公开(公告)号：US20150380354A1

公开(公告)日：2015-12-31

申请号：US14845435

申请日：2015-09-04

申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

发明人： Byoung-Gue MIN ,  Sang Choon KO ,  Jong-Won LIM ,  Hokyun AHN ,  Hyung Sup YOON ,  Jae Kyoung MUN ,  Eun Soo NAM

IPC分类号： H01L23/535 ,  H01L23/48

CPC分类号： H01L23/535 ,  H01L21/02365 ,  H01L21/28 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor device may include a substrate having a lower via-hole, an epitaxial layer having an opening exposing a top surface of the substrate, a semiconductor chip disposed on the top surface of the substrate and including first, second, and third electrodes, an upper metal layer connected to the first electrode, a supporting substrate disposed on the upper metal layer and having an upper via-hole, an upper pad disposed on the substrate and extending into the upper via-hole, a lower pad connected to the second electrode in the opening, and a lower metal layer covering a bottom surface of the substrate and connected to the lower pad through the lower via-hole.

摘要翻译： 半导体器件可以包括具有下通孔的衬底，具有暴露衬底的顶表面的开口的外延层，设置在衬底的顶表面上并包括第一，第二和第三电极的半导体芯片， 连接到第一电极的上金属层，设置在上金属层上并具有上通孔的支撑基板，设置在基板上并延伸到上通孔中的上焊盘，连接到第二电极的下焊盘 以及覆盖基板的底面的下金属层，并且通过下通路孔与下焊盘连接。

公开(公告)号：US20140103539A1

公开(公告)日：2014-04-17

申请号：US14021269

申请日：2013-09-09

申请人： Electronics and Telecommunications Research Institute

发明人： Byoung-Gue MIN ,  Sang Choon KO ,  Jong-Won Lim ,  Hokyun AHN ,  Hyung Sup YOON ,  Jae Kyoung MUN ,  Eun Soo NAM

IPC分类号： H01L21/768 ,  H01L23/48 ,  H01L21/28 ,  H01L21/02

CPC分类号： H01L23/535 ,  H01L21/02365 ,  H01L21/28 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor device may include a substrate having a lower via-hole, an epitaxial layer having an opening exposing a top surface of the substrate, a semiconductor chip disposed on the top surface of the substrate and including first, second, and third electrodes, an upper metal layer connected to the first electrode, a supporting substrate disposed on the upper metal layer and having an upper via-hole, an upper pad disposed on the substrate and extending into the upper via-hole, a lower pad connected to the second electrode in the opening, and a lower metal layer covering a bottom surface of the substrate and connected to the lower pad through the lower via-hole.

摘要翻译： 半导体器件可以包括具有下通孔的衬底，具有暴露衬底的顶表面的开口的外延层，设置在衬底的顶表面上并包括第一，第二和第三电极的半导体芯片， 连接到第一电极的上金属层，设置在上金属层上并具有上通孔的支撑基板，设置在基板上并延伸到上通孔中的上焊盘，连接到第二电极的下焊盘 以及覆盖基板的底面的下金属层，并且通过下通路孔与下焊盘连接。

公开(公告)号：US20170236909A1

公开(公告)日：2017-08-17

申请号：US15248676

申请日：2016-08-26

申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

发明人： Ho Kyun AHN ,  Dong Min KANG ,  Yong-Hwan KWON ,  Dong-Young KIM ,  SEONG IL KIM ,  Hae Cheon KIM ,  Eun Soo NAM ,  Jae Won DO ,  Byoung-Gue MIN ,  Hyung Sup YOON ,  Sang-Heung LEE ,  Jong Min LEE ,  Jong-Won LIM ,  Hyun Wook JUNG ,  Kyu Jun CHO

IPC分类号： H01L29/40 ,  H01L29/66 ,  H01L29/778 ,  H01L29/20 ,  H01L29/205

CPC分类号： H01L29/404 ,  H01L21/6835 ,  H01L29/0619 ,  H01L29/0657 ,  H01L29/2003 ,  H01L29/205 ,  H01L29/401 ,  H01L29/4175 ,  H01L29/66462 ,  H01L29/7786 ,  H01L29/7787 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A high electron mobility transistor includes a substrate including a first surface and a second surface facing each other and having a via hole passing through the first surface and the second surface, an active layer on the first surface, a cap layer on the active layer and including a gate recess region exposing a portion of the active layer, a source electrode and a drain electrode on one of the cap layer and the active layer, an insulating layer on the source electrode and the drain electrode and having on opening corresponding to the gate recess region to expose the gate recess region, a first field electrode on the insulating layer, a gate electrode electrically connected to the first field electrode on the insulating layer, and a second field electrode on the second surface and contacting the active layer through the via hole.

