公开(公告)号：US4128527A

公开(公告)日：1978-12-05

申请号：US787098

申请日：1977-04-13

申请人： Noriyuki Kinjo ,  Akio Nishikawa ,  Junichi Katagiri ,  Hitoshi Yokono ,  Tamotsu Ikeda ,  Tsuguo Kobayashi

发明人： Noriyuki Kinjo ,  Akio Nishikawa ,  Junichi Katagiri ,  Hitoshi Yokono ,  Tamotsu Ikeda ,  Tsuguo Kobayashi

IPC分类号： C08L67/00 ,  C08L67/06 ,  H02K3/30 ,  H02K3/32 ,  H02K3/44 ,  H02K5/02 ,  H02K5/08 ,  C08K7/14

CPC分类号： H02K3/30 ,  H02K3/32

摘要： In a dynamoelectric machine having a stator assembly of coil windings and a core, a heat-dissipating, electro-insulative housing encapsulates the coil windings and the core. The housing is made of a cured molded article or material formed of a resin-filler composition which comprises a liquid unsaturated polyester resin, a finely divided calcium carbonate powder, an inorganic mineral particulate having a particle size larger than that of the calcium carbonate powder, and a chopped glass fiber, wherein the ratio by weight of the calcium carbonate to the mineral particulate is 0.3 to 4, the ratio of the weight of glass fiber to the total weight of the composition is 0.05 to 0.25, the ratio of the weight of the polyester resin to the total weight of the composition is 0.1 to 0.4 and the weight ratio of the calcium carbonate powder, the mineral particulate and the glass fiber to the total weight of the composition is 0.6 to 0.9.The disclosure is also concerned with a dynamoelectric machine having a housing made of a cured article of a composition containing a certain amount of clay powder as a separation inhibitor.

摘要翻译： 在具有线圈绕组和芯的定子组件的电动机中，散热的电绝缘壳体封装线圈绕组和芯。 壳体由固化的模制品或由树脂填料组合物形成的材料制成，该组合物包括液体不饱和聚酯树脂，细碎碳酸钙粉末，粒径大于碳酸钙粉末的无机矿物颗粒， 和短切玻璃纤维，其中碳酸钙与矿物颗粒的重量比为0.3〜4，玻璃纤维重量与组合物总重量的比例为0.05〜0.25，重量比 聚酯树脂的组合物总重量为0.1〜0.4，碳酸钙粉末，矿物颗粒和玻璃纤维的重量比为0.6〜0.9。

公开(公告)号：US4211686A

公开(公告)日：1980-07-08

申请号：US767322

申请日：1977-02-10

申请人： Akio Nishikawa ,  Junichi Katagiri ,  Noriyuki Kinjo ,  Hitoshi Yokono ,  Tamotsu Ikeda ,  Tsuguo Kobayashi

发明人： Akio Nishikawa ,  Junichi Katagiri ,  Noriyuki Kinjo ,  Hitoshi Yokono ,  Tamotsu Ikeda ,  Tsuguo Kobayashi

IPC分类号： C08L67/00 ,  C08K3/26 ,  C08K3/36 ,  C08K7/02 ,  C08K13/04 ,  C08L33/00 ,  C08L33/02 ,  C08L67/06 ,  C08L77/00 ,  C08K7/14

CPC分类号： C08K13/04 ,  C08K3/0033 ,  C08K3/26 ,  C08K7/14

摘要： An unsaturated polyester resin composition for use in pressure molding, which comprises an unsaturated polyester resin and fillers consisting essentially of (a) calcium carbonate powder which passes a 325 mesh sieve, (b) an inorganic mineral particulate which passes a 12 mesh sieve and is retained on a 200 mesh sieve and (c) glass fibers having a length larger than 0.2 mm, wherein the ratio by weight of (a) to (b) is within a range of from 0.3 to 10, the ratio of (a)+(b) to the unsaturated polyester resin is within a range of from 1.5 to 7, and the ratio of (c) to the total weight of the resin, calcium carbonate, silica sand and glass fiber is within a range of from 0.01 to 0.25.

摘要翻译： 一种用于加压成型的不饱和聚酯树脂组合物，其包含不饱和聚酯树脂和基本上由（a）通过325目筛的碳酸钙粉末组成的填料，（b）通过12目筛的无机矿物颗粒， 保留在200目筛上，（c）长度大于0.2mm的玻璃纤维，其中（a）〜（b）的重量比在0.3〜10的范围内，（a）+ （b）不饱和聚酯树脂在1.5〜7的范围内，（c）与树脂，碳酸钙，硅砂和玻璃纤维的总重量的比例在0.01〜0.25的范围内 。

公开(公告)号：US4387311A

公开(公告)日：1983-06-07

申请号：US247269

申请日：1981-03-25

申请人： Tsuguo Kobayashi ,  Tetsuo Ishikawa ,  Kenichi Hironaka ,  Hideo Umetsu ,  Masatsugu Ogata ,  Hitoshi Yokono

