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1.发明申请公开(公告)号：US20150237713A1
公开(公告)日：2015-08-20
申请号：US14184575
申请日：2014-02-19
IPC分类号： H05K1/02 , H01L23/13 , H01L25/00 , H05K3/36 , H01L25/065 , H05K1/14 , H05K1/11 , H01L23/552 , H01L23/538
CPC分类号： H05K1/147 , H01L23/13 , H01L23/49833 , H01L23/552 , H01L25/0655 , H01L25/50 , H01L2224/13025 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73253 , H01L2924/15192 , H01L2924/3025 , H05K1/0218 , H05K3/361 , H05K2201/09245 , H05K2201/09681 , Y10T29/49126
摘要： Embodiments of the present disclosure are directed towards electro-magnetic interference (EMI) shielding techniques and configurations. In one embodiment, an apparatus includes a first substrate, a die having interconnect structures coupled with the first substrate to route input/output (I/O) signals between the die and the first substrate and a second substrate coupled with the first substrate, wherein the die is disposed between the first substrate and the second substrate and at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die. Other embodiments may be described and/or claimed.
摘要翻译： 本公开的实施例涉及电磁干扰（EMI）屏蔽技术和配置。 在一个实施例中，一种装置包括第一衬底，具有与第一衬底耦合的互连结构的管芯以在管芯和第一衬底之间路由输入/输出（I / O）信号和与第一衬底耦合的第二衬底， 芯片设置在第一基板和第二基板之间，并且第一基板和第二基板中的至少一个包括被配置为为管芯提供电磁干扰（EMI）屏蔽的迹线。 可以描述和/或要求保护其他实施例。
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公开(公告)号：US09368455B2
公开(公告)日：2016-06-14
申请号：US14229771
申请日：2014-03-28
IPC分类号： H01L23/00 , H01L23/552 , H01L21/56
CPC分类号： H01L23/552 , H01L21/56 , H01L21/568 , H01L24/16 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/15311 , H01L2924/157 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2224/81
摘要： An electromagnetic interference shield is described for semiconductor chip packages. In some embodiments, a package has a semiconductor die. a redistribution layer, a mold compound over the die, a plurality of vias through the mold compound and outside the die to form a shield, and a metal film over the vias. and over the mold compound.
摘要翻译： 半导体芯片封装描述了电磁干扰屏蔽。 在一些实施例中，封装具有半导体管芯。 再分布层，模具上的模具化合物，通过模具化合物的多个通孔和模具外部以形成屏蔽，以及在通孔上方的金属膜。 并在模具化合物上。
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公开(公告)号：US20190207290A1
公开(公告)日：2019-07-04
申请号：US16325351
申请日：2016-09-30
申请人： Brandon M. Rawlings , Shawna M. Liff , Sasha N. Oster , Georgios C. Dogiamis , Telesphor Kamgaing , Adel A. Elsherbini , Aleksandar Aleksov, I , Johanna M. Swan , Richard J. Dischier
发明人： Brandon M. Rawlings , Shawna M. Liff , Sasha N. Oster , Georgios C. Dogiamis , Telesphor Kamgaing , Adel A. Elsherbini , Aleksandar Aleksov, I , Johanna M. Swan , Richard J. Dischier
CPC分类号： H01P11/002 , H01P3/122 , H01P3/123 , H01P3/14
摘要： A method of making a waveguide, comprises: extruding a first dielectric material as a waveguide core of the waveguide, wherein the waveguide core is elongate; and coextruding an outer layer with the waveguide core, wherein the outer layer is arranged around the waveguide core.
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公开(公告)号：US20170287736A1
公开(公告)日：2017-10-05
申请号：US15085538
申请日：2016-03-30
CPC分类号： H01L23/315 , H01L21/56 , H01L23/3128 , H01L23/42 , H01L23/4334 , H01L23/467 , H01L2224/16227 , H01L2224/97 , H01L2924/14 , H01L2924/15311 , H01L2924/1815 , H01L2924/19105 , H01L2924/3511 , H01L2224/81
摘要： Molded electronics package cavities are formed by placing a sacrificial material in the mold and then decomposing, washing, or etching away this sacrificial material. The electronics package that includes this sacrificial material is then overmolded, with little or no change needed in the overmolding process. Following overmolding, the sacrificial material is removed such as using a thermal, chemical, optical, or other decomposing process. This proposed use of sacrificial material allows for formation of complex 3-D cavities, and reduces or eliminates the need for precise material removal tolerances. Multiple instances of the sacrificial material may be removed simultaneously, replacing a serial drilling process with a parallel material removal manufacturing process.
