公开(公告)号：US4460783A

公开(公告)日：1984-07-17

申请号：US226029

申请日：1981-01-19

申请人： Akio Nishikawa ,  Masashi Shitara ,  Susumu Era ,  Toshiaki Fukushima ,  Hiroshi Suzuki ,  Hisashi Kohkame

发明人： Akio Nishikawa ,  Masashi Shitara ,  Susumu Era ,  Toshiaki Fukushima ,  Hiroshi Suzuki ,  Hisashi Kohkame

IPC分类号： C07D207/44 ,  C07D207/452 ,  C07D207/456 ,  C07D209/48 ,  C07D209/76 ,  C08G59/40 ,  C08G73/00 ,  C08G73/10 ,  C08G73/12 ,  C08K5/3412 ,  C08K5/3415 ,  C07D209/56

CPC分类号： C07D207/452 ,  C07D207/456 ,  C07D209/48 ,  C07D209/76 ,  C08G59/4042 ,  C08K5/16 ,  C08K5/3412 ,  C08K5/3415

摘要： An ether imide of the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6 and D are as defined in the specification produced by reacting a diamine with an ethylenically unsaturated dicarboxylic acid can give a composition together with one or more unsaturated polyesters, epoxy compounds, amines, and the like to give shaped articles excellent in flexibility and heat resistance.

摘要翻译： 下式的醚酰亚胺：其中R 1，R 2，R 3，R 4，R 5，R 6和D如通过使二胺与烯键式不饱和二羧酸反应制备的说明书中所定义，可以与一个或多个 不饱和聚酯，环氧化合物，胺等，得到柔软性和耐热性优异的成型制品。

公开(公告)号：US4278780A

公开(公告)日：1981-07-14

申请号：US55069

申请日：1979-07-05

申请人： Akio Nishikawa ,  Hiroshi Suzuki ,  Hisashi Kohkame

发明人： Akio Nishikawa ,  Hiroshi Suzuki ,  Hisashi Kohkame

IPC分类号： C08K5/34 ,  C07D207/06 ,  C07D207/452 ,  C08G59/42 ,  C08G73/12 ,  C08K5/00 ,  C08K5/3412 ,  C08L63/00 ,  C08L67/00 ,  C08L79/08 ,  C08L63/04 ,  C08G73/10

CPC分类号： C08L79/08 ,  C08G59/4269 ,  C08G73/12 ,  C08L63/00

摘要： A thermosetting resin composition suitable for use as a molding material comprising (a) a reaction product mixture obtained by preferably reacting 1 mole of a dicarboxylic acid anhydride having ethylenic carbon-carbon double bond such as maleic anhydride with 2-20 moles of a diamine such as 4,4'-diaminodiphenylmethane in a molten state and (b) an epoxy compound having more than one 1,2-epoxy group on the average gives a cured product excellent in heat resistance, etc., when cured with heating at a temperature of 150.degree. to 200.degree. C.

摘要翻译： 一种适合用作模塑材料的热固性树脂组合物，其包含（a）通过优选使1摩尔具有乙烯基碳 - 碳双键的二羧酸酐如马来酸酐与2-20摩尔二胺反应获得的反应产物混合物 作为熔融状态的4,4'-二氨基二苯基甲烷，和（b）具有多于一个1,2-环氧基的环氧化合物平均得到当在温度下加热固化时耐热性等优异的固化产物 150〜200℃

公开(公告)号：US4494217A

公开(公告)日：1985-01-15

申请号：US222612

申请日：1981-01-05

申请人： Hiroshi Suzuki ,  Goro Tanaka ,  Akio Nishikawa ,  Junji Mukai ,  Mikio Sato ,  Daisuke Makino ,  Yoshiaki Wakashima

发明人： Hiroshi Suzuki ,  Goro Tanaka ,  Akio Nishikawa ,  Junji Mukai ,  Mikio Sato ,  Daisuke Makino ,  Yoshiaki Wakashima

IPC分类号： H01L23/29 ,  H01L23/057 ,  H01L23/16 ,  H01L23/31 ,  H01L23/556 ,  G11C5/00 ,  G11C11/34

CPC分类号： H01L23/3135 ,  H01L23/057 ,  H01L23/16 ,  H01L23/3171 ,  H01L23/556 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025

摘要： In a semiconductor memory device comprising semiconductor memory elements having such a degree of integration in memory circuits as to produce soft errors by incident .alpha.-rays derived from a packaging material and a package which packages the memory elements and is made from the packaging material, when an .alpha.-rays shielding layer made from a resinous material, which may contain one or more high-purity fillers, containing a total amount of 1 part per billion or less of uranium and thorium is interposed between the memory elements and the package, the generation of soft errors is reduced remarkably.

