公开(公告)号：US20110318881A1

公开(公告)日：2011-12-29

申请号：US13165063

申请日：2011-06-21

申请人： Akihiro CHIDA ,  Yoshiaki OIKAWA ,  Chiho KAWANABE

发明人： Akihiro CHIDA ,  Yoshiaki OIKAWA ,  Chiho KAWANABE

IPC分类号： H01L21/50

CPC分类号： H01L24/96 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L27/1262 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a method for manufacturing a semiconductor device, which prevents waste generation from being caused peeling of films and prevents failure of peeling from being caused by waste due to peeling of films. A first semiconductor substrate is used which has a structure in which a peeling layer is not formed in a section subjected to a first dividing treatment, so that the peeling layer is not exposed at the end surface of a second semiconductor substrate when the second semiconductor substrate is cut out of the first semiconductor substrate. In addition, a supporting material is provided on a layer to be peeled of the second semiconductor substrate before the second semiconductor substrate is subjected to a second dividing treatment.

摘要翻译： 提供一种制造半导体器件的方法，其防止废物产生被膜剥离，并防止由于剥离而导致的剥离不会导致剥离。 使用第一半导体基板，其具有其中在经受第一分割处理的部分中不形成剥离层的结构，使得当第二半导体基板上的剥离层不暴露在第二半导体基板的端面时 被切出第一半导体衬底。 另外，在对第二半导体衬底进行第二次分割处理之前，在要被剥离的第二半导体衬底的层上提供支撑材料。

公开(公告)号：US20120217516A1

公开(公告)日：2012-08-30

申请号：US13404692

申请日：2012-02-24

申请人： Kaoru HATANO ,  Satoshi SEO ,  Akihiro CHIDA ,  Yoshiaki OIKAWA

发明人： Kaoru HATANO ,  Satoshi SEO ,  Akihiro CHIDA ,  Yoshiaki OIKAWA

IPC分类号： H01L33/08

CPC分类号： H01L27/3246 ,  H01L51/525

摘要： Provided is a highly reliable light-emitting device in which a light-emitting element is prevented from being damaged when external physical force is applied. The light-emitting device includes a light-emitting element formed over a first substrate, including a first electrode layer, a light-emitting layer, and a second electrode layer; a structure body formed over the first substrate; a second substrate provided to face the first substrate; and a bonding layer provided between the first substrate and the second substrate. The light-emitting layer is separated by the structure body. By strengthening adhesion between the structure body and the bonding layer, or between the structure body and the second electrode, the highly reliable light-emitting device in which damage of the light-emitting element is prevented can be provided.

摘要翻译： 提供了一种高度可靠的发光装置，其中当施加外部物理力时防止发光元件被损坏。 发光装置包括形成在第一基板上的发光元件，包括第一电极层，发光层和第二电极层; 形成在所述第一基板上的结构体; 设置成面对第一基板的第二基板; 以及设置在第一基板和第二基板之间的接合层。 发光层被结构体分开。 通过加强结构体与结合层之间或结构体与第二电极之间的粘附性，可以提供防止发光元件损坏的高度可靠的发光装置。

公开(公告)号：US20110175101A1

公开(公告)日：2011-07-21

申请号：US13005766

申请日：2011-01-13

申请人： Kaoru HATANO ,  Takaaki NAGATA ,  Nozomu SUGISAWA ,  Tatsuya OKANO ,  Akihiro CHIDA ,  Tatsunori INOUE

发明人： Kaoru HATANO ,  Takaaki NAGATA ,  Nozomu SUGISAWA ,  Tatsuya OKANO ,  Akihiro CHIDA ,  Tatsunori INOUE

IPC分类号： H01L33/16 ,  H01L33/00

CPC分类号： H01L27/1266 ,  H01L27/1225

摘要： To simply provide a flexible light-emitting device with long lifetime. To provide a flexible light-emitting device with favorable display characteristics, high yield, and high reliability without display unevenness. Provided is a flexible light-emitting device including: a substrate having flexibility and a property of transmitting visible light; an adhesive layer provided over the substrate; a conductive layer having a property of transmitting visible light provided over the adhesive layer; an insulating layer disposed over the conductive layer; a transistor provided over the insulating layer; an interlayer insulating layer covering the transistor, a light-emitting element including a first electrode electrically connected to source or drain electrodes of the transistor and provided over the interlayer insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property provided between the first and second electrodes; and a sealing layer covering the light-emitting element.

