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    Chemically sintered composite electrodes and manufacturing processes
    3.
    发明申请
    Chemically sintered composite electrodes and manufacturing processes 有权
    化学烧结复合电极及制造工艺

    公开(公告)号：US20090035633A1

    公开(公告)日：2009-02-05

    申请号：US11888943

    申请日：2007-08-03

    申请人： John Rule ,  Samuel B. Schaevitz ,  Zachary Byars ,  Ramanan Ganeshananthan ,  Atul Verma ,  Vladimir Petrovsky

    发明人： John Rule ,  Samuel B. Schaevitz ,  Zachary Byars ,  Ramanan Ganeshananthan ,  Atul Verma ,  Vladimir Petrovsky

    IPC分类号： H01M8/10 ,  B05D5/12 ,  B32B5/16

    CPC分类号： H01M8/1213 ,  H01M4/8652 ,  H01M4/8657 ,  H01M4/8828 ,  H01M4/8885 ,  H01M8/1004 ,  H01M8/1097 ,  H01M8/1246 ,  H01M8/1286 ,  Y02E60/521 ,  Y02E60/525 ,  Y02P70/56 ,  Y10T428/25

    摘要： An iterative process of depositing on a solid electrolyte a coating of unconnected particles composed of an ionically conductive material. A liquid solution is also applied. The liquid solution includes an inorganic component. The deposited liquid is heated to a temperature sufficient to evaporate or otherwise remove some or all of the volatile components of the liquid solution. Typically the temperature is below 1000° and often at about 850° C. The effect of heating the solution is to cause ion conducting material in the solution to adhere to the surface of the existing ion conducting particles and form connections between these particles. This is understood to create an ion conducting skeletal support structure. Within the intrestices of this skeletal support structure, the step of heating is also understood to result in the deposition of the inorganic component that will begin to form a electron conducting structure. The process of applying the liquid solution and heating may be repeated until a sufficiently thick layer of material is laid over the solid electrolyte to provide the composite electrode structure desired.

    摘要翻译： 在固体电解质上沉积由离子导电材料组成的未连接颗粒的涂层的迭代过程。 还应用液体溶液。 液体溶液包含无机成分。 将沉积的液体加热到足以蒸发或以其它方式除去液体溶液的一些或全部挥发性组分的温度。 通常，温度低于1000°，通常在约850℃。加热溶液的效果是使溶液中的离子传导材料粘附到现有离子传导颗粒的表面上并形成这些颗粒之间的连接。 这被理解为产生离子导电骨架支撑结构。 在该骨骼支撑结构的内部，加热步骤也被理解为导致开始形成电子传导结构的无机组分的沉积。 可以重复施加液体溶液和加热的过程，直到将足够厚的材料层铺在固体电解质上以提供所需的复合电极结构。

    Chemically sintered composite electrodes and manufacturing processes
    7.
    发明授权
    Chemically sintered composite electrodes and manufacturing processes 有权
    化学烧结复合电极及制造工艺

    公开(公告)号：US09583778B2

    公开(公告)日：2017-02-28

    申请号：US11888943

    申请日：2007-08-03

    申请人： Samuel B. Schaevitz ,  Zachary Byars ,  Ramanan Ganeshananthan ,  Atul Verma ,  John Rule

    发明人： Samuel B. Schaevitz ,  Zachary Byars ,  Ramanan Ganeshananthan ,  Atul Verma ,  Vladimir Petrovsky ,  John Rule

    IPC分类号： H01M8/1213 ,  H01M8/1286 ,  H01M8/1004 ,  H01M8/1097 ,  H01M8/1246 ,  H01M8/12 ,  H01M4/86 ,  H01M4/88 ,  H01M8/10

    CPC分类号： H01M8/1213 ,  H01M4/8652 ,  H01M4/8657 ,  H01M4/8828 ,  H01M4/8885 ,  H01M8/1004 ,  H01M8/1097 ,  H01M8/1246 ,  H01M8/1286 ,  Y02E60/521 ,  Y02E60/525 ,  Y02P70/56 ,  Y10T428/25

    摘要： An iterative process of depositing on a solid electrolyte a coating of unconnected particles composed of an ionically conductive material. A liquid solution is also applied. The liquid solution includes an inorganic component. The deposited liquid is heated to a temperature sufficient to evaporate or otherwise remove some or all of the volatile components of the liquid solution. Typically the temperature is below 1000° and often at about 850° C. The effect of heating the solution is to cause ion conducting material in the solution to adhere to the surface of the existing ion conducting particles and form connections between these particles. This is understood to create an ion conducting skeletal support structure. Within the intrestices of this skeletal support structure, the step of heating is also understood to result in the deposition of the inorganic component that will begin to form a electron conducting structure. The process of applying the liquid solution and heating may be repeated until a sufficiently thick layer of material is laid over the solid electrolyte to provide the composite electrode structure desired.

