公开(公告)号：US07148785B2

公开(公告)日：2006-12-12

申请号：US10835655

申请日：2004-04-30

Applicant: Paul N. Becker ,  Sirikhit Maniraj ,  Martin Pineda ,  Anthony Vranicar ,  Francis M. Yankello ,  Frank Wasilewski

Inventor： Paul N. Becker ,  Sirikhit Maniraj ,  Martin Pineda ,  Anthony Vranicar ,  Francis M. Yankello ,  Frank Wasilewski

IPC: H01C7/10

CPC classification number: H01C1/016 ,  H01C1/1406 ,  H01C1/144 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10643 ,  Y02P70/613

Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5,7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion. The first attachment portion may contain a slot (49) and a solid hinge portion (51). When the device is mounted on a substrate by means of a mounting component (41) extending from the first terminal, the first flexible portion allows contraction and expansion of the conductive polymer despite the rigid attachment of the mounting component onto the substrate.

Abstract translation: 一种适于表面安装在基板（19）上的电路保护装置（31）。 该装置具有由导电聚合物组合物构成并位于第一和第二电极（5,7）之间的层状PTC电阻元件（3）。 连接到第一电极的是包含导电材料的第一电端子（33），其具有借助于第一连接部分（47）连接到第一柔性部分（39）的第一附接部分（35）。 第一柔性部分的至少一部分不与第一电极连接。 第一附接部分与第一连接部分和第一柔性部分中的至少一个共面。 第一附接部分可以包含槽（49）和实心铰链部分（51）。 当通过从第一端子延伸的安装部件（41）将装置安装在基板上时，尽管将安装部件刚性地附接到基板上，但是第一柔性部分允许导电聚合物的收缩和膨胀。

公开(公告)号：US20050225408A1

公开(公告)日：2005-10-13

申请号：US10944181

申请日：2004-09-20

Applicant: Takatoshi Yagisawa ,  Tadashi Ikeuchi

Inventor： Takatoshi Yagisawa ,  Tadashi Ikeuchi

IPC: H01P1/00 ,  H01P1/201 ,  H01P1/203 ,  H01P3/02 ,  H01P5/02 ,  H01P5/08 ,  H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  H01P3/08

CPC classification number: H01P1/203 ,  H01P1/2013 ,  H05K1/0231 ,  H05K1/0239 ,  H05K1/184 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09481 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611

Abstract: In the direct current cut structure of the present invention, two capacitors are provided in parallel between signal transmission line patterns facing each other on a substrate, and each of the two capacitors is electrically connected to each surface of each transmission line pattern that is exposed through a hole part provided on the substrate. It is preferable for the two capacitors to have different capacity. If there is no need to cover such a broad band, only one capacitor can also connected to either side of each transmission line pattern exposed through the hole part.

Abstract translation: 在本发明的直流切断结构中，在基板上彼此面对的信号传输线图案之间并联设置两个电容器，并且两个电容器中的每一个电连接到每个传输线图案的暴露于 设置在基板上的孔部。 两个电容器的电容最好具有不同的容量。 如果不需要覆盖这样的宽带，则只有一个电容器也可以连接到通过孔部分暴露的每个传输线图案的任一侧。

公开(公告)号：US20050200447A1

公开(公告)日：2005-09-15

申请号：US10802127

申请日：2004-03-15

Applicant: Daniel Chandler ,  Matthew Galla

Inventor： Daniel Chandler ,  Matthew Galla

IPC: H01C1/14 ,  H01C1/144 ,  H01C7/02 ,  H05K3/32 ,  H01M2/00

CPC classification number: H01C1/1406 ,  H01C1/144 ,  H01C7/02 ,  H05K3/328 ,  H05K2201/10492 ,  H05K2201/10643

Abstract: A surface mount circuit protection device includes a laminar PTC resistive element having first and second major surfaces and a thickness therebetween. A first electrode layer substantially coextensive the first surface is formed of a first metal material of a type adapted to be soldered to a printed circuit substrate. A second electrode layer formed at the second major surface includes structure forming or defining a weld plate. The metal weld plate has a thermal mass and thickness capable of withstanding resistance micro spot welding of a strap interconnect without significant resultant damage to the device. The device is preferably surface mounted to a printed circuit board assembly forming a battery protection circuit connected to a battery/cell by battery strap interconnects, wherein one of the battery strap interconnects is micro spot welded to the weld plate of the device.