发明人： Tsuguo Kobayashi ,  Tetsuo Ishikawa ,  Kenichi Hironaka ,  Hideo Umetsu ,  Masatsugu Ogata ,  Hitoshi Yokono

IPC分类号： H02K3/30 ,  H02K3/44 ,  H02K5/08 ,  H02K1/04 ,  B32B27/36 ,  C08K7/14 ,  C08L67/06

CPC分类号： H02K5/08 ,  Y10S428/921 ,  Y10T428/31794

摘要： In a dynamoelectric machine having a stator assembly of coil windings and a core, a heat-dissipating, uninflammable, electro-insulative housing encapsulates the coil windings and the core. The housing is made of a cured molded article or material formed of a resin-filler composition which comprises a liquid unsaturated polyester resin, a finely divided calcium carbonate powder, an inorganic mineral particulate having a particle size larger than that of the calcium carbonate powder, a chopped glass fiber and an aluminum hydroxide powder, wherein the ratio by weight of the calcium carbonate to the mineral particulate is 0.3 to 4, the ratio of the weight of glass fiber to the total weight of the composition is 0.05 to 0.25, the ratio of the weight of the polyester resin to the total weight of the composition is 0.1 to 0.4, the weight ratio of the calcium carbonate powder, the mineral particulate and the glass fiber to the total weight of the composition is 0.15 to 0.80, and the weight ratio of the aluminum hydroxide powder to the total weight of the composition is 0.1 to 0.6.

摘要翻译： 在具有线圈绕组和铁心的定子组件的电动机中，散热不可燃的电绝缘壳体封装线圈绕组和芯。 壳体由固化的模制品或由树脂填料组合物形成的材料制成，该组合物包括液体不饱和聚酯树脂，细碎碳酸钙粉末，粒径大于碳酸钙粉末的无机矿物颗粒， 短切玻璃纤维和氢氧化铝粉末，其中碳酸钙与矿物颗粒的重量比为0.3〜4，玻璃纤维重量与组合物总重量的比例为0.05〜0.25，比例 聚酯树脂的重量相对于组合物的总重量为0.1〜0.4，碳酸钙粉末，矿物颗粒和玻璃纤维的重量比相对于组合物的总重量为0.15〜0.80，重量 氢氧化铝粉末与组合物总重量的比例为0.1〜0.6。

公开(公告)号：US4138372A

公开(公告)日：1979-02-06

申请号：US650066

申请日：1976-01-19

申请人： Akio Nishikawa ,  Hitoshi Yokono ,  Ryuichi Simizu ,  Junji Mukai

发明人： Akio Nishikawa ,  Hitoshi Yokono ,  Ryuichi Simizu ,  Junji Mukai

IPC分类号： C08G18/00 ,  C08G18/58 ,  C08G59/40 ,  C08G59/68 ,  H01B3/30 ,  H01B3/40 ,  H02K15/12

CPC分类号： C08G59/686 ,  C08G18/003 ,  C08G59/4028

摘要： A polymerizable, curable resin composition suitable for molding materials, prepreg, powdery paint materials or the like, which comprises a polyepoxide, a uretdione and a tetraphenyl borate-amine complex. This composition has long pot life and good curability by virtue of latent catalytic characteristics of the complex.

摘要翻译： 一种适用于模塑材料，预浸料，粉末涂料等的可聚合的可固化树脂组合物，其包含聚环氧化物，脲二酮和四苯基硼酸盐 - 胺络合物。 该组合物由于络合物的潜在催化特性而具有长的使用期和良好的固化性。

公开(公告)号：US3963796A

公开(公告)日：1976-06-15

申请号：US104398

申请日：1971-01-06

申请人： Hitoshi Yokono ,  Akio Nishikawa ,  Ritsuro Tada ,  Yasuo Miyadera

发明人： Hitoshi Yokono ,  Akio Nishikawa ,  Ritsuro Tada ,  Yasuo Miyadera

IPC分类号： C08G59/52 ,  C08G45/06

CPC分类号： C08G59/52 ,  Y10S525/934

摘要： An epoxy resin composition having a remarkably improved storage stability and an excellent hardening characteristic when heated, which comprises an epoxy resin and an aromatic amino carboxylic acid or a derivative thereof as a hardener for the epoxy resin. This composition can be molded by injection molding, heretofore being deemed inapplicable to epoxy resin compositions, whereby the molded articled of epoxy resin can be produced with a high molding efficiency.

