公开(公告)号：US20080020566A1

公开(公告)日：2008-01-24

申请号：US11902976

申请日：2007-09-27

Applicant: Frank Egitto ,  How Lin

Inventor： Frank Egitto ,  How Lin

IPC: H01L21/44

CPC classification number: H05K3/4007 ,  G01R1/06711 ,  G01R1/0735 ,  H05K1/0393 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2201/09745 ,  H05K2201/10378

Abstract: A method of making an interposer in which at least two dielectric layers are bonded to each other to sandwich a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts which are formed within and protrude from openings which are also formed within the dielectric layers as part of this method. The resulting interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board.

Abstract translation: 一种制造其中至少两个电介质层彼此结合以夹在其间的多个导体的插入件的方法。 这些导体各自电耦合相应的一对相对的电触点，其形成在也作为该方法的一部分的电介质层内形成的开口内并从其中突出。 所得到的内插器非常适合用作测试装置的一部分，以将半导体芯片的高密度图案的焊球接触件与装置的印刷电路板上的较小致密的触点阵列相互连接。

公开(公告)号：US20060022310A1

公开(公告)日：2006-02-02

申请号：US10900386

申请日：2004-07-28

Applicant: Frank Egitto ,  John Lauffer ,  How Lin ,  Voya Markovich ,  David Thomas

Inventor： Frank Egitto ,  John Lauffer ,  How Lin ,  Voya Markovich ,  David Thomas

IPC: H01L23/58

CPC classification number: G11C5/06 ,  B82Y10/00 ,  G02B6/43 ,  H01L23/48 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/16 ,  H05K1/181 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical assembly which includes a circuitized substrate comprised of an organic dielectric material having a first electrically conductive pattern thereon. At least part of the dielectric layer and pattern form the first, base portion of an organic memory device, the remaining portion being a second, polymer layer formed over the part of the pattern and a second conductive circuit formed on the polymer layer. A second dielectric layer if formed over the second conductive circuit and first circuit pattern to enclose the organic memory device. The device is electrically coupled to a first electrical component through the second dielectric layer and this first electrical component is electrically coupled to a second electrical component. A method of making the electrical assembly is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.

Abstract translation: 一种电气组件，其包括由其上具有第一导电图案的有机电介质材料构成的电路化衬底。 电介质层和图案的至少一部分形成有机存储器件的第一基底部分，其余部分是形成在图案部分上的第二聚合物层和形成在聚合物层上的第二导电电路。 如果形成在第二导电电路上的第二电介质层和第一电路图案以包围有机存储器件。 该器件通过第二介电层电耦合到第一电气部件，并且该第一电气部件电耦合到第二电气部件。 还提供了制造电气组件的方法，以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统。

公开(公告)号：US08198739B2

公开(公告)日：2012-06-12

申请号：US12836612

申请日：2010-08-13

Applicant: How Lin ,  Frank Egitto ,  Voya Markovich

Inventor： How Lin ,  Frank Egitto ,  Voya Markovich

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L23/3157 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L2224/0226 ,  H01L2224/02335 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73251 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81901 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: A method of forming a compressible contact structure on a semi-conductor chip which comprises bonding a compressible polymer layer to the chip's surface, forming a plurality of openings within the layer, depositing electrically conductive material within the openings to form electrical connections with the chip's contacts, forming a plurality of electrically conductive line elements on the polymer layer extending from a respective opening and each including an end portion, and forming a plurality of contact members each on a respective one of the line segment end portions. The compressible polymer layer allows the contact members to deflect toward (compress) the chip when the contact members are engaged by an external force or forces. A semi-conductor chip including such a compressible contact structure is also provided.