摘要翻译： 简单地提供具有长寿命的柔性发光装置。 提供具有良好的显示特性，高产率和高可靠性的柔性发光装置，而不会出现显示不均匀。 提供一种柔性发光装置，包括：具有柔性的透射可见光的特性的基板; 设置在所述基板上的粘合层; 导电层，其具有透射在所述粘合剂层上方提供的可见光的性质; 设置在所述导电层上的绝缘层; 设置在所述绝缘层上的晶体管; 覆盖晶体管的层间绝缘层，发光元件，包括电连接到晶体管的源极或漏极并设置在层间绝缘层上的第一电极，面对第一电极的第二电极和包含有机化合物的层 具有设置在第一和第二电极之间的发光特性; 以及覆盖发光元件的密封层。

公开(公告)号：US20100171221A1

公开(公告)日：2010-07-08

申请号：US12498462

申请日：2009-07-07

申请人： Akihiro CHIDA

发明人： Akihiro CHIDA

IPC分类号： H01L23/52 ,  H01L21/98

CPC分类号： H01L25/50 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2223/6677 ,  H01L2224/02205 ,  H01L2224/0221 ,  H01L2224/02215 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/111 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11438 ,  H01L2224/11848 ,  H01L2224/13022 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13364 ,  H01L2224/13366 ,  H01L2224/13369 ,  H01L2224/1338 ,  H01L2224/13381 ,  H01L2224/16146 ,  H01L2224/81005 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83005 ,  H01L2224/83101 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K1/0366 ,  H05K1/095 ,  H05K3/002 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2201/029 ,  H05K2203/1163 ,  H01L2224/03436 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/035 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： The present invention relates to a semiconductor device and its manufacturing method including the steps of: forming a first semiconductor element layer having a first wiring over a substrate; forming a second semiconductor element layer having a second wiring and fixed to a first structure body having a first sheet-like fiber body, a first organic resin, and a first electrode; preparing a second structure body having a second sheet-like fiber body, a second organic resin which is not cured, and a second electrode; disposing the second structure body between the first and second semiconductor element layers so that the first wiring, the second electrode, and the second wiring are overlapped with each other over the substrate; and curing the second organic resin.

摘要翻译： 半导体器件及其制造方法技术领域本发明涉及半导体器件及其制造方法，包括以下步骤：在衬底上形成具有第一布线的第一半导体元件层; 形成具有第二布线并固定到具有第一片状纤维体，第一有机树脂和第一电极的第一结构体的第二半导体元件层; 制备具有第二片状纤维体的第二结构体，未固化的第二有机树脂和第二电极; 将第二结构体设置在第一和第二半导体元件层之间，使得第一布线，第二电极和第二布线在基板上彼此重叠; 并固化第二有机树脂。

公开(公告)号：US20100120200A1

公开(公告)日：2010-05-13

申请号：US12613552

申请日：2009-11-06

申请人： Akihiro CHIDA

发明人： Akihiro CHIDA

IPC分类号： H01L21/60

CPC分类号： H01L21/6835 ,  H01L21/76802 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/83 ,  H01L25/0657 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/0554 ,  H01L2224/1147 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/1601 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/29076 ,  H01L2224/29499 ,  H01L2224/81191 ,  H01L2224/83851 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00

摘要： A method for manufacturing a thin but robust stack of electrically connected thin film semiconductor elements includes the steps of forming a first element to be stacked: forming a separation layer and a semiconductor element layer over a substrate, forming a wiring connected to the semiconductor element layer, forming a protective material over the semiconductor layer and the wiring, forming a conductive region electrically connected to the wiring in the protective layer, and separating the semiconductor element layer from the substrate along the separation layer. A second element is formed according to the aforementioned process, and the first element is stacked thereon, before separating the second element from its substrate. The first element is bonded to the protective layer of the second element so that the semiconductor element layers of the first and the second element are electrically connected to each other through the protective layer, without damaging the protective layer.

