Method and apparatus for measuring a surface profile of a sample
    10.
    发明申请
    Method and apparatus for measuring a surface profile of a sample 失效
    用于测量样品的表面轮廓的方法和装置

    公开(公告)号:US20050258365A1

    公开(公告)日:2005-11-24

    申请号:US11096174

    申请日:2005-03-31

    CPC分类号: H01L22/12 H01L22/24

    摘要: In order to measure a surface profile of a sample, an imprint of the surface profile to be examined is produced in a transfer material. The sample contains processed semiconductor material and is in particular a patterned semiconductor wafer or part of a patterned semiconductor wafer. The transfer material is deformable and curable under suitable ambient conditions. The transfer material may be a thermoplastic material or a material which is deformable as desired after application on a substrate and cures in one case by means of irradiation with photons having a suitable wavelength or alternatively heating. The transfer material may be configured in such a way that the imprint produced is the same size as or alternatively of smaller size than the surface profile. The imprint produced is subsequently measured by known methods.

    摘要翻译: 为了测量样品的表面轮廓,在转印材料中产生待检查的表面轮廓的压印。 样品包含经处理的半导体材料,特别是图案化的半导体晶片或图案化的半导体晶片的一部分。 转印材料可在适当的环境条件下变形和固化。 转印材料可以是热塑性材料或在施加到基底上之后根据需要可变形的材料,并且在一种情况下通过用具有合适波长的光子或替代地加热的光子照射来固化。 转印材料可以以这样的方式构造,使得产生的印记与表面轮廓尺寸相同或更小。 随后通过已知方法测量产生的印迹。