公开(公告)号：US20090250824A1

公开(公告)日：2009-10-08

申请号：US12098311

申请日：2008-04-04

申请人： Xiwang Qi ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy ,  Isao Yamada

发明人： Xiwang Qi ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy ,  Isao Yamada

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H05K3/3426 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00

摘要： A semiconductor package comprises a substrate that utilizes one or more pins to form external interconnects. The pins are bonded to bonding pads on the substrate by solder. The pins may each has a pin head that may have a bonding surface, wherein the bonding surface may comprises a center portion and a side portion that is tapered away relative to the center portion. In some embodiments, the bonding surface may comprise a round shape. In some embodiments, a gas escape path may be provided by the shape of the bonding surface to increase pin pull strength and/or solder strength. The package may further comprise a surface finish that may comprise a palladium layer with a reduced thickness to reduce the amount of palladium based IMC precipitation into the solder.

摘要翻译： 半导体封装包括利用一个或多个引脚形成外部互连的基板。 引脚通过焊料与基板上的焊盘接合。 销可以各自具有可以具有接合表面的销头，其中接合表面可以包括中心部分和相对于中心部分逐渐变细的侧部部分。 在一些实施例中，接合表面可以包括圆形。 在一些实施例中，可以通过接合表面的形状提供气体逸出路径，以增加引脚拉伸强度和/或焊接强度。 该封装还可以包括表面光洁度，其可以包括具有减小厚度的钯层，以减少基于钯的IMC沉淀到焊料中的量。

公开(公告)号：US20150179600A1

公开(公告)日：2015-06-25

申请号：US14641056

申请日：2015-03-06

申请人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy

发明人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/11464 ,  H01L2224/13 ,  H01L2224/13017 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/35 ,  H05K3/244 ,  H01L2924/00

摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

摘要翻译： 提供了一种用于输入/输出连接的方法和装置。 用于连接结构的装置和方法显示出具有改善的机械性能，例如硬度和耐磨性。 提供了由于诸如金的材料成本的降低而制造成本较低的土地格栅阵列结构。 球栅阵列结构在制造过程中具有改善的耐腐蚀性。 球栅阵列结构还具有改善的机械性能，从而提高了冲击测试结果。

公开(公告)号：US07749900B2

公开(公告)日：2010-07-06

申请号：US12242414

申请日：2008-09-30

申请人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

发明人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

IPC分类号： H01L21/02

CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/12 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/0029 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/10674 ,  H01L2224/0401

摘要： A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element.

摘要翻译： 半导体封装包括可包括芯的半导体衬底。 芯可以包括选自包括陶瓷和玻璃电介质的组中的一种或多种材料。 所述封装还包括设置在所述芯上的一组或多个内部导电元件，设置在所述基板的外侧上的一组或多个外部导电元件的集合，以及半导体管芯，以通过 一个或多个外部导电元件。 芯的示例性材料可以包括氧化铝，氧化锆，碳化物，氮化物，熔融二氧化硅，石英，蓝宝石和派雷克斯中的一种或多种。 可以使用激光器来钻一个或多个电镀通孔，以将内部导电元件耦合到外部导电元件。 介电层可以形成在衬底中以使外部导电元件与芯或内部导电元件绝缘。

公开(公告)号：US08456016B2

公开(公告)日：2013-06-04

申请号：US12729821

申请日：2010-03-23

申请人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

发明人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

IPC分类号： H01L23/48

CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/12 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/0029 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/10674 ,  H01L2224/0401

摘要： A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element.

摘要翻译： 半导体封装包括可包括芯的半导体衬底。 芯可以包括选自包括陶瓷和玻璃电介质的组中的一种或多种材料。 所述封装还包括设置在所述芯上的一组或多个内部导电元件，设置在所述基板的外侧上的一组或多个外部导电元件的集合，以及半导体管芯，以通过 一个或多个外部导电元件。 芯的示例性材料可以包括氧化铝，氧化锆，碳化物，氮化物，熔融二氧化硅，石英，蓝宝石和派雷克斯中的一种或多种。 可以使用激光器来钻一个或多个电镀通孔，以将内部导电元件耦合到外部导电元件。 介电层可以形成在衬底中以使外部导电元件与芯或内部导电元件绝缘。

公开(公告)号：US20100289154A1

公开(公告)日：2010-11-18

申请号：US12729821

申请日：2010-03-23

申请人： Yonggang Li ,  Amruthavalll P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

发明人： Yonggang Li ,  Amruthavalll P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

IPC分类号： H01L23/48

CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/12 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/0029 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/10674 ,  H01L2224/0401

摘要： A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element.