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公开(公告)号：US20180084643A1
公开(公告)日：2018-03-22
申请号：US15267872
申请日：2016-09-16
申请人： Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
发明人： Amit Sudhir Baxi , Vincent S. Mageshkumar , Adel A. Elsherbini , Sasha Oster , Feras Eid , Aleksandar Aleksov , Johanna M. Swan
CPC分类号： H05K1/147 , A61B5/00 , A61B5/6833 , A61B2562/164 , A61B2562/166 , H05K1/0283 , H05K1/112 , H05K1/181 , H05K3/365 , H05K2201/10151 , H05K2201/10265 , H05K2201/10303 , H05K2201/10318
摘要： A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.
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公开(公告)号：US20140266902A1
公开(公告)日：2014-09-18
申请号：US13799645
申请日：2013-03-13
CPC分类号： H01Q21/293 , H01L2224/16225 , H01P11/00 , H01Q1/36 , H01Q1/50 , H01Q3/24 , H01Q3/26 , H01Q15/08 , H01Q21/061 , H01Q21/065 , H01Q23/00 , H01Q25/00 , Y10T29/49016 , Y10T29/49018
摘要： Embodiments of the present disclosure are directed to a single-package communications device that includes an antenna module with a plurality of independently selectable arrays of antenna elements. The antenna elements of the different arrays may send and/or receive data signals over different ranges of signal angles. The communications device may further include a switch module to separately activate the individual arrays. In some embodiments, a radio frequency (RF) communications module may be included in the package of the communications device. In some embodiments, the RF communications module may be configured to communicate over a millimeter-wave (mm-wave) network using the plurality of arrays of antenna elements.
摘要翻译： 本公开的实施例涉及一种单包装通信设备，其包括具有多个可独立选择的天线元件阵列的天线模块。 不同阵列的天线元件可以在不同的信号角度范围上发送和/或接收数据信号。 通信设备还可以包括用于单独地激活各个阵列的交换机模块。 在一些实施例中，射频（RF）通信模块可以包括在通信设备的包中。 在一些实施例中，RF通信模块可以被配置为使用多个天线元件阵列在毫米波（mm波）网络上进行通信。
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公开(公告)号：US10468737B2
公开(公告)日：2019-11-05
申请号：US15859482
申请日：2017-12-30
摘要： Embodiments include waveguide launchers and connectors (WLCs), and a method of forming a WLC. The WLC has a waveguide connector with a waveguide launcher, a taper, and a slot-line signal converter; and a balun structure on the slot-line signal converter, where the taper is on the slot-line signal converter and a terminal end of the waveguide connector to form a channel and a tapered slot. The WLC may have the waveguide connector disposed on the package, and a waveguide coupled to waveguide connector. The WLC may include assembly pads and external walls of the waveguide connector electrically coupled to package. The WLC may have the balun structure convert a signal to a slot-line signal, and the waveguide launcher converts the slot-line signal to a closed waveguide mode signal, and emits the closed signal along channel and propagates the closed signal along taper slot to the waveguide coupled to waveguide connector.
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公开(公告)号：US10057796B2
公开(公告)日：2018-08-21
申请号：US14552587
申请日：2014-11-25
摘要： Described herein are architectures, platforms and methods for implementing an antenna array with a dynamic polarization adjustment in a portable device.
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公开(公告)号：US09853359B2
公开(公告)日：2017-12-26
申请号：US14038202
申请日：2013-09-26
CPC分类号： H01Q9/0414 , H01L2223/6677 , H01L2224/16227 , H01L2924/15321 , H01Q21/0006 , H01Q21/065 , H01Q21/067 , Y10T29/49016
摘要： An antenna integrated in a package substrate, the antenna comprising an upper antenna element, a lower antenna element and a coupling element disposed between the upper antenna element and the lower antenna element, the coupling element comprising an aperture, and configured to provide a coupling between the upper antenna element and the lower antenna element.
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公开(公告)号：US20170172421A1
公开(公告)日：2017-06-22
申请号：US14971800
申请日：2015-12-16
申请人： Nadine L. Dabby , Adel A. Elsherbini , Sasha Oster , Braxton Lathrop , Aleksandar Aleksov , Feras Eid
发明人： Nadine L. Dabby , Adel A. Elsherbini , Sasha Oster , Braxton Lathrop , Aleksandar Aleksov , Feras Eid
IPC分类号： A61B5/0205 , G06F3/01 , A61B5/00
CPC分类号： A61B5/0205 , A61B5/024 , A61B5/08 , A61B5/11 , A61B5/113 , A61B5/6804 , A61B2562/0219 , A61B2562/12 , G06F3/011 , G06F3/014 , G06F3/017
摘要： A sensor assembly configured to monitor one or more physiological characteristics includes a deformable substrate. The deformable substrate includes a body side interface. Substrate conductive traces are coupled with the deformable substrate. Two or more physiological sensor elements are coupled with the deformable substrate. The two or more physiological sensor elements include at least first and second sensor elements. The first sensor element includes a first piezo element in a first orientation along the deformable substrate, the first sensor element is electrically coupled with the substrate conductive traces. The second sensor element includes a second piezo element in a second orientation along the deformable substrate different than the first orientation, the second sensor element is electrically coupled with the substrate conductive traces.
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