    摘要翻译： 在固体电解质上沉积由离子导电材料组成的未连接颗粒的涂层的迭代过程。 还应用液体溶液。 液体溶液包含无机成分。 将沉积的液体加热到足以蒸发或以其它方式除去液体溶液的一些或全部挥发性组分的温度。 通常，温度低于1000°，通常在约850℃。加热溶液的效果是使溶液中的离子传导材料粘附到现有离子传导颗粒的表面上并形成这些颗粒之间的连接。 这被理解为产生离子导电骨架支撑结构。 在该骨骼支撑结构的内部，加热步骤也被理解为导致开始形成电子传导结构的无机组分的沉积。 可以重复施加液体溶液和加热的过程，直到将足够厚的材料层铺在固体电解质上以提供所需的复合电极结构。

    Method, system and device for handling a memory management fault in a multiple processor device
    8.
    发明授权
    Method, system and device for handling a memory management fault in a multiple processor device 有权
    用于处理多处理器设备中的存储器管理故障的方法，系统和设备

    公开(公告)号：US07681012B2

    公开(公告)日：2010-03-16

    申请号：US11699562

    申请日：2007-01-30

    申请人： Atul Verma ,  Samant Kumar

    发明人： Atul Verma ,  Samant Kumar

    IPC分类号： G06F13/00

    CPC分类号： G06F12/10 ,  G06F2212/1032

    摘要： A method or device handles memory management faults in a device having a digital signal processor (“DSP”) and a microprocessor. The DSP includes a memory management unit (“DSP MMU”) to manage memory access by the DSP, and the DSP and the microprocessor access shared physical memory. Upon the DSP executing an instruction attempting to access a virtual address wherein the virtual address is invalid, a page fault interrupt is generated by the DSP MMU. A microprocessor interrupt handler in the microprocessor is activated in direct response to the page fault interrupt. Thereafter in the microprocessor, a translation lookaside buffer (“TLB”) entry is created in the DSP MMU, which includes a valid mapping between the virtual address and a page of physical memory. After creating the TLB entry, the microprocessor indicates to the DSP that the access by the DSP of the virtual address is completed.

    摘要翻译： 方法或设备处理具有数字信号处理器（“DSP”）和微处理器的设备中的存储器管理故障。 DSP包括一个内存管理单元（“DSP MMU”），用于管理DSP的存储器访问，DSP和微处理器访问共享的物理内存。 在DSP执行试图访问虚拟地址无效的虚拟地址的指令时，由DSP MMU产生寻呼故障中断。 微处理器中的微处理器中断处理程序是直接响应页错误中断而被激活的。 此后在微处理器中，在DSP MMU中创建翻译后备缓冲器（“TLB”）条目，其包括虚拟地址和物理存储器页之间的有效映射。 在创建TLB条目之后，微处理器向DSP指示DSP访问虚拟地址。

    SOLID OXIDE ELECTROCHEMICAL DEVICES HAVING A DIMENSIONALLY STABLE BONDING AGENT TO BOND AN ANODE TO ANODE INTERCONNECT AND METHODS
    10.
    发明申请
    SOLID OXIDE ELECTROCHEMICAL DEVICES HAVING A DIMENSIONALLY STABLE BONDING AGENT TO BOND AN ANODE TO ANODE INTERCONNECT AND METHODS 审中-公开
    具有尺寸稳定的粘结剂的固体氧化物电化学装置将阳极粘合到阳极互连和方法

    公开(公告)号：US20070134540A1

    公开(公告)日：2007-06-14

    申请号：US11164941

    申请日：2005-12-12

    申请人： Atul Verma ,  Shekhar Kamat

    发明人： Atul Verma ,  Shekhar Kamat

    IPC分类号： H01M2/08 ,  H01M8/12

    CPC分类号： H01M8/0273 ,  H01M8/0217 ,  H01M8/0247 ,  H01M8/0282 ,  H01M2008/1293 ,  Y10T29/49114

    摘要： A solid oxide electrochemical device having improved mechanical integrity comprising a bonding agent for physically and electrically bonding an anode to an anode interconnect, the bonding agent comprising a particulate metal, wherein the bonding agent is substantially chemically inert during operation of the solid oxide electrochemical device. A method for bonding an anode and an anode interconnect to be used in a solid oxide electrochemical device.

    摘要翻译： 一种具有改进的机械完整性的固体氧化物电化学装置，其包括用于将阳极物理和电连接到阳极互连的粘合剂，所述粘合剂包含颗粒状金属，其中所述粘合剂在固体氧化物电化学装置的操作期间基本上是化学惰性的。 用于将固体氧化物电化学装置中使用的阳极和阳极互连件接合的方法。