公开(公告)号：US06706202B1

公开(公告)日：2004-03-16

申请号：US09672386

申请日：2000-09-28

申请人： Decai Sun ,  Michel A. Rosa ,  Eric Peeters ,  Francesco Lemmi ,  Patrick Y. Maeda ,  Christopher L. Chua

发明人： Decai Sun ,  Michel A. Rosa ,  Eric Peeters ,  Francesco Lemmi ,  Patrick Y. Maeda ,  Christopher L. Chua

IPC分类号： B81B702

CPC分类号： B81C1/00666 ,  B81B2201/047 ,  B81C2201/017

摘要： A method is disclosed for making shaped optical moems components with stressed thin films. In particular, stressed thin films are used to make mirror structures.

摘要翻译： 公开了一种用于制造具有应力薄膜的成形光学元件的方法。 特别地，应力薄膜用于制造镜面结构。

公开(公告)号：US07042015B2

公开(公告)日：2006-05-09

申请号：US09924840

申请日：2001-08-08

申请人： Decai Sun ,  Eric Peeters ,  Christopher L. Chua ,  Francesco Lemmi ,  Patrick Y. Maeda ,  Scott Solberg

发明人： Decai Sun ,  Eric Peeters ,  Christopher L. Chua ,  Francesco Lemmi ,  Patrick Y. Maeda ,  Scott Solberg

IPC分类号： H01L31/12

CPC分类号： H01L31/1055 ,  B41J2/45 ,  H01L25/0753 ,  H01L31/1016 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01S5/02 ,  H01S5/0262 ,  H01S5/4025 ,  H01L2924/00

摘要： A light-producing device integrated with a power monitoring system include a light-producing device from which light is emitted in wavelengths that can range from approximately 700 nm to approximately 3 microns. A semi-transparent sensor is located such that at least a portion of the light emitted passes through the semi-transparent sensor and at least a portion of light is absorbed by the semi-transparent sensor. The semi-transparent sensor is configured to be semi-transparent at wavelengths that can range from 700 nm to 3 microns. The semi-transparent sensor may also be used with an external light source, for example with fiber-optic cables.

公开(公告)号：US07284324B2

公开(公告)日：2007-10-23

申请号：US11197675

申请日：2005-08-04

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01R43/16

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

摘要翻译： 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US07000315B2

公开(公告)日：2006-02-21

申请号：US10387203

申请日：2003-03-11

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01R43/16

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

公开(公告)号：US06856225B1

公开(公告)日：2005-02-15

申请号：US09573815

申请日：2000-05-17

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01F41/04 ,  G01R1/067 ,  G01R3/00 ,  G03C5/00 ,  H01F17/00 ,  H01F17/02 ,  H01F27/29 ,  H01L21/02 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/522 ,  H01R9/03 ,  H05K7/02

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

摘要翻译： 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US06947291B2

公开(公告)日：2005-09-20

申请号：US10154555

申请日：2002-05-23

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01F41/04 ,  G01R1/067 ,  G01R3/00 ,  G03C5/00 ,  H01F17/00 ,  H01F17/02 ,  H01F27/29 ,  H01L21/02 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/522 ,  H01R9/03 ,  H05K7/02

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

公开(公告)号：US07324717B2

公开(公告)日：2008-01-29

申请号：US11286123

申请日：2005-11-22

申请人： Christopher L. Chua ,  Michel A. Rosa ,  Patrick Y. Maeda ,  Eric Peeters

发明人： Christopher L. Chua ,  Michel A. Rosa ,  Patrick Y. Maeda ,  Eric Peeters

IPC分类号： G02B6/12 ,  G02B6/32

CPC分类号： H01L31/02327 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/16151 ,  H01S5/02296 ,  H01S5/18388 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microlens structure is mounted directly onto the upper surface of a packaged VCSEL device and positioned to locate microlenses directly over corresponding VCSEL elements. The microlens structure includes a block-like pedestal having a lower surface that faces the upper surface of the VSCEL device. The microlenses are formed in a central region of the lower surface, and several legs (stand-offs) extend from peripheral edges of the lower surface. During assembly, the VCSEL device is positioned under the microlens structure such that each microlens is aligned over its corresponding VCSEL element, and then raised until the legs contact the upper surface of the VCSEL device. The legs serve to self-align the microlenses to the VCSEL device, and are sized to maintain an optimal distance between the microlenses and the VCSEL elements. The pedestal is attached to a carrier plate that is secured to an IC package housing the VCSEL device.

