公开(公告)号：US20140009932A1

公开(公告)日：2014-01-09

申请号：US13544662

申请日：2012-07-09

申请人： Eric Tarsa ,  Monica Hansen ,  Bernd Keller

发明人： Eric Tarsa ,  Monica Hansen ,  Bernd Keller

IPC分类号： F21V7/04 ,  F21V7/00

CPC分类号： H01L33/54 ,  F21K9/233 ,  F21S8/026 ,  F21V7/0008 ,  F21V7/005 ,  F21V13/04 ,  F21V29/74 ,  F21Y2115/10

摘要： LED components are described having primary optics provide improved LED component emission characteristics. Light fixtures are also described that utilize the LED components to provide improved light fixture emissions. One LED component according to the present invention comprises an LED chip emitting an LED chip emission pattern. A primary optic is included directly on the LED chip with LED light from the LED chip passing through the primary optic. The primary optic shapes the LED emission pattern into an LED component emission pattern with the LED component emission pattern being broader than the LED chip emission pattern.

摘要翻译： 描述了具有主要光学器件的LED组件，提供了改进的LED组件发射特性。 还描述了利用LED组件来提供改进的灯具排放物的灯具。 根据本发明的一个LED组件包括发射LED芯片发射图案的LED芯片。 主要光学元件直接包含在LED芯片上，LED芯片的LED光通过主光学元件。 主要光学器件将LED发射图案形成LED组件发射图案，其中LED组件发射图案比LED芯片发射图案更宽。

公开(公告)号：US08931929B2

公开(公告)日：2015-01-13

申请号：US13544662

申请日：2012-07-09

申请人： Eric Tarsa ,  Monica Hansen ,  Bernd Keller

发明人： Eric Tarsa ,  Monica Hansen ,  Bernd Keller

IPC分类号： F21V3/00

CPC分类号： H01L33/54 ,  F21K9/233 ,  F21S8/026 ,  F21V7/0008 ,  F21V7/005 ,  F21V13/04 ,  F21V29/74 ,  F21Y2115/10

摘要： LED components are described having primary optics provide improved LED component emission characteristics. Light fixtures are also described that utilize the LED components to provide improved light fixture emissions. One LED component according to the present invention comprises an LED chip emitting an LED chip emission pattern. A primary optic is included directly on the LED chip with LED light from the LED chip passing through the primary optic. The primary optic shapes the LED emission pattern into an LED component emission pattern with the LED component emission pattern being broader than the LED chip emission pattern.

摘要翻译： 描述了具有主要光学器件的LED组件，提供了改进的LED组件发射特性。 还描述了利用LED组件来提供改进的灯具排放物的灯具。 根据本发明的一个LED组件包括发射LED芯片发射图案的LED芯片。 主要光学元件直接包含在LED芯片上，LED芯片的LED光通过主光学元件。 主要光学器件将LED发射图案形成LED组件发射图案，其中LED组件发射图案比LED芯片发射图案更宽。

公开(公告)号：US09159888B2

公开(公告)日：2015-10-13

申请号：US11899790

申请日：2007-09-07

申请人： Ashay Chitnis ,  James Ibbetson ,  Bernd Keller ,  David T. Emerson ,  John Edmond ,  Michael J. Bergmann ,  Jasper S. Cabalu ,  Jeffrey C. Britt ,  Arpan Chakraborty ,  Eric Tarsa ,  Yankun Fu

发明人： Ashay Chitnis ,  James Ibbetson ,  Bernd Keller ,  David T. Emerson ,  John Edmond ,  Michael J. Bergmann ,  Jasper S. Cabalu ,  Jeffrey C. Britt ,  Arpan Chakraborty ,  Eric Tarsa ,  James Seruto ,  Yankun Fu

IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/62 ,  H01L33/38 ,  H01L33/36 ,  H01L33/44 ,  H01L33/54

CPC分类号： H01L33/508 ,  H01L33/0095 ,  H01L33/36 ,  H01L33/387 ,  H01L33/44 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

