感器设置在第一表面上。 第二表面具有露出光传感器（或热传感器）的开口。 支撑件设置在第一表面上。 盖子设置在支撑件上，使得盖子在光传感器（或热传感器）上方，以在盖和光传感器（或热传感器）之间形成第一空间。 板被放置在第二表面上以覆盖开口，使得在板和光传感器（或热传感器）之间形成第二空间。

公开(公告)号：US09528879B2

公开(公告)日：2016-12-27

申请号：US14761807

申请日：2014-01-20

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yoshifumi Watabe ,  Sadayuki Sumi ,  Yuichi Inaba ,  Junichi Hozumi ,  Takahiko Hirai ,  Tsuyoshi Kuroda

IPC: G01J5/00 ,  G01J5/16 ,  H01L37/02 ,  G01J5/04 ,  G01J5/08 ,  G01J3/42 ,  G01J5/34 ,  G01J1/02

CPC classification number: G01J5/0014 ,  G01J1/0271 ,  G01J3/42 ,  G01J5/045 ,  G01J5/046 ,  G01J5/0815 ,  G01J5/0831 ,  G01J5/0853 ,  G01J5/0862 ,  G01J5/0875 ,  G01J5/16 ,  G01J5/34 ,  H01L37/02

Abstract: An infrared detection element includes first and second pyroelectric elements which are arranged in a single pyroelectric substrate. First pyroelectric element includes a first surface electrode, a first back face electrode, and a first portion interposed between first surface and back face electrodes. First portion is provided as part of pyroelectric substrate. Second pyroelectric element includes a second surface electrode, a second back face electrode, and a second portion interposed between second surface and back face electrodes. Second portion is provided as part of pyroelectric substrate. Pyroelectric substrate is provided in part thereof surrounding first pyroelectric element with a slit shaped along an outer periphery of first pyroelectric element. Slit is formed out of regions in which a first surface wiring and a first back face wiring are disposed. Part of pyroelectric substrate surrounding second pyroelectric element is continuously formed over an entire circumference of second portion.

Abstract translation: 红外线检测元件包括布置在单个热电基底中的第一和第二热电元件。 第一热释电元件包括​​第一表面电极，第一背面电极和介于第一表面和背面电极之间的第一部分。 第一部分被提供为热电基片的一部分。 第二热电元件包括​​第二表面电极，第二背面电极和介于第二表面和背面电极之间的第二部分。 第二部分被提供为热电基片的一部分。 热电基板的一部分设置有第一热电元件，沿着第一热电元件的外周形成有狭缝。 在其中设置有第一表面布线和第一背面布线的区域中形成狭缝。 围绕第二热电元件的热电基板的一部分在第二部分的整个圆周上连续地形成。