公开(公告)号：US20170133471A1

公开(公告)日：2017-05-11

申请号：US15238492

申请日：2016-08-16

申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

发明人： Jong Min LEE ,  Byoung-Gue MIN ,  Hyung Sup YOON ,  Dong Min KANG ,  Dong-Young KIM ,  SEONG-IL KIM ,  Hae Cheon KIM ,  Jae Won DO ,  Ho Kyun AHN ,  Sang-Heung LEE ,  Jong-Won LIM ,  Hyun Wook JUNG ,  Kyu Jun CHO ,  Chull Won JU

IPC分类号： H01L29/40 ,  H01L29/66 ,  H01L29/778 ,  H01L29/20 ,  H01L29/205

CPC分类号： H01L29/408 ,  H01L29/2003 ,  H01L29/205 ,  H01L29/66462 ,  H01L29/7786 ,  H01L29/7787

摘要： The present invention relates to a high reliability field effect power device and a manufacturing method thereof. A method of manufacturing a field effect power device includes sequentially forming a transfer layer, a buffer layer, a barrier layer and a passivation layer on a substrate, patterning the passivation layer by etching a first region of the passivation layer, and forming at least one electrode on the first region of the barrier layer exposed by patterning the passivation layer, wherein the first region is provided to form the at least one electrode, and the passivation layer may include a material having a wider bandgap than the barrier layer to prevent a trapping effect and a leakage current of the field effect power device.

公开(公告)号：US20190103483A1

公开(公告)日：2019-04-04

申请号：US16137235

申请日：2018-09-20

申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

发明人： Hokyun AHN ,  Min Jeong SHIN ,  Jeong Jin KIM ,  Hae Cheon KIM ,  Jae Won DO ,  Byoung-Gue MIN ,  Hyung Sup YOON ,  Hyung Seok LEE ,  Jong-Won LIM ,  Sungjae CHANG ,  Hyunwook JUNG ,  Kyu Jun CHO ,  Dong Min KANG ,  Dong-Young KIM ,  SEONG-IL KIM ,  Sang-Heung LEE ,  Jongmin LEE ,  Hong Gu JI

IPC分类号： H01L29/78 ,  H01L29/20 ,  H01L29/45 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L21/3065

摘要： Provided is a semiconductor device including a substrate in which an insulation layer is disposed between a first semiconductor layer and a second semiconductor layer, a through-hole penetrating through the substrate, the through-hole having a first hole penetrating through the first semiconductor layer and a second hole penetrating through the insulation layer and the second semiconductor layer from a bottom surface of the first hole, an epi-layer disposed inside the through-hole, a drain electrode disposed inside the second hole and contacting one surface of the epi-layer, and a source electrode and a gate electrode which are disposed on the other surface of the epi-layer.

公开(公告)号：US20190081166A1

公开(公告)日：2019-03-14

申请号：US16028612

申请日：2018-07-06

申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

发明人： Jae Won DO ,  Dong Min KANG ,  Dong-Young KIM ,  SEONG-IL KIM ,  Hae Cheon KIM ,  Byoung-Gue MIN ,  Min Jeong SHIN ,  Hokyun AHN ,  Hyung Sup YOON ,  Sang-Heung LEE ,  Jongmin LEE ,  Jong-Won LIM ,  Sungjae CHANG ,  Yoo Jin JANG ,  Hyunwook JUNG ,  Kyu Jun CHO ,  Hong Gu JI

IPC分类号： H01L29/778 ,  H01L29/423 ,  H01L29/66 ,  H01L29/06 ,  H01L29/10 ,  H01L29/205

摘要： Provided is a gate-all-around device. The gate-all-around device includes a substrate, a pair of heterojunction source/drain regions provided on the substrate, a heterojunction channel region provided between the pair of heterojunction source/drain regions, and a pair of ohmic electrodes provided on the pair of heterojunction source/drain regions, respectively. Each of the pair of heterojunction source/drain regions includes a pair of two-dimensional electron gas layers. The pair of ohmic electrodes extends toward an upper surface of the substrate and pass through the pair of heterojunction source/drain regions, respectively.