摘要翻译： 制造发光二极管（LED）芯片的方法包括通常在衬底上提供多个LED。 基座沉积在LED上，每个基座与其中一个LED电接触。 在LED上形成涂层，其中涂层埋入至少一些基座。 然后将涂层平坦化以暴露至少一些埋置的基座，同时在所述LED上留下至少一些所述涂层。 然后可以例如通过引线接合露出的基座。 本发明公开了用于制造LED芯片的类似方法，所述LED芯片具有倒装芯片接合在载体基板上并用于制造其它半导体器件的LED。 还公开了使用所公开的方法制造的LED芯片晶片和LED芯片。

公开(公告)号：US08941134B2

公开(公告)日：2015-01-27

申请号：US13242103

申请日：2011-09-23

申请人： Ban P. Loh ,  Nicholas W. Medendorp, Jr. ,  Eric Tarsa ,  Bernd Keller

发明人： Ban P. Loh ,  Nicholas W. Medendorp, Jr. ,  Eric Tarsa ,  Bernd Keller

IPC分类号： H01L33/62 ,  H01L23/495 ,  H01L33/48 ,  H01L33/64 ,  H01L23/498 ,  H01L25/075

CPC分类号： H01L33/483 ,  H01L23/49861 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01322 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.

摘要翻译： 用于发光器件的模块化封装包括引线框架，其包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域 。 引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。 热固性封装体可以在第二区域的顶表面和底表面上。 泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。 还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。

公开(公告)号：US08882284B2

公开(公告)日：2014-11-11

申请号：US13018291

申请日：2011-01-31

申请人： Tao Tong ,  Ronan Le Toquin ,  Bernd Keller ,  Eric Tarsa ,  Mark Youmans ,  Theodore Lowes ,  Nicholas W. Medendorp, Jr. ,  Antony Van De Ven ,  Gerald Negley

发明人： Tao Tong ,  Ronan Le Toquin ,  Bernd Keller ,  Eric Tarsa ,  Mark Youmans ,  Theodore Lowes ,  Nicholas W. Medendorp, Jr. ,  Antony Van De Ven ,  Gerald Negley

IPC分类号： F21V9/16 ,  F21V5/00 ,  F21K99/00 ,  F21Y101/02 ,  F21V3/00 ,  F21V29/00 ,  F21V3/02 ,  F21V7/20

CPC分类号： F21V9/30 ,  F21K9/232 ,  F21K9/64 ,  F21V3/00 ,  F21V3/02 ,  F21V29/505 ,  F21V29/767 ,  F21V29/773 ,  F21Y2115/10

摘要： An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The properties of the diffuser, such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the scattering layer properties may be used to control various lamp properties such as color uniformity and light intensity distribution as a function of viewing angle.

摘要翻译： 公开了一种LED灯或灯泡，其包括光源，散热结构和光学腔。 光学腔包括具有转换材料的荧光体载体并且布置在通向空腔的开口上。 荧光体载体包括导热透明材料并且热耦合到散热器结构。 基于LED的光源通过来自光源的光穿过荧光体载体而安装在远离荧光体载体的光学腔中。 包括安装在光学腔上的扩散器圆顶，来自光学腔的光通过扩散器圆顶。 扩散器的性质，如几何形状，散射层的散射特性，表面粗糙度或平滑度以及散射层性质的空间分布可用于控制各种灯具性能，如颜色均匀性和光强度分布，作为 可视角度。

公开(公告)号：USD653365S1

公开(公告)日：2012-01-31

申请号：US29381404

申请日：2010-12-19

申请人： Zongjie Yuan ,  Eric Tarsa ,  Tao Tong ,  Ronan LeToquin ,  Bernd Keller

设计人： Zongjie Yuan ,  Eric Tarsa ,  Tao Tong ,  Ronan LeToquin ,  Bernd Keller

公开(公告)号：US20110216523A1

公开(公告)日：2011-09-08

申请号：US12901405

申请日：2010-10-08

申请人： TAO TONG ,  Ronan Letoquin ,  Bernd Keller ,  Eric Tarsa ,  Mark Youmans ,  Theodore Lowes ,  Nicholas W. Medendorp, JR. ,  Antony Van De Ven ,  Gerald Negley ,  Peter Guschl ,  Zongjie Yuan

发明人： TAO TONG ,  Ronan Letoquin ,  Bernd Keller ,  Eric Tarsa ,  Mark Youmans ,  Theodore Lowes ,  Nicholas W. Medendorp, JR. ,  Antony Van De Ven ,  Gerald Negley ,  Peter Guschl ,  Zongjie Yuan