Abstract translation: 表面安装电路保护装置包括具有第一和第二主表面的层状PTC电阻元件和它们之间的厚度。 基本上共同延伸第一表面的第一电极层由适于焊接到印刷电路基板的第一金属材料形成。 形成在第二主表面处的第二电极层包括形成或限定焊接板的结构。 金属焊接板具有热质量和厚度，能够耐受带状互连的电阻微点焊，而不会对器件造成严重的损害。 该装置优选地表面安装到印刷电路板组件，其形成通过电池带互连连接到电池/电池的电池保护电路，其中电池带互连中的一个被微点焊接到装置的焊接板。

公开(公告)号：US20040223306A1

公开(公告)日：2004-11-11

申请号：US10771166

申请日：2004-02-04

Inventor： Tomokazu Katsuyama

IPC: H05K001/14

CPC classification number: H01P1/047 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2223/665 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01P1/2007 ,  H05K1/0219 ,  H05K1/0231 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: This invention is directed to reduce degradation, loss, and reflection of high frequency signals of a coupling circuit for an alternating current. The coupling circuit, for connecting a first circuit element to a second circuit element, comprises a die capacitor and a chip capacitor connected in parallel to each other. The die capacitor has a first electrode that faces to and is in contact with the first circuit element, and a second electrode that is wire-bonded to the second circuit element. The chip capacitor also has a first electrode that is in contact with the first circuit element and a second electrode that is in contact with the second electrode of the die capacitor. The coupling circuit may show both advantages of superior performance at high frequencies attributed to the die-capacitor and relative large capacitance attributed to the chip-capacitor.

Abstract translation: 本发明旨在减少交流电耦合电路的高频信号的劣化，损耗和反射。 用于将第一电路元件连接到第二电路元件的耦合电路包括彼此并联连接的管芯电容器和片式电容器。 管芯电容器具有面向第一电极并与第一电路元件接触的第一电极，以及与第二电路元件引线接合的第二电极。 芯片电容器还具有与第一电路元件接触的第一电极和与模具电容器的第二电极接触的第二电极。 耦合电路可以显示归因于芯片电容器的高频下的优异性能和归因于芯片电容器的相对大的电容的两个优点。

公开(公告)号：US06489880B2

公开(公告)日：2002-12-03

申请号：US09960787

申请日：2001-09-21

Applicant: Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

Inventor： Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

IPC: H01C713

CPC classification number: H01C1/01 ,  H01C1/014 ,  H01C1/1406 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/062 ,  H05K2201/10378 ,  H05K2201/10643 ,  H05K2201/10659 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

公开(公告)号：US6068947A

公开(公告)日：2000-05-30

申请号：US954975

申请日：1997-10-20

Applicant: Mark E. Tuttle

Inventor： Mark E. Tuttle

IPC: H01M2/10 ,  H01M2/20 ,  H01M6/42 ,  H02J7/00 ,  H04B1/38 ,  H05K3/32 ,  H01M2/24

CPC classification number: H01M2/1066 ,  H01M2/1044 ,  H01M2/204 ,  H02J7/0024 ,  H05K3/321 ,  H01M6/42 ,  H04B1/3883 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/49114

Abstract: Thin-profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate is provided having an outer surface with a pair of spaced electrical contact pads thereon. At least two thin-profile batteries are conductively bonded together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections.

Abstract translation: 描述了薄型电池电路和结构，特别是按钮式电池电路及其构成及其形成方法。 在一个实施方案中，提供了具有外表面的衬底，其上具有一对间隔的电接触焊盘。 至少两个薄型电池在具有最低电池和最上面的电池的堆叠中导电地结合在一起。 电池包括相应的正极和负极。 最下面的电池具有一个正极或负极端子，其粘合地粘合到一对电接触焊盘中的一个，而最上面的电池具有与该对电接触焊盘中的另一个电连接的正或负端子中的一个。 电池可以并联或串联电连接。

公开(公告)号：US6020809A

公开(公告)日：2000-02-01

申请号：US247730

申请日：1999-02-09

Applicant: Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

Inventor： Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

IPC: H01C1/01 ,  H01C1/014 ,  H01C1/14 ,  H01C7/02 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H01C7/10