摘要翻译： 微透镜结构直接安装在封装的VCSEL器件的上表面上并定位成将微透镜直接定位在相应的VCSEL元件上。 微透镜结构包括具有面向VSCEL器件的上表面的下表面的块状基座。 微透镜形成在下表面的中心区域中，并且几个腿（支座）从下表面的周边边缘延伸。 在组装期间，VCSEL器件位于微透镜结构下方，使得每个微透镜在其相应的VCSEL元件上对准，然后升高直到腿接触VCSEL器件的上表面。 腿用于将微透镜自对准到VCSEL器件，并且其尺寸被设计成保持微透镜和VCSEL元件之间的最佳距离。 基座固定在承载VCSEL装置的IC封装的承载板上。

公开(公告)号：US6054335A

公开(公告)日：2000-04-25

申请号：US209866

申请日：1998-12-11

申请人： Decai Sun ,  Ross D. Bringans ,  Christopher L. Chua ,  Philip D. Floyd ,  Eric Peeters ,  Joel A. Kubby ,  Alex T. Tran

发明人： Decai Sun ,  Ross D. Bringans ,  Christopher L. Chua ,  Philip D. Floyd ,  Eric Peeters ,  Joel A. Kubby ,  Alex T. Tran

IPC分类号： B81B3/00 ,  B81B7/02 ,  H01L27/15 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/026 ,  H01S5/042 ,  H01S5/183 ,  H01S5/42 ,  H01L21/00

CPC分类号： H01S5/18308 ,  H01S5/02288 ,  H01L27/15 ,  H01S5/021 ,  H01S5/02252 ,  H01S5/4087 ,  H01S5/423 ,  H01S5/426

摘要： A III-V compound light emitter is integrated with Si-based actuators. The Proposed devices take advantage of the superior optical properties of III-V compounds and the superior mechanical properties of Si, as well as mature fabrication technologies of Si-Micro-Electro-Mechanical Systems (MEMS). The emitter can be a light emitting diode (LED), a vertical cavity surface emitting laser (VCSEL) or an edge emitting laser. Electro or magnetic based actuation from Si-based actuators provides linear or angular movement of the light emitter.

摘要翻译： III-V复合光发射器与Si基致动器集成。 提出的器件利用了III-V化合物的优异光学性能和Si的优异机械性能，以及Si-Micro-Electro-Mechanical Systems（MEMS）的成熟制造技术。 发射极可以是发光二极管（LED），垂直腔表面发射激光器（VCSEL）或边缘发射激光器。 基于Si的致动器的基于电或磁的致动器提供光发射器的线性或角度运动。

公开(公告)号：US06549691B1

公开(公告)日：2003-04-15

申请号：US09708814

申请日：2000-11-08

申请人： Robert A. Street ,  Eric Peeters ,  Michel A. Rosa ,  Jeng Ping Lu ,  Christopher L. Chua

发明人： Robert A. Street ,  Eric Peeters ,  Michel A. Rosa ,  Jeng Ping Lu ,  Christopher L. Chua

IPC分类号： G02B626

CPC分类号： G02B6/3586 ,  G02B6/3512 ,  G02B6/3556 ,  G02B6/3588 ,  G02B6/359 ,  H04Q11/0005 ,  H04Q2011/0026 ,  H04Q2011/0039 ,  H04Q2011/0058

摘要： An optical cross switch including an improved system to align optical components is described. The system utilizes a highly transmissive sensor positioned in the optical path of an optical signal to determine the precise position of the optical signal. A feedback loop uses output from the highly transmissive sensor to readjust elements that maintains the optical signal in a desired position. The current system is particularly suitable for use in an optical cross switch.

摘要翻译： 描述了包括改进的对准光学部件的系统的光交叉开关。 该系统利用位于光信号的光路中的高度透射的传感器来确定光信号的精确位置。 反馈回路使用高度透射传感器的输出来重新调整将光信号保持在期望位置的元件。 目前的系统特别适用于光交叉开关。

公开(公告)号：US06429417B1

公开(公告)日：2002-08-06

申请号：US09708808

申请日：2000-11-08

申请人： Robert A. Street ,  Eric Peeters ,  Michel A. Rosa ,  Jeng Ping Lu ,  Christopher L. Chua

发明人： Robert A. Street ,  Eric Peeters ,  Michel A. Rosa ,  Jeng Ping Lu ,  Christopher L. Chua

IPC分类号： H01L2700

CPC分类号： H01L31/1055 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/356 ,  G02B6/3588 ,  G02B26/0841 ,  H01L31/108 ,  H04Q11/0005 ,  H04Q2011/003 ,  H04Q2011/0039

摘要： A system to align optical components is described. The system utilizes a highly transmissive sensor positioned in the optical path of an optical signal to determine the precise position of the optical signal. A feedback loop uses output from the highly transmissive sensor to readjust elements that maintains the optical signal in a desired position. The current system is particularly suitable for use in an optical cross switch.

摘要翻译： 描述了对准光学部件的系统。 该系统利用位于光信号的光路中的高度透射的传感器来确定光信号的精确位置。 反馈回路使用高度透射传感器的输出来重新调整将光信号保持在期望位置的元件。 目前的系统特别适用于光交叉开关。