Abstract translation: 一种在半导体芯片上形成可压缩接触结构的方法，包括将可压缩的聚合物层粘合到芯片的表面，在该层内形成多个开口，在开口内沉积导电材料以形成与芯片的触点的电连接 在聚合物层上形成多个导电线元件，所述多个导电线元件从相应的开口延伸并且各自包括端部，并且在所述线段端部中的相应一个上形成多个接触元件。 当可接触构件通过外力或力接合时，可压缩聚合物层允许接触构件偏转（压缩）芯片。 还提供了包括这种可压缩接触结构的半导体芯片。

公开(公告)号：US20120038046A1

公开(公告)日：2012-02-16

申请号：US12836612

申请日：2010-08-13

Applicant: How Lin ,  Frank Egitto ,  Voya Markovich

Inventor： How Lin ,  Frank Egitto ,  Voya Markovich

IPC: H01L23/48 ,  H01L21/447

CPC classification number: H01L23/3157 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L2224/0226 ,  H01L2224/02335 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73251 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81901 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: A method of forming a compressible contact structure on a semi-conductor chip which comprises bonding a compressible polymer layer to the chip's surface, forming a plurality of openings within the layer, depositing electrically conductive material within the openings to form electrical connections with the chip's contacts, forming a plurality of electrically conductive line elements on the polymer layer extending from a respective opening and each including an end portion, and forming a plurality of contact members each on a respective one of the line segment end portions. The compressible polymer layer allows the contact members to deflect toward (compress) the chip when the contact members are engaged by an external force or forces. A semi-conductor chip including such a compressible contact structure is also provided.

Abstract translation: 一种在半导体芯片上形成可压缩接触结构的方法，包括将可压缩的聚合物层粘合到芯片的表面，在该层内形成多个开口，在开口内沉积导电材料以形成与芯片的触点的电连接 在聚合物层上形成多个导电线元件，所述多个导电线元件从相应的开口延伸并且各自包括端部，并且在所述线段端部中的相应一个上形成多个接触元件。 当可接触构件通过外力或力接合时，可压缩聚合物层允许接触构件偏转（压缩）芯片。 还提供了包括这种可压缩接触结构的半导体芯片。

公开(公告)号：US20060238207A1

公开(公告)日：2006-10-26

申请号：US11110901

申请日：2005-04-21

Applicant: Frank Egitto ,  How Lin

Inventor： Frank Egitto ,  How Lin

IPC: G01R31/02

CPC classification number: H05K3/4007 ,  G01R1/06711 ,  G01R1/0735 ,  H05K1/0393 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2201/09745 ,  H05K2201/10378

Abstract: An interposer comprising at least two dielectric layers bonded to each other, sandwiching a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts formed within and protruding from openings with the dielectric layers. The interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board. The interposer is also capable of being used for other purposes, including as an interconnecting circuitized substrate between a semiconductor chip and a chip carrier substrate or between a chip carrier and a printed circuit board. Various methods of making such an interposer are also provided.

Abstract translation: 一种插入器，包括至少两个彼此结合的介电层，在其间夹有多个导体。 这些导体各自电连接形成在电介质层的开口内并在其中突出的相应的一对相对的电触点。 内插器非常适合用作测试设备的一部分，以将半导体芯片的高度致密图案的焊球接触件与设备的印刷电路板上较小致密的触点阵列相互连接。 该插入器还能够用于其它目的，包括作为半导体芯片和芯片载体衬底之间的互连电路化衬底，或者在芯片载体和印刷电路板之间。 还提供了制造这种插入件的各种方法。

公开(公告)号：US20060022303A1

公开(公告)日：2006-02-02

申请号：US10900385

申请日：2004-07-28

Applicant: Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

Inventor： Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

IPC: H01L29/00 ,  H01L21/00

CPC classification number: G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

Abstract: A circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly capable of using the substrate is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.

