SILICON OXIDE DEPOSITION METHOD
    2.
    发明申请

    公开(公告)号:US20220084817A1

    公开(公告)日:2022-03-17

    申请号:US17472981

    申请日:2021-09-13

    IPC分类号: H01L21/02

    摘要: The current disclosure relates to methods of depositing silicon oxide on a substrate, methods of forming a semiconductor device and a method of forming a structure. The method comprises providing a substrate in a reaction chamber, providing a silicon precursor in the reaction chamber, the silicon precursor comprising a silicon atom connected to at least one oxygen atom, the at least one oxygen atom being connected to a carbon atom, and providing a reactant comprising hydrogen atoms in the reaction chamber to form silicon oxide on the substrate.

    PLASMA ENHANCED DEPOSITION PROCESSES FOR CONTROLLED FORMATION OF METAL OXIDE THIN FILMS

    公开(公告)号:US20180350587A1

    公开(公告)日:2018-12-06

    申请号:US15971601

    申请日:2018-05-04

    IPC分类号: H01L21/02 H01L21/311

    摘要: Methods for depositing oxide thin films, such as metal oxide, metal silicates, silicon oxycarbide (SiOC) and silicon oxycarbonitride (SiOCN) thin films, on a substrate in a reaction space are provided. The methods can include at least one plasma enhanced atomic layer deposition (PEALD) cycle including alternately and sequentially contacting the substrate with a first reactant that comprises oxygen and a component of the oxide, and a second reactant comprising reactive species that does not include oxygen species. In some embodiments the plasma power used to generate the reactive species can be selected from a range to achieve a desired step coverage or wet etch rate ratio (WERR) for films deposited on three dimensional features. In some embodiments oxide thin films are selectively deposited on a first surface of a substrate relative to a second surface, such as on a dielectric surface relative to a metal or metallic surface.

    Method of making a resistive random access memory device
    8.
    发明授权
    Method of making a resistive random access memory device 有权
    制造电阻随机存取存储器件的方法

    公开(公告)号:US09472757B2

    公开(公告)日:2016-10-18

    申请号:US14334566

    申请日:2014-07-17

    IPC分类号: H01L45/00 H01L21/02 H01L39/24

    摘要: The disclosed technology generally relates to the field of semiconductor processing and more particularly to resistive random access memory and methods for manufacturing such memory. In one aspect, a method of fabricating a memory cell includes providing a substrate and providing a first electrode on the substrate. The method additionally includes depositing, via atomic layer deposition, a resistive switching material on the first electrode, wherein the resistive switching material comprises an oxide comprising a pnictogen chosen from the group consisting of As, Bi, Sb, and P. The resistive switching material may be doped, e.g., with Sb or an antimony-metal alloy. A second electrode may be formed over and in contact with the resistive switching material.

    摘要翻译: 所公开的技术通常涉及半导体处理领域,更具体地涉及电阻随机存取存储器以及用于制造这种存储器的方法。 一方面,一种制造存储单元的方法包括提供衬底并在衬底上提供第一电极。 该方法还包括通过原子层沉积沉积第一电极上的电阻式开关材料,其中电阻开关材料包括一种氧化物,该氧化物包括选自由As,Bi,Sb和P组成的组的pnictogen。电阻式开关材料 可以掺杂,例如用Sb或锑 - 金属合金。 第二电极可以形成在电阻开关材料之上并与电阻开关材料接触。

    METHOD OF MAKING A RESISTIVE RANDOM ACCESS MEMORY DEVICE
    9.
    发明申请
    METHOD OF MAKING A RESISTIVE RANDOM ACCESS MEMORY DEVICE 有权
    制造电阻随机访问存储器件的方法

    公开(公告)号:US20150021540A1

    公开(公告)日:2015-01-22

    申请号:US14334566

    申请日:2014-07-17

    IPC分类号: H01L45/00

    摘要: The disclosed technology generally relates to the field of semiconductor processing and more particularly to resistive random access memory and methods for manufacturing such memory. In one aspect, a method of fabricating a memory cell includes providing a substrate and providing a first electrode on the substrate. The method additionally includes depositing, via atomic layer deposition, a resistive switching material on the first electrode, wherein the resistive switching material comprises an oxide comprising a pnictogen chosen from the group consisting of As, Bi, Sb, and P. The resistive switching material may be doped, e.g., with Sb or an antimony-metal alloy. A second electrode may be formed over and in contact with the resistive switching material.

    摘要翻译: 所公开的技术通常涉及半导体处理领域,更具体地涉及电阻随机存取存储器以及用于制造这种存储器的方法。 一方面,一种制造存储单元的方法包括提供衬底并在衬底上提供第一电极。 该方法还包括通过原子层沉积沉积第一电极上的电阻式开关材料,其中电阻开关材料包括一种氧化物,该氧化物包括选自由As,Bi,Sb和P组成的组的pnictogen。电阻式开关材料 可以掺杂,例如用Sb或锑 - 金属合金。 第二电极可以形成在电阻开关材料之上并与电阻开关材料接触。