摘要翻译： 在包括半导体存储器元件的半导体存储器件中，这些半导体存储器元件在存储器电路中具有这样一个程度的集成度，以便通过从封装材料衍生的入射α射线产生软误差，以及封装存储器元件并由封装材料制成的封装， 由存储元件和封装之间插入含有总量为十亿分之一以上的铀和钍的一种或多种高纯度填料的由树脂材料制成的α-阵列屏蔽层， 的软错误显着降低。

公开(公告)号：US4562322A

公开(公告)日：1985-12-31

申请号：US682947

申请日：1984-12-18

申请人： Motoo Yamaguchi ,  Isamu Sone ,  Kunio Hirasawa ,  Yoshio Yoshioka ,  Akio Nishikawa ,  Hiroshi Suzuki ,  Mikio Sato ,  Masao Hosokawa

发明人： Motoo Yamaguchi ,  Isamu Sone ,  Kunio Hirasawa ,  Yoshio Yoshioka ,  Akio Nishikawa ,  Hiroshi Suzuki ,  Mikio Sato ,  Masao Hosokawa

IPC分类号： H01B3/30 ,  H01B3/56 ,  H01B19/00 ,  H01H33/02 ,  H01H33/915 ,  H01H33/82

CPC分类号： H01H33/021

摘要： A SF.sub.6 gas insulating electric apparatus usable as a circuit breaker, etc., containing a SF.sub.6 gas insulator and a resin insulator, both of which insulators are present in an atmosphere to be exposed to arcs, characterized by making at least the surface portion to be exposed to arcs of the resin insulator from a polymer containing nitrogen atoms or a polyolefin resin, and if necessary together with an inorganic filler powder, is excellent in both surface and inner arc resistance and can maintain breaking performance for a long period of time.

摘要翻译： 可用作断路器等的SF6气体绝缘电气设备，其包含SF6气体绝缘体和树脂绝缘体，两者都存在于暴露于电弧的气氛中，其特征在于至少使表面部分为 从包含氮原子的聚合物或聚烯烃树脂暴露于树脂绝缘体的弧，并且如果需要，与无机填料粉末一起，具有优异的表面和内部电弧电阻，并且可以长时间保持断裂性能。

公开(公告)号：US4758875A

公开(公告)日：1988-07-19

申请号：US266198

申请日：1981-05-22

申请人： Koji Fujisaki ,  Akio Nishikawa ,  Shunichi Numata ,  Hiroshi Suzuki ,  Takeshi Komaru ,  Daisuke Makino

发明人： Koji Fujisaki ,  Akio Nishikawa ,  Shunichi Numata ,  Hiroshi Suzuki ,  Takeshi Komaru ,  Daisuke Makino

IPC分类号： C08G73/00 ,  C08G73/10 ,  H01L21/312 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H01L23/28 ,  H01L29/34

CPC分类号： H01L21/312 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/3025

摘要： Disclosed is a resin encapsulated semiconductor memory device comprising a semiconductor memory element, a package encapsulating the memory element and an .alpha.-rays shielding layer made from a water-resistant aromatic polyimide polymer, interposed between the memory element and the package, the aromatic polyimide polymer having a saturated water absorption rate of 1% or less. The polyimide polymer is exemplified as the polymer having the following recurring units: ##STR1## wherein R is an aliphatic or aromatic group; R.sub.1 and R.sub.2 are independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or CF.sub.3 ; and R.sub.3 to R.sub.6 are independently a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms. The disclosure is also concerned with resin encapsulated semiconductor devices in which the aromatic polyimide polymer of low water absorption is used as an insulating layer or passivation film.