摘要翻译： 一种制造薄而坚固的电连接薄膜半导体元件堆叠的方法包括以下步骤：形成要堆叠的第一元件：在衬底上形成分离层和半导体元件层，形成连接到半导体元件层 在所述半导体层和所述布线之上形成保护材料，形成与所述保护层中的布线电连接的导电区域，以及沿着所述分离层将所述半导体元件层与所述基板分离。 根据上述方法形成第二元件，并且在将第二元件与基板分离之前，将第一元件堆叠在其上。 第一元件被结合到第二元件的保护层，使得第一和第二元件的半导体元件层通过保护层彼此电连接，而不损坏保护层。

公开(公告)号：US20110318906A1

公开(公告)日：2011-12-29

申请号：US13168059

申请日：2011-06-24

申请人： Akihiro CHIDA ,  Kaoru HATANO

发明人： Akihiro CHIDA ,  Kaoru HATANO

IPC分类号： H01L21/304

CPC分类号： H01L27/1266 ,  H01L21/67092 ,  H01L21/6838 ,  H01L21/68735 ,  H01L27/1214 ,  Y10T156/1906

摘要： Objects are to reduce the number of steps in a process for separating a substrate and a semiconductor element, to provide a separation apparatus capable of reducing the number of steps, to suppress manufacturing cost by reducing the number of steps in a separation process, and to improve productivity in manufacturing semiconductor elements. A separation apparatus including a frame body, a porous body having a chamfered, rounded corner portion, a suction unit configured to create suction in the porous body and the frame body, and a jig which includes a unit adopted to press down part of an object to be separated and a unit adopted to lift another part of the object to be separated, and also a separation method and a method for manufacturing a semiconductor element by using the separation apparatus, are provided.

摘要翻译： 目的是减少用于分离衬底和半导体元件的工艺中的步骤数量，以提供能够减少步骤数量的分离装置，通过减少分离工艺中的步骤数来抑制制造成本，以及 提高制造半导体元件的生产率。 一种分离装置，包括框体，具有倒角的圆角部分的多孔体，构造成在多孔体和框体中产生吸力的吸引单元，以及包括用于将物体的一部分压下的单元的夹具 以及用于提升要分离的物体的另一部分的单元，还提供了使用分离装置制造半导体元件的分离方法和方法。

公开(公告)号：US20110318889A1

公开(公告)日：2011-12-29

申请号：US13155475

申请日：2011-06-08

申请人： Akihiro CHIDA

发明人： Akihiro CHIDA

IPC分类号： H01L21/336 ,  H01L21/20

CPC分类号： H01L27/1244 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/02631 ,  H01L27/1225 ,  H01L27/1266 ,  H01L2227/323 ,  H01L2227/326

摘要： An object is to provide a manufacturing method of a semiconductor device in which a defect in characteristics due to a crack occurring in a semiconductor device is reduced. Provision of a crack suppression layer formed of a metal film in the periphery of a semiconductor element makes it possible to suppress a crack occurring from the outer periphery of a substrate and reduce damage to the semiconductor element. In addition, even if the semiconductor device is subjected to physical forces from the outer periphery in separation and transposition steps, progression (growth) of a crack to the semiconductor device can be suppressed by the crack suppression layer.

