摘要:
A Schottky diode, and a method of making the same, which is fabricated on InP material and employs a Schottky layer including InxAl1−xAS with x>0.6, or else including a chirped graded superlattice in which successive periods of the superlattice contain progressively less GaInAs and progressively more AlInAs, the increase in AlInAs being terminated before the proportion of AlInAs within the last period (adjacent the anode metal) exceeds 80%. Such fabrication creates an InP-based Schottky diode having a low turn-on voltage which may be predictably set within a range by adjusting the fabrication parameters
摘要翻译:肖特基二极管及其制造方法,其制造在InP材料上并且采用包括x> 0.6的In x Al 1-xAS的肖特基层,或者包括啁啾分级超晶格,其中超晶格的连续周期包含逐渐减少的GaInAs 并且逐渐增加AlInAs,AlInAs在上一期(邻近阳极金属)的比例超过80%之前终止的AlInAs的增加。 这种制造产生了具有低导通电压的基于InP的肖特基二极管,其可以通过调整制造参数来预测地设置在一个范围内
摘要:
A Schottky diode, and a method of making the same, which is fabricated on InP material and employs a Schottky layer including InxAl1−xAs with x>0.6, or else including a chirped graded supperlattice in which successive periods of the superlattice contain progressively less GaInAs and progressively more AlInAs, the increase in AlInAs being terminated before the proportion of AlInAs within the last period (adjacent the anode metal) exceeds 80%. Such fabrication creates an InP-based Schottky diode having a low turn-on voltage which may be predictably set within a range by adjusting the fabrication parameters.
摘要翻译:肖特基二极管及其制造方法,其制造在InP材料上,并采用包括x> 0.6的In x Al 1-x As的肖特基层,或者包括啁啾分级超晶格,其中超晶格的连续周期含有逐渐减少的GaInAs 并且逐渐增加AlInAs,AlInAs在上一期(邻近阳极金属)的比例超过80%之前终止的AlInAs的增加。 这种制造产生具有低导通电压的基于InP的肖特基二极管,其可以通过调整制造参数在一定范围内可预测地设置。
摘要:
An analog-to-digital converter 10 employs a series of comparators 12, 14, 16 and 18. Each comparator includes at least one inverter consisting of a CMOS transistor pair including a P-channel transistor 22 and N-channel transistor 24. The threshold levels of the transistors 22, 24 are modified using focused ion beam implantation techniques to provide the comparators with monotonically increasing transistion levels.
摘要:
Apparatus for a micro-electro-mechanical switch that provides single pole, double throw switching action. The switch has two input lines and two output lines. The switch has a seesaw cantilever arm with contacts at each end that electrically connect the input lines with the output lines. The cantilever arm is latched into position by frictional forces between structures on the cantilever arm and structures on the substrate in which the cantilever arm is disposed. The state of the switch is changed by applying an electrostatic force at one end of the cantilever arm to overcome the mechanical force holding the other end of the cantilever arm in place.
摘要:
A semiconductor passivation technique uses a plasma enhanced chemical vapor deposition (PECVD) process to produce a silicon-rich nitride film as a passivation layer on a Group III-V semiconductor device. The silicon-rich film has a nitrogen to silicon ratio of about 0.7, has a relatively high index of refraction of, for example, approximately 2.4, is compressively stressed, and is very low in hydrogen and oxygen content.
摘要:
An integrated circuit module comprising integrated coupling transmission structures protruding from the main body of the integrated circuit with extra substrate material removed around and/or under the coupling transmission structures.
摘要:
Disclosed are methods for fabricating a micro-electro-mechanical switch. The switch has a cantilever arm disposed on a substrate that can be moved in orthogonal directions for latching and unlatching. For latching, the cantilever arm is moved back by a comb-drive actuator and then pulled down by electrodes disposed on the substrate and the cantilever arm. The comb-drive actuator switch is then released and the cantilever arm moves forward to be captured by a dove-tail structure on the substrate. When the voltage is removed, the cantilever arm is held in place by the dove-tail structure. The switch is unlatched by actuating the comb-drive actuator to move the cantilever arm away from the dove-tail structure. The cantilever arm will then pop up once it is released from the dove-tail structure.
摘要:
The tone or polarity of a patterned layer such as a photoresist mask on an integrated circuit or device substrate is reversed with substantially perfect alignment. A liquid planarizing layer is formed and hardened onto the patterned layer and underlying substrate, filling in spaces between pattern areas. The planarizing layer is then etched to a sufficient depth to expose the patterned layer. Finally, the patterned layer is dissolved away, leaving the reversed tone image which is constituted by the planarizing material in the spaces which were filled in. Modified embodiments enable large spaces between original pattern areas to be effectively reversed, and multi-level reversed tone images to be formed in which the reversed tone layers are thicker than the original layers.
摘要:
Apparatus for a micro-electro-mechanical switch that provides for latching switching action. The switch has a cantilever arm disposed on a substrate that can be moved in orthogonal directions for latching and unlatching. To latch the switch, the cantilever arm is moved back by a comb-drive actuator and then pulled down by electrodes disposed on the substrate and the cantilever arm. The comb-drive actuator switch is then released and the cantilever arm moves forward to be captured by a dove-tail structure on the substrate. When the voltage to the electrodes on the substrate and the cantilever arm is removed, the cantilever arm is held in place by the dove-tail structure. The switch is unlatched by actuating the comb-drive actuator to move the cantilever arm away from the dove-tail structure. The cantilever arm will then pop up once it is released from the dove-tail structure.
摘要:
A method for making a thin film device on integrated circuits including the steps of applying a first photoresist layer to a first surface, and patterning the first photoresist layer to have at least a first opening that exposes the first surface. A film is deposited onto the first photoresist layer, wherein a portion of the deposited film is deposited onto the exposed first surface. A second photoresist layer is applied onto the deposited layer, wherein the second photoresist layer is applied to the portion of the deposited film within the first opening and covers a second portion of the deposited layer, wherein the first photoresist layer and the second photoresist layer assist in the defining of the deposited layer. The deposited layer, first photoresist layer, and second photoresist layer are selectively removed, therein exposing the first surface and the second portion of the deposited layer.