摘要翻译： 包含环氧树脂和芳香族氨基羧酸或其衍生物作为环氧树脂的硬化剂的具有显着提高的储存稳定性和优异的硬化特性的环氧树脂组合物。 该组合物可以通过注塑成型，迄今为止被认为不适用于环氧树脂组合物，由此可以以高模塑效率制造环氧树脂的模制接头。

公开(公告)号：US4056579A

公开(公告)日：1977-11-01

申请号：US613543

申请日：1975-09-15

申请人： Akio Nishikawa ,  Hitoshi Yokono ,  Shun-ichi Numata ,  Junji Mukai

发明人： Akio Nishikawa ,  Hitoshi Yokono ,  Shun-ichi Numata ,  Junji Mukai

IPC分类号： C08G18/00 ,  C08G18/18 ,  C08G18/34 ,  C08G18/58 ,  C08G18/80 ,  C08G59/40 ,  C08L63/00

CPC分类号： C08G18/003 ,  C08G18/18 ,  C08G18/1875 ,  C08G18/343 ,  C08G18/8048 ,  C08G59/4028 ,  C08G2105/02

摘要： A novel thermosetting resin composition consisting essentially of (a) an isocyanate group-terminated condensate obtained by reacting a polycarboxylic acid compound having at least one acid anhydride ring with a stoichiometrical excess of a polyfunctional isocyanate compound or said condensate containing the unreacted isocyanate compound, (b) a polyfunctional epoxy compound and (c) a catalyst which forms mainly isocyanurate rings and oxazolidone rings. A cured product having excellent thermal resistance and excellent high temperature strength can be obtained by heating said composition.

摘要翻译： 一种新型的热固性树脂组合物，其基本上由（a）通过使具有至少一个酸酐环的多元羧酸化合物与化学计量过量的多官能异氰酸酯化合物或所述含有未反应的异氰酸酯化合物的缩合物反应得到的异氰酸酯基封端的缩合物 b）多官能环氧化合物和（c）主要形成异氰脲酸酯环和恶唑烷酮环的催化剂。 通过加热所述组合物可以获得具有优异的耐热性和优异的高温强度的固化产物。

公开(公告)号：US5162240A

公开(公告)日：1992-11-10

申请号：US537492

申请日：1990-06-12

申请人： Norio Saitou ,  Hideo Todokoro ,  Katsuhiro Kuroda ,  Satoru Fukuhara ,  Genya Matsuoka ,  Hideo Arima ,  Hitoshi Yokono ,  Takashi Inoue ,  Hidetaka Shigi

发明人： Norio Saitou ,  Hideo Todokoro ,  Katsuhiro Kuroda ,  Satoru Fukuhara ,  Genya Matsuoka ,  Hideo Arima ,  Hitoshi Yokono ,  Takashi Inoue ,  Hidetaka Shigi

IPC分类号： H01L21/48 ,  H01L23/538 ,  H01L23/544 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46

CPC分类号： H05K3/4679 ,  H01L21/4857 ,  H01L23/5383 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15174 ,  H05K1/0269 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K3/4605 ,  H05K3/467

摘要： A thick and thin film hybrid multilayer wiring substrate includes an adjustment layer provided between a thick film circuit and a thin film circuit in order to adjust positions of the thick film circuit and the thin film circuit with high integration and large area of the thick and thin film hybrid substrate. The adjustment layer is formed using a direct printing process in accordance with dispersion of the shape of the thick film circuit substrate to absorb the dispersion of the substrate. Further, in order to absorb dispersion of contraction of the thick film substrate due to sintering, a position of a mark provided on the substrate is detected by an electron beam and thereafter a connection pattern is formed to be connected to a regular pattern.

摘要翻译： 厚薄膜混合多层布线基板包括设置在厚膜电路和薄膜电路之间的调整层，以便调整厚膜电路和薄膜电路的位置，具有高集成度和大面积的厚薄 薄膜混合基板。 根据厚膜电路基板的形状的分散，使用直接印刷法形成调整层，以吸收基板的分散。 此外，为了吸收由于烧结引起的厚膜基板的收缩分散，通过电子束检测设置在基板上的标记的位置，然后形成连接图案以连接到规则图案。

公开(公告)号：US5133403A

公开(公告)日：1992-07-28

申请号：US423386

申请日：1989-10-19

申请人： Hitoshi Yokono ,  Takao Terabayashi ,  Nobuo Kayaba ,  Takahiro Daikoku ,  Shigekazu Kieda ,  Fumiyuki Kobayashi ,  Shizuo Zushi

发明人： Hitoshi Yokono ,  Takao Terabayashi ,  Nobuo Kayaba ,  Takahiro Daikoku ,  Shigekazu Kieda ,  Fumiyuki Kobayashi ,  Shizuo Zushi

IPC分类号： H01L23/373 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/4338 ,  H01L23/3733 ,  F28F2255/18 ,  H01L2224/16225

摘要： A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.m, with a sintering aid being added and the powdery mixture being subjected to a hot press sintering whereby the sintered material is low in thermal conductivity in a direction parallel to an axis of a shaft of the hot press.