摘要翻译： 本发明的目的是提供一种半导体器件的制造方法，其中由于在半导体器件中发生的裂纹引起的特性缺陷降低。 在半导体元件的周围设置由金属膜形成的裂纹抑制层，可以抑制从基板的外周发生的裂纹，并减少对半导体元件的损伤。 此外，即使半导体器件在分离和转置步骤中受到来自外周的物理力的影响，也可以通过裂纹抑制层来抑制裂纹向半导体器件的进展（生长）。

公开(公告)号：US20090314527A1

公开(公告)日：2009-12-24

申请号：US12485957

申请日：2009-06-17

申请人： Kaoru HATANO ,  Akihiro CHIDA ,  Takaaki NAGATA ,  Masayuki SAKAKURA

发明人： Kaoru HATANO ,  Akihiro CHIDA ,  Takaaki NAGATA ,  Masayuki SAKAKURA

IPC分类号： H05K1/03 ,  H05K1/16 ,  B05D5/12 ,  H01L21/50

CPC分类号： H01L27/1266 ,  G06K19/07745 ,  G06K19/07747 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/49827 ,  H01L23/5389 ,  H01L27/1218 ,  H01L2221/6835 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0366 ,  H05K3/002 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2203/1163 ,  Y10T29/49126 ,  Y10T29/49169 ,  H01L2924/00

摘要： To form a conductive region in a prepreg without opening a through hole in a fibrous body. A wiring substrate is provided, including: an organic resin layer and a fibrous body, wherein the fibrous body is impregnated with the organic resin layer; and a wiring with which the fibrous body is impregnated and which is formed by dissolving the organic resin layer. The wiring is exposed on both surfaces of the organic resin layer and penetrates the fibrous body so that the fibrous body is positioned in the through wiring. Further, a semiconductor device is provided by adhering an integrated circuit chip having a bump to the wiring substrate so that the bump is in contact with the wiring.

摘要翻译： 在预浸料坯中形成导电区域，而不在纤维体内打开通孔。 提供一种布线基板，包括：有机树脂层和纤维体，其中所述纤维体浸渍有机树脂层; 以及纤维体浸渍并通过溶解有机树脂层而形成的布线。 布线暴露在有机树脂层的两个表面上并穿透纤维体，使得纤维体位于贯通布线中。 此外，通过将具有凸块的集成电路芯片粘附到布线基板以使得凸块与布线接触来提供半导体器件。

公开(公告)号：US20090302457A1

公开(公告)日：2009-12-10

申请号：US12465703

申请日：2009-05-14

申请人： Akihiro CHIDA ,  Tomoyuki AOKI

发明人： Akihiro CHIDA ,  Tomoyuki AOKI

IPC分类号： H01L23/12 ,  B32B5/02 ,  B05D5/12 ,  H01L21/58

CPC分类号： H05K3/4647 ,  H01L21/6835 ,  H01L23/3733 ,  H01L27/124 ,  H01L27/1266 ,  H01L29/78603 ,  H01L2221/6835 ,  H01L2224/29499 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K1/0366 ,  H05K3/4069 ,  H05K2201/029 ,  H05K2203/1147 ,  Y10T442/2418 ,  H01L2924/00

摘要： A wiring substrate is provided, including an insulating resin layer which is provided on both surfaces of a sheet-like fibrous body and with which the sheet-like fibrous body is impregnated, and a through wiring provided in a region surrounded by the insulating resin layer. The through wiring is formed using a conductive material, the conductive material is exposed on both surfaces of the insulating resin layer, the sheet-like fibrous body is positioned in the conductive material, and the sheet-like fibrous body is impregnated with the conductive material. A manufacturing method of the wiring substrate is also provided.

摘要翻译： 提供一种布线基板，包括设置在片状纤维体的两个表面上且被片状纤维体浸渍的绝缘树脂层，以及设置在由绝缘树脂层围绕的区域中的贯通布线 。 贯通布线使用导电材料形成，导电材料暴露在绝缘树脂层的两个表面上，片状纤维体位于导电材料中，并且片状纤维体浸渍有导电材料 。 还提供了布线基板的制造方法。