CPC classification number: H01C1/01 ,  H01C1/014 ,  H01C1/1406 ,  H05K1/0201 ,  H05K1/181 ,  H05K2201/062 ,  H05K2201/10378 ,  H05K2201/10643 ,  H05K2201/10659 ,  H05K2201/2036 ,  H05K3/341 ,  Y02P70/611

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

公开(公告)号：US5898574A

公开(公告)日：1999-04-27

申请号：US926082

申请日：1997-09-02

Applicant: Wiling Tan ,  Raymond Teh Wai Tiong ,  Lian It Song

Inventor： Wiling Tan ,  Raymond Teh Wai Tiong ,  Lian It Song

IPC: H01C1/144 ,  H01C17/00 ,  H05K3/34 ,  H05K7/02

CPC classification number: H01C17/006 ,  H01C1/144 ,  H05K3/3442 ,  H05K2201/0939 ,  H05K2201/09418 ,  H05K2201/09809 ,  H05K2201/10643 ,  Y02P70/613

Abstract: An electrical device (400) includes a substrate (300) having solder pads (215, 220) formed thereon and a self aligning electrical component (200) mounted to the solder pads (215, 220). The self aligning electrical component (200) includes a body having a cylindrical shape, a first terminal (205) formed on an inner region of the body, and a second terminal (210) formed around outer regions of the body surrounding the first terminal (205).

Abstract translation: 电气设备（400）包括其上形成有焊盘（215,220）的衬底（300）和安装到焊盘（215,220）的自对准电子部件（200）。 自对准电子部件（200）包括具有圆筒形状的主体，形成在主体的内部区域上的第一端子（205）和围绕第一端子的主体的外部区域周围形成的第二端子（210） 205）。

公开(公告)号：US4894751A

公开(公告)日：1990-01-16

申请号：US197602

申请日：1988-05-20

Applicant: Ulrich Wehnelt

Inventor： Ulrich Wehnelt

IPC: B32B15/08 ,  H01L21/60 ,  H01L23/498 ,  H01L25/075 ,  H01L33/62 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K3/3442 ,  H01L23/4985 ,  H01L25/0753 ,  H05K1/184 ,  H05K3/326 ,  H01L2924/0002 ,  H01L33/62 ,  H05K1/183 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/10454 ,  H05K2201/1059 ,  H05K2201/10643 ,  H05K2203/1105 ,  H05K2203/1189 ,  Y02P70/613

Abstract: An easily automated and heat-stable semiconductor contacting system for linear and planar SMD components, particularly LED arrangements. SMD components are applied to a carrier film coated with interconnects. The interconnects are entirely or partly formed of solderable material for simpler contacting through melting.

Abstract translation: 一种易于自动化和热稳定的用于线性和平面SMD元件的半导体接触系统，特别是LED布置。 将SMD组件应用于涂覆有互连件的载体膜。 互连件完全或部分地由可焊接材料形成，以通过熔化更简单地接触。

公开(公告)号：US4359701A

公开(公告)日：1982-11-16

申请号：US212099

申请日：1980-12-02

Applicant: Kazuharu Aoki

Inventor： Kazuharu Aoki

IPC: H04B1/08 ,  H01P5/02 ,  H01P7/04 ,  H03J1/00 ,  H03J3/18 ,  H03J3/20 ,  H04N5/64 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/184 ,  H01P5/02 ,  H03J3/185 ,  H05K1/0243 ,  H01R12/523 ,  H05K1/0237 ,  H05K2201/043 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10295 ,  H05K2201/10371 ,  H05K2201/10454 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/4046 ,  Y02P70/611

Abstract: A printed circuit board lamination consisting of upper and lower printed circuit boards is provided with an area consisting of the sole lower printed circuit board, and a varactor diode and a resonance rod portion parallel to the lamination are arranged in this area. Thus, the length of lead of the varactor diode is reduced in effect, and also the effects of variation of the dielectric constant of the printed circuit board due to changes of the temperature thereof and relative humidity are reduced.

Abstract translation: 由上下印刷电路板组成的印刷电路板层叠件设置有由底部下印刷电路板组成的区域，并且在该区域中布置变容二极管和平行于层压件的共振杆部分。 因此，变容二极管的引线长度有效地降低，并且由于温度和相对湿度的变化也导致印刷电路板的介电常数的变化的影响降低。