摘要翻译： 一种用于通过从大型电子计算机中的诸如半导体集成芯片的半导体元件产生的热量来冷却半导体元件的冷却装置。 该冷却装置由维氏硬度不高于AlN材料的五分之一的复合AlN-BN烧结材料制成，并且二维方向的热导率的各向异性特性比AlN的各向异性高 各向同性的导热性。 即使复合烧结体的形状和尺寸一致，冷却装置也可以批量生产，同时具有与每个半导体元件产生的热量匹配的高转印性能。 复合烧结材料由平均粒径不小于1μm的六方晶BN粉末和平均粒径约2μm的AlN粉末的混合物形成，并加入烧结助剂。 混合物进行热压烧结，由此烧结材料在与热压机的轴的轴线平行的方向上的导热性低。

公开(公告)号：US4715673A

公开(公告)日：1987-12-29

申请号：US857957

申请日：1986-05-01

申请人： Takanobu Noro ,  Yasumasa Koakutsu ,  Tamio Takeuchi ,  Masao Yano ,  Seiichi Onoda ,  Hideo Arima ,  Hitoshi Yokono ,  Hirayoshi Tanei

发明人： Takanobu Noro ,  Yasumasa Koakutsu ,  Tamio Takeuchi ,  Masao Yano ,  Seiichi Onoda ,  Hideo Arima ,  Hitoshi Yokono ,  Hirayoshi Tanei

IPC分类号： G02B6/35 ,  G02B6/36

CPC分类号： G02B6/35 ,  G02B6/3598 ,  G02B6/3542 ,  G02B6/3572 ,  G02B6/3582 ,  G02B6/3586

摘要： An optical switch having a small number of optical connections includes a substrate in which are provided a first light path for conducting optical signals and a second light path consisting of a photosensitive element and light emitting element in pairs. An optical fiber cable is interrupted by the substrate, and optical signals in the fiber cable are transmitted through the first light path or intervened by an electrical system through the second light path in response to the switching movement of the substrate.

摘要翻译： 具有少量光学连接的光学开关包括其中设置有用于传导光学信号的第一光路和由感光元件和发光元件成对组成的第二光路的基板。 光纤电缆被基板中断，并且光纤电缆中的光信号响应于基板的切换运动而通过第一光路传输或通过第二光路被电气系统干涉。

公开(公告)号：US4554237A

公开(公告)日：1985-11-19

申请号：US452198

申请日：1982-12-22

申请人： Fumio Kataoka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Daisuke Makino ,  Shigeru Koibuchi ,  Asao Isobe

发明人： Fumio Kataoka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Daisuke Makino ,  Shigeru Koibuchi ,  Asao Isobe

IPC分类号： G03C1/72 ,  G03F7/008 ,  G03C1/52 ,  G03C1/60 ,  G03C5/16

CPC分类号： G03F7/008 ,  Y10S430/128

摘要： Disclosed are photosensitive resin composition useful for formation of fine patterns on semiconductor devices, magnetic bubble devices, etc. which is highly sensitive and is excellent in developability and which has no problem such as precipitation of azide compounds and remaining azide particles after development and a method for forming fine patterns with said composition.Said photosensitive resin composition comprises (a) at least one polymer compound selected from the group consisting of a novolak resin and a polyhydroxystyrene resin and (b) an azide compound represented by the general formula (1): ##STR1## [wherein X is --N.sub.3 or --SO.sub.2 N.sub.3, Y is ##STR2## R.sup.1 is a lower alkylene such as --CH.sub.2 CH.sub.2 --, --CH.sub.2 CH.sub.2 CH.sub.2 --, or --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 CH.sub.2 --, a hydroxyalkylene or an aminoalkylene such as ##STR3## (wherein R.sup.4 and R.sup.5 are lower alkyl or hydrogen, R.sup.6 -R.sup.8 are lower alkyl groups, R.sup.3 is hydrogen, a lower alkyl group or --CH.sub.2 CH.sub.2 O).sub.n R.sup.9 wherein n is an integer of 3 or less and R.sup.9 is hydrogen or a lower alkyl group)].

摘要翻译： 公开了用于在半导体器件上形成精细图案的光敏树脂组合物，具有高度敏感性和显影性优异的并且没有问题，例如显影后的叠氮化合物和剩余的叠氮化物颗粒的沉淀，以及方法 用于用所述组合物形成精细图案。 所述光敏树脂组合物包含（a）至少一种选自酚醛清漆树脂和聚羟基苯乙烯树脂的聚合物化合物和（b）由通式（1）表示的叠氮化合物：其中 X是-N3或-SO2N3，Y是低级亚烷基，例如-CH2CH2-，-CH2CH2CH2-或-CH2CH2OCH2CH2CH2-，羟基亚烷基或氨基亚烷基，例如