摘要翻译： 公开了一种树脂封装的半导体存储器件，其包括半导体存储元件，封装存储元件的封装以及介于该存储元件与封装之间的由防水芳香族聚酰亚胺聚合物制成的α-阵列屏蔽层，芳族聚酰亚胺聚合物 饱和吸水率为1％以下。 聚酰亚胺聚合物作为具有以下重复单元的聚合物被列举：其中R是脂族或芳族基团; R1和R2独立地为氢原子，具有1至4个碳原子的烷基或CF 3; R 3〜R 6独立地为氢原子，卤原子或碳原子数为1〜4的烷基。 本发明还涉及使用低吸水性的芳族聚酰亚胺聚合物作为绝缘层或钝化膜的树脂封装的半导体器件。

公开(公告)号：US4138372A

公开(公告)日：1979-02-06

申请号：US650066

申请日：1976-01-19

申请人： Akio Nishikawa ,  Hitoshi Yokono ,  Ryuichi Simizu ,  Junji Mukai

发明人： Akio Nishikawa ,  Hitoshi Yokono ,  Ryuichi Simizu ,  Junji Mukai

IPC分类号： C08G18/00 ,  C08G18/58 ,  C08G59/40 ,  C08G59/68 ,  H01B3/30 ,  H01B3/40 ,  H02K15/12

CPC分类号： C08G59/686 ,  C08G18/003 ,  C08G59/4028

摘要： A polymerizable, curable resin composition suitable for molding materials, prepreg, powdery paint materials or the like, which comprises a polyepoxide, a uretdione and a tetraphenyl borate-amine complex. This composition has long pot life and good curability by virtue of latent catalytic characteristics of the complex.

摘要翻译： 一种适用于模塑材料，预浸料，粉末涂料等的可聚合的可固化树脂组合物，其包含聚环氧化物，脲二酮和四苯基硼酸盐 - 胺络合物。 该组合物由于络合物的潜在催化特性而具有长的使用期和良好的固化性。

公开(公告)号：US4128527A

公开(公告)日：1978-12-05

申请号：US787098

申请日：1977-04-13

申请人： Noriyuki Kinjo ,  Akio Nishikawa ,  Junichi Katagiri ,  Hitoshi Yokono ,  Tamotsu Ikeda ,  Tsuguo Kobayashi

发明人： Noriyuki Kinjo ,  Akio Nishikawa ,  Junichi Katagiri ,  Hitoshi Yokono ,  Tamotsu Ikeda ,  Tsuguo Kobayashi

IPC分类号： C08L67/00 ,  C08L67/06 ,  H02K3/30 ,  H02K3/32 ,  H02K3/44 ,  H02K5/02 ,  H02K5/08 ,  C08K7/14

CPC分类号： H02K3/30 ,  H02K3/32

摘要： In a dynamoelectric machine having a stator assembly of coil windings and a core, a heat-dissipating, electro-insulative housing encapsulates the coil windings and the core. The housing is made of a cured molded article or material formed of a resin-filler composition which comprises a liquid unsaturated polyester resin, a finely divided calcium carbonate powder, an inorganic mineral particulate having a particle size larger than that of the calcium carbonate powder, and a chopped glass fiber, wherein the ratio by weight of the calcium carbonate to the mineral particulate is 0.3 to 4, the ratio of the weight of glass fiber to the total weight of the composition is 0.05 to 0.25, the ratio of the weight of the polyester resin to the total weight of the composition is 0.1 to 0.4 and the weight ratio of the calcium carbonate powder, the mineral particulate and the glass fiber to the total weight of the composition is 0.6 to 0.9.The disclosure is also concerned with a dynamoelectric machine having a housing made of a cured article of a composition containing a certain amount of clay powder as a separation inhibitor.

摘要翻译： 在具有线圈绕组和芯的定子组件的电动机中，散热的电绝缘壳体封装线圈绕组和芯。 壳体由固化的模制品或由树脂填料组合物形成的材料制成，该组合物包括液体不饱和聚酯树脂，细碎碳酸钙粉末，粒径大于碳酸钙粉末的无机矿物颗粒， 和短切玻璃纤维，其中碳酸钙与矿物颗粒的重量比为0.3〜4，玻璃纤维重量与组合物总重量的比例为0.05〜0.25，重量比 聚酯树脂的组合物总重量为0.1〜0.4，碳酸钙粉末，矿物颗粒和玻璃纤维的重量比为0.6〜0.9。

公开(公告)号：US5225499A

公开(公告)日：1993-07-06

申请号：US662942

申请日：1991-03-01

申请人： Hiroyoshi Kokaku ,  Masatsugu Ogata ,  Masanori Segawa ,  Hiroshi Hozoji ,  Akio Nishikawa ,  Fumio Sato