公开(公告)号：US20170237171A1

公开(公告)日：2017-08-17

申请号：US15229891

申请日：2016-08-05

申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

发明人： Dong-Young KIM ,  Dong Min KANG ,  SEONG-IL KIM ,  Hae Cheon KIM ,  Jae Won DO ,  Byoung-Gue MIN ,  Ho Kyun AHN ,  Hyung Sup YOON ,  Sang-Heung LEE ,  Jong Min LEE ,  Jong-Won LIM ,  Yoo Jin JANG ,  Hyun Wook JUNG ,  Kyu Jun CHO ,  Chull Won JU

IPC分类号： H01Q9/04 ,  H01Q1/50

CPC分类号： H01Q9/0407 ,  H01Q1/50 ,  H01Q9/0442

摘要： Provided herein is a patch antenna including a multilayered substrate on which a plurality of dielectric layers are laminated; at least one metal pattern layer disposed between the plurality of dielectric layers outside a central area of the multilayered substrate; an antenna patch disposed on an upper surface of the multilayered substrate and within the central area; a ground layer disposed on a lower surface of the multilayered substrate; a plurality of connection via patterns penetrating the plurality of dielectric layers to connect the metal pattern layer and the ground layer, and surrounding the central area; a transmission line comprising a first transmission line unit disposed on the upper surface of the multilayered substrate and located outside the central area, and a second transmission line unit disposed on the upper surface of the multilayered substrate and located within the central area; and an impedance transformer located below the second transmission line unit within the central area of the multilayered substrate.

公开(公告)号：US20140035044A1

公开(公告)日：2014-02-06

申请号：US14049816

申请日：2013-10-09

申请人： Electronics and Telecommunications Research Institute

发明人： Hokyun AHN ,  Jong-Won LIM ,  Hyung Sup YOON ,  Byoung-Gue MIN ,  Sang-Heung LEE ,  Hae Cheon KIM ,  Eun Soo NAM

IPC分类号： H01L29/78

CPC分类号： H01L29/7831 ,  H01L29/2003 ,  H01L29/404 ,  H01L29/42316 ,  H01L29/66462 ,  H01L29/66863 ,  H01L29/7787 ,  H01L29/812

摘要： Disclosed are a field-effect transistor and a manufacturing method thereof. The disclosed field-effect transistor includes: a semiconductor substrate; a source ohmic metal layer formed on one side of the semiconductor substrate; a drain ohmic metal layer formed on another side of the semiconductor substrate; a gate electrode formed between the source ohmic metal layer and the drain ohmic metal layer, on an upper portion of the semiconductor substrate; an insulating film formed on the semiconductor substrate's upper portion including the source ohmic metal layer, the drain ohmic metal layer and the gate electrode; and a plurality of field electrodes formed on an upper portion of the insulating film, wherein the insulating film below the respective field electrodes has different thicknesses.

摘要翻译： 公开了场效应晶体管及其制造方法。 所公开的场效应晶体管包括：半导体衬底; 源极欧姆金属层，形成在半导体衬底的一侧上; 形成在所述半导体衬底的另一侧上的漏极欧姆金属层; 在所述源极欧姆金属层和所述漏极欧姆金属层之间形成的栅电极，位于所述半导体衬底的上部; 形成在包括源极欧姆金属层，漏极欧姆金属层和栅电极的半导体衬底的上部上的绝缘膜; 以及形成在绝缘膜的上部的多个场电极，其中，各个场电极下方的绝缘膜具有不同的厚度。