Abstract translation: 一种电路化衬底，由至少一层具有导电图案的电介质材料构成。 图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成 设备。 衬底优选地与其它介电电路分层组件组合以形成多层衬底，在多层衬底上，可以将耦合到内部存储器件的分立电子部件（例如，逻辑芯片）放置在其上以与之组合工作。 还提供了能够使用基板的电气组件，以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统。

公开(公告)号：US20070139977A1

公开(公告)日：2007-06-21

申请号：US11305073

申请日：2005-12-19

Applicant: Subahu Desai ,  John Lauffer ,  How Lin ,  Voya Markovich ,  Ronald Smith

Inventor： Subahu Desai ,  John Lauffer ,  How Lin ,  Voya Markovich ,  Ronald Smith

IPC: H02M3/315

CPC classification number: H05K3/4069 ,  H05K1/0293 ,  H05K3/105 ,  H05K2201/096 ,  H05K2203/105

Abstract: A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.

Abstract translation: 一种改进电路化基板中的导电糊料连接的方法，其中施加至少一个并且优选一系列高压脉冲施加在该糊料上并且至少一个并且优选地一系列高电流脉冲，两个脉冲串分别施加 。 结果是通过粘合连接的导电路径的数量从在脉冲应用之前存在的导电路径的数量增加以及所述连接中相应的电阻减小。

公开(公告)号：US07142121B2

公开(公告)日：2006-11-28

申请号：US10860071

申请日：2004-06-04

Applicant: Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

Inventor： Benson Chan ,  William Kimler ,  How Lin ,  William Maines ,  Voya Markovich

IPC: G08B13/14

CPC classification number: G06K19/07749 ,  G06K2017/0045 ,  G06Q10/087

Abstract: A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).

Abstract translation: 用于包含与从一个位置（例如，仓库）运送到另一个位置（例如客户）的特定商品相关的特定信息的射频（RF）设备（或“标签”）。 该装置包括电路化基板（例如，印刷电路板），半导体芯片，天线和功率调节器，并且在一个实施例中设计成部分地插入到包含一个或多个 的货物被运输和跟踪。 或者，该装置可以通过其他方式（例如，粘合剂）附接。 托运人可以使用无线通信设备（例如，卫星）轻松跟踪含有此类设备的货物，以便随时快速确定货物的具体位置以及与此类货物相关的适当的所需信息（例如数量，重量 ，类型等）。

公开(公告)号：US20060213973A1

公开(公告)日：2006-09-28

申请号：US11086324

申请日：2005-03-23

Applicant: Benson Chan ,  How Lin ,  Voya Markovich ,  Ronald Smith

Inventor： Benson Chan ,  How Lin ,  Voya Markovich ,  Ronald Smith

IPC: G06K5/00 ,  G06K19/06

CPC classification number: G06K19/005 ,  G06K7/084 ,  G06K17/00 ,  G06K19/07354 ,  G06K2017/0064

Abstract: An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.

Abstract translation: 提供了一种电子卡组件，其包括其中具有可移动卡的保护壳体。 在一个示例中具有磁条的卡在卡插入时被插入到壳体中被擦除并且在卡退出期间被重新写回到其信息部分（磁条）上，提供适当的人类信息（例如，从指纹） 被大会的阅读器组件接收。

公开(公告)号：US20050152650A1

公开(公告)日：2005-07-14

申请号：US10756782

申请日：2004-01-13

Applicant: John Knickerbocker ,  How Lin

Inventor： John Knickerbocker ,  How Lin

IPC: G02B6/36 ,  G02B6/38

CPC classification number: G02B6/3672 ,  G02B6/3644 ,  G02B6/3692 ,  G02B6/3696 ,  G02B6/3885

Abstract: A method is provided for making ferrules for connecting optical fibers to other optical fibers or to an optical input device such as an optical chip. The method utilizes ceramic greensheets or silicon wafers. In one method, the greensheets are stacked and laminated and then fiber optic through openings are provided in the laminate for holding the fibers. The laminate is then sintered forming the ferrule.

Abstract translation: 提供了一种用于制造用于将光纤连接到其它光纤或光输入装置（例如光学芯片）的套圈的方法。 该方法采用陶瓷片或硅片。 在一种方法中，将绿色纸堆叠并层压，然后在用于保持纤维的层压体中设置光纤通孔。 然后将层压体烧结形成套圈。