公开(公告)号：US20050201660A1

公开(公告)日：2005-09-15

申请号：US11078785

申请日：2005-03-11

申请人： Annette Grot ,  Laura Mirkarimi ,  Mihail Sigalas ,  Kai Chow

发明人： Annette Grot ,  Laura Mirkarimi ,  Mihail Sigalas ,  Kai Chow

IPC分类号： G02B6/00 ,  G02F1/00

CPC分类号： G02B6/1225 ,  B82Y20/00 ,  G01N21/41 ,  G01N21/59

摘要： A photonic crystal sensor adapted for single nanoparticle detection is disclosed. Very small single particles and single molecules may be detected. The sensors may be adapted to allow differential measurements.

摘要翻译： 公开了适用于单纳米颗粒检测的光子晶体传感器。 可以检测到非常小的单个颗粒和单个分子。 传感器可以适于允许差分测量。

公开(公告)号：US06993234B1

公开(公告)日：2006-01-31

申请号：US10910216

申请日：2004-08-03

申请人： Mihail Sigalas ,  Annette Grot ,  Laura Mirkarimi

发明人： Mihail Sigalas ,  Annette Grot ,  Laura Mirkarimi

IPC分类号： G02B6/00 ,  G02B6/10 ,  G02B6/12

CPC分类号： B82Y20/00 ,  G02B6/1225 ,  G02B2006/12109

摘要： A two-dimensional photonic crystal resonator apparatus in which the power of light coupled out of the apparatus in one direction is greater than the power of light coupled out of the apparatus in the opposite direction The apparatus has a photonic crystal slab waveguide structure having a waveguide and a resonator in the vicinity of the waveguide such that light propagated through the waveguide is extracted from the waveguide through the resonator and is coupled out of the plane of the apparatus. The apparatus has upper and lower cladding layers on the photonic crystal slab waveguide structure having different indices of refraction, and the power of light coupled out of the apparatus in the direction of the cladding layer having the higher index of refraction is greater than the power of the light coupled out of the apparatus in the direction of the cladding layer having the lower index of refraction.

摘要翻译： 一种二维光子晶体谐振器装置，其中在一个方向上耦合出设备的光的功率大于在相反方向上耦合到设备外的光的功率。该装置具有光子晶体平板波导结构，其具有波导 以及在波导附近的谐振器，使得通过波导传播的光从波导通过谐振器提取出来并被耦合到设备的平面之外。 该装置在具有不同折射率的光子晶体平板波导结构上具有上包层和下包层，并且在具有较高折射率的包层的方向上耦合到装置外的光的功率大于 在具有较低折射率的包层的方向上耦合出装置的光。

公开(公告)号：US20060029347A1

公开(公告)日：2006-02-09

申请号：US10910216

申请日：2004-08-03

申请人： Mihail Sigalas ,  Annette Grot ,  Laura Mirkarimi

发明人： Mihail Sigalas ,  Annette Grot ,  Laura Mirkarimi

IPC分类号： G02B6/00 ,  G02B6/10 ,  G02B6/12

CPC分类号： B82Y20/00 ,  G02B6/1225 ,  G02B2006/12109

摘要： A two-dimensional photonic crystal resonator apparatus in which the power of light coupled out of the apparatus in one direction is greater than the power of light coupled out of the apparatus in the opposite direction The apparatus has a photonic crystal slab waveguide structure having a waveguide and a resonator in the vicinity of the waveguide such that light propagated through the waveguide is extracted from the waveguide through the resonator and is coupled out of the plane of the apparatus. The apparatus has upper and lower cladding layers on the photonic crystal slab waveguide structure having different indices of refraction, and the power of light coupled out of the apparatus in the direction of the cladding layer having the higher index of refraction is greater than the power of the light coupled out of the apparatus in the direction of the cladding layer having the lower index of refraction.

摘要翻译： 一种二维光子晶体谐振器装置，其中在一个方向上耦合出设备的光的功率大于在相反方向上耦合到设备外的光的功率。该装置具有光子晶体平板波导结构，其具有波导 以及在波导附近的谐振器，使得通过波导传播的光从波导通过谐振器提取出来并被耦合到设备的平面之外。 该装置在具有不同折射率的光子晶体平板波导结构上具有上包层和下包层，并且在具有较高折射率的包层的方向上耦合到装置外的光的功率大于 在具有较低折射率的包层的方向上耦合出装置的光。

公开(公告)号：US20050200942A1

公开(公告)日：2005-09-15

申请号：US10799020

申请日：2004-03-11

申请人： Annette Grot ,  Kai-Cheung Chow ,  Laura Mirkarimi ,  Mihail Sigalas

发明人： Annette Grot ,  Kai-Cheung Chow ,  Laura Mirkarimi ,  Mihail Sigalas

IPC分类号： G02B6/00 ,  G02F1/00

CPC分类号： G02B6/1225 ,  B82Y20/00 ,  G01B11/0625

摘要： Photonic crystal sensors may be created from two and three dimensional photonic crystals by introducing defects. The localization of the optical field in the defect region affords the ability to sense small volumes of analyte.