发明人： Hiroyoshi Kokaku ,  Masatsugu Ogata ,  Masanori Segawa ,  Hiroshi Hozoji ,  Akio Nishikawa ,  Fumio Sato

IPC分类号： C08G59/00 ,  C08G59/40 ,  C08G59/62 ,  C08L63/00 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01L23/293 ,  C08G59/4042 ,  C08L63/00 ,  H01B3/40 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L24/45 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025

摘要： A resin composition having superior molding character, bonding character, moisture resistance, and heat resistance, for encapsulating of a semiconductor which contains:(a) An ether imide group compound represented by the general formula (I) ##STR1## wherein, each of R.sup.1 -R.sup.4, R.sup.8 and R.sup.8 is hydrogen, lower alkyl group, lower alkoxy group, lower fluoroalkyl group, chlorine or bromine, and R.sup.1 -R.sup.4, R.sup.7 and R.sup.8 may be same or different each other, and each of R.sup.5 and R.sup.6 is hydrogen, methyl group, ethyl group, trifluoromethyl group or trichloromethyl group, and R.sup.5 and R.sup.6 may be same or different each other, and D is a hydrocarbon group of a dicarboxylic acid having an ethylene type unsaturated double bond of an extract of the compound obtained by extraction with water in an amount 10 times by weight of the compound at 120.degree. C. for more than 100 hours has electric conductivity of at most 300 s/cm ph of 1.5-7; and(b) an epoxy resin as well as a semiconductor apparatus encapsulated with the resin.

摘要翻译： 一种具有优异的成型特性，结合特性，耐湿性和耐热性的树脂组合物，其用于包封半导体，其包含：（a）由通式（I）表示的醚酰亚胺基化合物其中， R 1 -R 4，R 8和R 8各自为氢，低级烷基，低级烷氧基，低级氟代烷基，氯或溴，R 1 -R 4，R 7和R 8可以相同或不同，R 5和R 6 是氢，甲基，乙基，三氟甲基或三氯甲基，R 5和R 6可以相同或不同，并且D是化合物的提取物的乙烯型不饱和双键的二羧酸的烃基 通过在120℃下将化合物的10倍量的水萃取超过100小时获得的电导率为至多300s / cm ph的1.5-7; 和（b）环氧树脂以及用该树脂封装的半导体装置。

公开(公告)号：US3963796A

公开(公告)日：1976-06-15

申请号：US104398

申请日：1971-01-06

申请人： Hitoshi Yokono ,  Akio Nishikawa ,  Ritsuro Tada ,  Yasuo Miyadera

发明人： Hitoshi Yokono ,  Akio Nishikawa ,  Ritsuro Tada ,  Yasuo Miyadera

IPC分类号： C08G59/52 ,  C08G45/06

CPC分类号： C08G59/52 ,  Y10S525/934

摘要： An epoxy resin composition having a remarkably improved storage stability and an excellent hardening characteristic when heated, which comprises an epoxy resin and an aromatic amino carboxylic acid or a derivative thereof as a hardener for the epoxy resin. This composition can be molded by injection molding, heretofore being deemed inapplicable to epoxy resin compositions, whereby the molded articled of epoxy resin can be produced with a high molding efficiency.

摘要翻译： 包含环氧树脂和芳香族氨基羧酸或其衍生物作为环氧树脂的硬化剂的具有显着提高的储存稳定性和优异的硬化特性的环氧树脂组合物。 该组合物可以通过注塑成型，迄今为止被认为不适用于环氧树脂组合物，由此可以以高模塑效率制造环氧树脂的模制接头。

公开(公告)号：US5166283A

公开(公告)日：1992-11-24

申请号：US715324

申请日：1991-06-14

申请人： Akio Nishikawa ,  Tohru Koyama ,  Hideki Asano ,  Toshikazu Narahara

发明人： Akio Nishikawa ,  Tohru Koyama ,  Hideki Asano ,  Toshikazu Narahara

IPC分类号： C08G73/06

CPC分类号： C08G73/0638 ,  C08G73/0633

摘要： A polymer having dihydropyridine rings or dihydrotriazine rings as main constitutional units, an ethynyl- or cyanato-terminated Schiff's compound which is a starting material for producing the polymer, and applications of the polymer.

摘要翻译： 具有二氢吡啶环或二氢三嗪环作为主要结构单元的聚合物，作为制备聚合物的起始原料的乙炔基或氰基封端的希夫化合物以及该聚合物的应用。