IPC分类号： F21V9/16 ,  H01K1/30 ,  H01J1/62 ,  H01J61/52 ,  F21V9/00 ,  F21V11/00

CPC分类号： F21K9/135 ,  F21K9/232 ,  F21K9/60 ,  F21K9/64 ,  F21K9/65 ,  F21V3/12 ,  F21V5/002 ,  F21V29/505 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A lighting device comprising a light source and a diffuser spaced from the light source. The lighting device further comprises a wavelength conversion material disposed between the light source and the diffuser and spaced from the light source and the diffuser, wherein the diffuser is shaped such that there are different distances between the diffuser and said conversion material at different emission angles. In other embodiments the diffuser includes areas with different diffusing characteristics. Some lamps are arranged to meet A19 and Energy Star lighting standards.

摘要翻译： 一种照明装置，包括光源和与光源间隔开的扩散器。 照明装置还包括设置在光源和扩散器之间并与光源和漫射器隔开的波长转换材料，其中扩散器被成形为使得扩散器和所述转换材料之间在不同的发射角度处具有不同的距离。 在其它实施例中，扩散器包括具有不同扩散特性的区域。 一些灯具被安排满足A19和能源之星照明标准。

公开(公告)号：US07821023B2

公开(公告)日：2010-10-26

申请号：US12154691

申请日：2008-05-23

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US20080012036A1

公开(公告)日：2008-01-17

申请号：US11657347

申请日：2007-01-24

申请人： Ban Loh ,  Nicholas Medendorp ,  Eric Tarsa ,  Bernd Keller

发明人： Ban Loh ,  Nicholas Medendorp ,  Eric Tarsa ,  Bernd Keller

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/483 ,  H01L23/49861 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01322 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.

摘要翻译： 用于发光器件的模块化封装包括引线框架，该引线框架包括具有顶表面，底表面和第一厚度的第一区域和具有小于第一厚度的顶表面，底表面和第二厚度的第二区域 。 引线框还包括从第二区域横向延伸的电引线，并且封装件还包括在引线框上并围绕第一区域的热固性封装主体。 热固性封装体可以在第二区域的顶表面和底表面上。 泄漏屏障可以在引线框架上，并且封装主体可以在泄漏屏障上。 还公开了在引线框架上形成包括热固性封装体的模块化封装的方法。

公开(公告)号：US20070120129A1

公开(公告)日：2007-05-31

申请号：US11353647

申请日：2006-02-13

申请人： Steven DenBaars ,  Eric Tarsa ,  Michael Mack ,  Bernd Keller ,  Brian Thibeault ,  Adam Saxler

发明人： Steven DenBaars ,  Eric Tarsa ,  Michael Mack ,  Bernd Keller ,  Brian Thibeault ,  Adam Saxler

IPC分类号： H01L33/00

CPC分类号： H01L33/08 ,  H01L25/0756 ,  H01L27/15 ,  H01L33/025 ,  H01L33/30 ,  H01L33/343 ,  H01L33/465 ,  H01L33/502 ,  H01L2224/8592 ,  H01L2924/0002 ,  H01S5/405 ,  H01S5/4087 ,  H01L2924/00

摘要： A solid state light emitting device comprising an emitter structure having an active region of semiconductor material and a pair of oppositely doped layers of semiconductor material on opposite sides of the active region. The active region emits light at a predetermined wavelength in response to an electrical bias across the doped layers. An absorption layer of semiconductor material is included that is integral to said emitter structure and doped with at least one rare earth or transition element. The absorption layer absorbs at least some of the light emitted from the active region and re-emits at least one different wavelength of light. A substrate is included with the emitter structure and absorption layer disposed on the substrate.

摘要翻译： 一种固态发光器件，包括具有半导体材料的有源区的发射极结构和在该有源区的相对侧上的一对相对掺杂的半导体材料层。 响应于穿过掺杂层的电偏压，有源区域以预定波长发光。 包括与所述发射极结构成一体并掺杂有至少一种稀土或过渡元素的半导体材料的吸收层。 吸收层吸收从有源区域发射的至少一些光并且再发射至少一个不同波长的光。 发射体结构和衬底上设置的吸收层包括衬底。