摘要翻译： 光子晶体传感器可以通过引入缺陷从二维和三维光子晶体产生。 缺陷区域中的光场的定位提供了感测小体积分析物的能力。

公开(公告)号：US20050090116A1

公开(公告)日：2005-04-28

申请号：US10692772

申请日：2003-10-24

申请人： Laura Mirkarimi ,  Kai Chow

发明人： Laura Mirkarimi ,  Kai Chow

IPC分类号： G03F7/20 ,  H01L21/00 ,  H01L21/302 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/3213 ,  H01L21/461

CPC分类号： H01L21/30621

摘要： III-V based compounds are etched to produce smooth sidewalls for electro-optical applications using BCl3 together with chemistries of CH4 and H2 in RIE and/or ICP systems. HI or IBr or some combination of group VII gaseous species (Br, F, I) may be added in accordance with the invention.

摘要翻译： 蚀刻III-V基化合物以产生使用BCl 3 3与CH 4和H 2的化学物质的电光学应用的平滑侧壁 RIE和/或ICP系统。 根据本发明可以加入HI或IBr或VII族气态物质（Br，F，I）的某些组合。

公开(公告)号：US08680662B2

公开(公告)日：2014-03-25

申请号：US12456349

申请日：2009-06-15

申请人： Belgacem Haba ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Moshe Kriman

发明人： Belgacem Haba ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Moshe Kriman

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L23/3114 ,  H01L25/50 ,  H01L2224/24145 ,  H01L2225/06551 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/01067 ,  H01L2924/01322 ,  Y10T29/49144

摘要： A microelectronic assembly can include a first microelectronic device and a second microelectronic device. Each microelectronic device has a die structure including at least one semiconductor die and each of the microelectronic devices has a first surface, a second surface remote from the first surface and at least one edge surface extending at angles other than a right angle away from the first and second surfaces. At least one electrically conductive element extends along the first surface onto at least one of the edge surfaces and onto the second surface. At least one conductive element of the first microelectronic device can be conductively bonded to the at least one conductive element of the second microelectronic device to provide an electrically conductive path therebetween.

摘要翻译： 微电子组件可以包括第一微电子器件和第二微电子器件。 每个微电子器件具有包括至少一个半导体管芯的管芯结构，并且每个微电子器件具有第一表面，远离第一表面的第二表面和至少一个边缘表面，该边缘表面以远离第一表面的直角延伸 和第二表面。 至少一个导电元件沿着第一表面延伸到至少一个边缘表面上并且延伸到第二表面上。 第一微电子器件的至少一个导电元件可以导电地结合到第二微电子器件的至少一个导电元件，以在它们之间提供导电路径。

公开(公告)号：US20120145442A1

公开(公告)日：2012-06-14

申请号：US12965192

申请日：2010-12-10

申请人： Debabrata Gupta ,  Yukio Hashimoto ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Rajesh Katkar

发明人： Debabrata Gupta ,  Yukio Hashimoto ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Rajesh Katkar

IPC分类号： H05K1/18 ,  H05K1/11

CPC分类号： H01L24/14 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/528 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13647 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a first surface and a first thin conductive element exposed at the first surface and having a face comprising first and second regions. A first conductive projection having a base connected to and covering the first region of the face extends to an end remote from the base. A first dielectric material layer covers the second region of the first thin element and contacts at least the base of the first conductive projection. The assembly further includes a second substrate having a second face and a second conductive projection extending away from the second face. A first fusible metal mass connects the first projection to the second projection and extends along an edge of the first projection towards the first dielectric material layer.