公开(公告)号：US20100078805A1

公开(公告)日：2010-04-01

申请号：US12242414

申请日：2008-09-30

申请人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

发明人： Yonggang Li ,  Amruthavalli P. Alur ,  Devarajan Balaraman ,  Xiwang Qi ,  Charan K. Gurumurthy

IPC分类号： H01L23/48 ,  H01L23/535 ,  H01L21/02

CPC分类号： H01L23/15 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/12 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/0029 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4605 ,  H05K2201/10674 ,  H01L2224/0401

摘要： A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element.

摘要翻译： 半导体封装包括可包括芯的半导体衬底。 芯可以包括选自包括陶瓷和玻璃电介质的组中的一种或多种材料。 所述封装还包括设置在所述芯上的一组或多个内部导电元件，设置在所述基板的外侧上的一组或多个外部导电元件的集合，以及半导体管芯，以通过 一个或多个外部导电元件。 芯的示例性材料可以包括氧化铝，氧化锆，碳化物，氮化物，熔融二氧化硅，石英，蓝宝石和派雷克斯中的一种或多种。 可以使用激光器来钻一个或多个电镀通孔，以将内部导电元件耦合到外部导电元件。 介电层可以形成在衬底中以使外部导电元件与芯或内部导电元件绝缘。

公开(公告)号：US20150181713A1

公开(公告)日：2015-06-25

申请号：US14227697

申请日：2014-03-27

申请人： Ching-Ping Janet Shen ,  Charan K. Gurumurthy ,  Dilan Seneviratne ,  Ravi Shankar ,  Liwen Jin ,  Deepak Arora

发明人： Ching-Ping Janet Shen ,  Charan K. Gurumurthy ,  Dilan Seneviratne ,  Ravi Shankar ,  Liwen Jin ,  Deepak Arora

IPC分类号： H05K1/18 ,  B32B3/26 ,  B32B37/12 ,  H05K3/30 ,  B32B37/14 ,  H05K1/02 ,  B32B15/20

CPC分类号： H05K1/183 ,  B32B3/263 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B37/10 ,  B32B37/1284 ,  B32B2307/202 ,  B32B2457/08 ,  H01L23/13 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/185 ,  H05K3/284 ,  Y10T428/24612 ,  Y10T428/2495 ,  Y10T428/31678 ,  H01L2924/00

摘要： Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.

摘要翻译： 本文通常讨论的是可以包括可释放的核心面板的系统和装置。 本公开还包括制造和使用系统和装置的技术。 根据一个实例，制造可释放的芯板的技术可以包括将内箔连接到基底上，将粘合剂层定位在内箔上，使得内箔基本上与基底的周边齐平，将外导电 或者利用保护材料覆盖粘合层，内箔和外导电箔之间的界面。

公开(公告)号：US07402515B2

公开(公告)日：2008-07-22

申请号：US11169595

申请日：2005-06-28

申请人： Leonel R. Arana ,  Devendra Natekar ,  Michael Newman ,  Charan K. Gurumurthy

发明人： Leonel R. Arana ,  Devendra Natekar ,  Michael Newman ,  Charan K. Gurumurthy

IPC分类号： H01L21/4763 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

摘要： A method of forming a via having a stress buffer collar, wherein the stress buffer collar can absorb stress resulting from a mismatch in the coefficients of thermal expansion of the surrounding materials. Other embodiments are described and claimed.

公开(公告)号：US09698114B2

公开(公告)日：2017-07-04

申请号：US13071841

申请日：2011-03-25

申请人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Selvy Tamil Selvamuniandy

发明人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Selvy Tamil Selvamuniandy

IPC分类号： H01L29/40 ,  H01L23/00 ,  H05K3/24

CPC分类号： H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/11464 ,  H01L2224/13 ,  H01L2224/13017 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/35 ,  H05K3/244 ,  H01L2924/00

摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

公开(公告)号：US07915060B2

公开(公告)日：2011-03-29

申请号：US12714310

申请日：2010-02-26

申请人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Selvy Tamil Selvamuniandy

发明人： Munehiro Toyama ,  Siew Fong Tai ,  Kian Sin Sim ,  Charan K. Gurumurthy ,  Selvy Tamil Selvamuniandy

IPC分类号： H01L21/00 ,  H01L23/48

CPC分类号： H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/11 ,  H01L24/14 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05599 ,  H01L2224/11464 ,  H01L2224/13 ,  H01L2224/13017 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13564 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/35 ,  H05K3/244 ,  H01L2924/00

摘要： A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

摘要翻译： 提供了一种用于输入/输出连接的方法和装置。 用于连接结构的装置和方法显示出具有改善的机械性能，例如硬度和耐磨性。 提供了由于诸如金的材料成本的降低而制造成本较低的土地格栅阵列结构。 球栅阵列结构在制造过程中具有改善的耐腐蚀性。 球栅阵列结构还具有改善的机械性能，从而提高了冲击测试结果。