公开(公告)号：US20160020147A1

公开(公告)日：2016-01-21

申请号：US14862123

申请日：2015-09-22

申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

发明人： Jongmin LEE ,  Byoung-Gue MIN ,  Seong-il KIM ,  Hyung Sup YOON ,  Jae Kyoung MUN ,  Eun Soo NAM

IPC分类号： H01L21/8222 ,  H01L27/06

CPC分类号： H01L21/8222 ,  H01G7/00 ,  H01L27/0647 ,  H01L27/0658 ,  H01L29/93 ,  H03F1/565 ,  H03F3/21 ,  H03F2200/36 ,  H03F2200/378 ,  H03F2200/387 ,  H03F2200/391 ,  H03H7/38 ,  Y10T29/43

摘要： A manufacturing method for a variable capacitor includes forming a first element of which a capacitance value depends on a voltage applied to both of two terminals of a first area on a substrate, forming a second element having a capacitance value fixed to a second area on the substrate adjacent to the first area, and forming metallic wires for connecting the first element and the second element and connecting the first element and the second element with the outside. The first element maybe a bipolar transistor that may include a diode. The second element maybe a capacitor that includes a dielectric.

摘要翻译： 一种可变电容器的制造方法，包括：形成电容值取决于施加到基板上的第一区域的两端的电压的第一元件，形成具有固定在第二区域上的电容值的第二元件 基板，与第一区域相邻，并且形成用于连接第一元件和第二元件的金属线，并且将第一元件和第二元件与外部连接。 第一个元件可以是可以包括二极管的双极晶体管。 第二元件可以是包括电介质的电容器。

公开(公告)号：US20150171188A1

公开(公告)日：2015-06-18

申请号：US14633984

申请日：2015-02-27

申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

发明人： Hyung Sup YOON ,  Byoung-Gue MIN ,  Jong-Won LIM ,  Hokyun AHN ,  Seong-Il Kim ,  Sang Heung LEE ,  Dong Min KANG ,  Chull Won JU ,  Jae Kyoung MUN

IPC分类号： H01L29/66 ,  H01L29/201 ,  H01L21/02 ,  H01L21/28 ,  H01L21/311 ,  H01L29/423 ,  H01L29/20 ,  H01L29/205

CPC分类号： H01L29/66462 ,  H01L21/02118 ,  H01L21/0217 ,  H01L21/02178 ,  H01L21/0254 ,  H01L21/28264 ,  H01L21/28593 ,  H01L21/31111 ,  H01L21/31144 ,  H01L29/2003 ,  H01L29/201 ,  H01L29/205 ,  H01L29/404 ,  H01L29/42316 ,  H01L29/42376 ,  H01L29/778 ,  H01L29/7786

摘要： A field effect transistor is provided. The field effect transistor may include a capping layer on a substrate, a source ohmic electrode and a drain ohmic electrode on the capping layer, a first insulating layer and a second insulating layer stacked on the capping layer to cover the source and drain ohmic electrodes, a Γ-shaped gate electrode including a leg portion and a head portion, the leg portion being connected to the substrate between the source ohmic electrode and the drain ohmic electrode, and the head portion extending from the leg portion to cover a top surface of the second insulating layer, a first planarization layer on the second insulating layer to cover the Γ-shaped gate electrode, and a first electrode on the first planarization layer, the first electrode being connected to the source ohmic electrode or the drain ohmic electrode.

摘要翻译： 提供场效应晶体管。 场效应晶体管可以包括衬底上的覆盖层，覆盖层上的源欧姆电极和漏极欧姆电极，堆叠在覆盖层上以覆盖源极和漏极欧姆电极的第一绝缘层和第二绝缘层， 包括脚部和头部的栅格电极，所述脚部分连接到所述源欧姆电极和所述漏极欧姆电极之间的衬底，并且所述头部从所述腿部延伸以覆盖所述源极欧姆电极和所述漏极欧姆电极的顶表面 所述第二绝缘层，在所述第二绝缘层上覆盖所述栅格电极的第一平坦化层和所述第一平坦化层上的第一电极，所述第一电极连接到所述源欧姆电极或所述漏极欧姆电极。