摘要翻译： 微电子组件包括第一表面和暴露在第一表面处并具有包括第一和第二区域的面的第一薄导电元件。 具有连接到并覆盖面的第一区域的基部的第一导电突起延伸到远离基部的一端。 第一介电材料层覆盖第一薄元件的第二区域并且至少与第一导电突起的基部接触。 组件还包括具有第二面的第二衬底和远离第二面延伸的第二导电突起。 第一可熔金属块将第一突起连接到第二突起并沿着第一突起的边缘朝着第一介电材料层延伸。

公开(公告)号：US20090316378A1

公开(公告)日：2009-12-24

申请号：US12456349

申请日：2009-06-15

申请人： Belgacem Haba ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Moshe Kriman

发明人： Belgacem Haba ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Moshe Kriman

IPC分类号： H05K7/02 ,  H05K3/34

CPC分类号： H01L25/105 ,  H01L23/3114 ,  H01L25/50 ,  H01L2224/24145 ,  H01L2225/06551 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/01067 ,  H01L2924/01322 ,  Y10T29/49144

摘要： A microelectronic assembly can include a first microelectronic device and a second microelectronic device. Each microelectronic device has a die structure including at least one semiconductor die and each of the microelectronic devices has a first surface, a second surface remote from the first surface and at least one edge surface extending at angles other than a right angle away from the first and second surfaces. At least one electrically conductive element extends along the first surface onto at least one of the edge surfaces and onto the second surface. At least one conductive element of the first microelectronic device can be conductively bonded to the at least one conductive element of the second microelectronic device to provide an electrically conductive path therebetween.

摘要翻译： 微电子组件可以包括第一微电子器件和第二微电子器件。 每个微电子器件具有包括至少一个半导体管芯的管芯结构，并且每个微电子器件具有第一表面，远离第一表面的第二表面和至少一个边缘表面，该边缘表面以远离第一表面的直角延伸 和第二表面。 至少一个导电元件沿着第一表面延伸到至少一个边缘表面上并且延伸到第二表面上。 第一微电子器件的至少一个导电元件可以导电地结合到第二微电子器件的至少一个导电元件，以在它们之间提供导电路径。

公开(公告)号：US08853558B2

公开(公告)日：2014-10-07

申请号：US12965192

申请日：2010-12-10

申请人： Debabrata Gupta ,  Yukio Hashimoto ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Rajesh Katkar

发明人： Debabrata Gupta ,  Yukio Hashimoto ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Rajesh Katkar

IPC分类号： H05K1/16 ,  H01L25/10 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L24/14 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/528 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13647 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a first surface and a first thin conductive element exposed at the first surface and having a face comprising first and second regions. A first conductive projection having a base connected to and covering the first region of the face extends to an end remote from the base. A first dielectric material layer covers the second region of the first thin element and contacts at least the base of the first conductive projection. The assembly further includes a second substrate having a second face and a second conductive projection extending away from the second face. A first fusible metal mass connects the first projection to the second projection and extends along an edge of the first projection towards the first dielectric material layer.

摘要翻译： 微电子组件包括第一表面和暴露在第一表面处并具有包括第一和第二区域的面的第一薄导电元件。 具有连接到并覆盖面的第一区域的基部的第一导电突起延伸到远离基部的一端。 第一介电材料层覆盖第一薄元件的第二区域并且至少与第一导电突起的基部接触。 组件还包括具有第二面的第二衬底和远离第二面延伸的第二导电突起。 第一可熔金属块将第一突起连接到第二突起并沿着第一突起的边缘朝着第一介电材料层延伸。

公开(公告)号：US08372741B1

公开(公告)日：2013-02-12

申请号：US13405125

申请日：2012-02-24

申请人： Reynaldo Co ,  Laura Mirkarimi

发明人： Reynaldo Co ,  Laura Mirkarimi

IPC分类号： H01L21/44

CPC分类号： H01L23/3128 ,  H01L21/4853 ,  H01L23/3121 ,  H01L23/49517 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/06 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/32145 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/05599

摘要： A microelectronic assembly includes a substrate having a first and second opposed surfaces. A microelectronic element overlies the first surface and first electrically conductive elements can be exposed at at least one of the first surface or second surfaces. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer can extend from the first surface and fill spaces between the wire bonds, such that the wire bonds can be separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

摘要翻译： 微电子组件包括具有第一和第二相对表面的衬底。 微电子元件覆盖在第一表面上，并且第一导电元件可以在第一表面或第二表面中的至少一个处露出。 一些第一导电元件电连接到微电子元件。 线接合具有连接到远离基板和基座的导电元件和端表面的基部，每个引线接合限定在基部和端表面之间延伸的边缘表面。 封装层可以从第一表面延伸并填充引线键合之间的空间，使得引线键合可以被封装层分离。 引线键合的未封装的部分由未被封装层覆盖的引线接合端表面的至少部分限定。