公开(公告)号：US5218759A

公开(公告)日：1993-06-15

申请号：US670663

申请日：1991-03-18

申请人： Frank J. Juskey ,  Lonnie L. Bernardoni ,  Bruce J. Freyman ,  Anthony B. Suppelsa

发明人： Frank J. Juskey ,  Lonnie L. Bernardoni ,  Bruce J. Freyman ,  Anthony B. Suppelsa

IPC分类号： H01L21/56 ,  H01L21/68

CPC分类号： H01L21/568 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/181 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149

摘要： A method of making a pad array chip carrier package is disclosed. A semiconductor device (10) is bonded to a ceramic substrate (12). The semiconductor device may be attached to the substrate by wirebonding, tab bonding or flip chip bonding. The bonded assembly (16) is then attached to a flexible temporary support substrate (18) by means of an adhesive (19). The entire assembly is then placed into a mold cavity (20 and 22) and registered against the temporary support substrate (18). Plastic material (30) is molded about the semiconductor device and associated wirebonds in order to encapsulate the device. After removal from the mold, the encapsulated assembly is removed from the temporary support substrate (18) by peeling the temporary support substrate (18) from the circuit substrate.

摘要翻译： 公开了制造焊盘阵列芯片载体封装的方法。 将半导体器件（10）接合到陶瓷衬底（12）上。 半导体器件可以通过引线接合，接头接合或倒装芯片接合而附接到基板。 接合组件（16）然后通过粘合剂（19）附接到柔性临时支撑衬底（18）。 然后将整个组件放入模腔（20和22）中并与临时支撑衬底（18）对准。 围绕半导体器件和相关联的引线键合塑料材料（30），以封装该器件。 从模具中取出之后，通过从电路基板剥离临时支撑基板（18），将封装的组件从临时支撑基板（18）移除。

公开(公告)号：US5077633A

公开(公告)日：1991-12-31

申请号：US345280

申请日：1989-05-01

申请人： Bruce J. Freyman ,  Barry M. Miles ,  Frank J. Juskey

发明人： Bruce J. Freyman ,  Barry M. Miles ,  Frank J. Juskey

IPC分类号： H01L21/52 ,  H01L21/58 ,  H01L21/60 ,  H01L23/498 ,  H05K7/02

CPC分类号： H01L24/32 ,  H01L23/49827 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15787

摘要： A die pad (108) with a punched hole providing a throughway (110) is affixed upon the chip carrier base 100. Such throughway permits the electronic interconnection of the die backside (112) to a conductive runner (104) by electrically conductive material (110) set between the die backside (112) and the conductive runner (104).

摘要翻译： 具有提供通道（110）的冲孔的模垫（108）被固定在芯片载体基座100上。这样的通道允许模具背面（112）与导电流道（104）的电子互连通过导电材料 110）设置在模具背面（112）和导电浇道（104）之间。

公开(公告)号：US5438224A

公开(公告)日：1995-08-01

申请号：US159910

申请日：1993-12-01

申请人： Marc V. Papageorge ,  Bruce J. Freyman ,  Frank J. Juskey ,  John R. Thome

发明人： Marc V. Papageorge ,  Bruce J. Freyman ,  Frank J. Juskey ,  John R. Thome

IPC分类号： H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L23/02 ,  H01L23/12 ,  H01L23/44 ,  H01L29/41

CPC分类号： H01L23/4985 ,  H01L23/49575 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2924/01079 ,  H01L2924/15311

摘要： An integrated circuit package includes a stacked integrated circuit chip arrangement (140) placed on a circuit substrate. The stacked IC chip arrangement includes a first IC chip (110) and a second IC chip (120), each having an array of terminals (116, 126) and being positioned in a face-to-face manner. An interposed substrate (130) is positioned between the first IC chip (110) and the second IC chip (120) such that circuitry disposed on the interposed substrate (130) provides electrical connection among the arrays of terminals of the first IC chip (110) and the second IC chip (120) and external circuitry.

摘要翻译： 集成电路封装包括放置在电路基板上的堆叠集成电路芯片布置（140）。 堆叠的IC芯片装置包括第一IC芯片（110）和第二IC芯片（120），每个芯片具有端子阵列（116,126）并且以面对面的方式定位。 插入的基板（130）位于第一IC芯片（110）和第二IC芯片（120）之间，使得设置在插入的基板（130）上的电路在第一IC芯片（110）的端子阵列之间提供电连接 ）和第二IC芯片（120）和外部电路。

公开(公告)号：US5296738A

公开(公告)日：1994-03-22

申请号：US927774

申请日：1992-08-10

申请人： Bruce J. Freyman ,  Frank J. Juskey ,  Barry M. Miles

发明人： Bruce J. Freyman ,  Frank J. Juskey ,  Barry M. Miles

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L23/00 ,  H01L23/13 ,  H01L23/28 ,  H01L23/31 ,  H05K13/02

CPC分类号： H01L23/564 ,  H01L23/13 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181

摘要： An integrated circuit package (10) comprises a semiconductor die (14) having a top surface and a bottom surface, and a substrate (16) for receiving the semiconductor die. The substrate should have an aperture(s) (18) below the semiconductor die for providing moisture relief during temperature excursions. An adhesive (20) applied to the substrate allows for mounting the semiconductor die to the substrate. Then, the semiconductor die is wirebonded to the substrate. Finally, an encapsulant (12) for sealing the top surface of the semiconductor die is formed over the semiconductor die and portions of the substrate.

摘要翻译： 集成电路封装（10）包括具有顶表面和底表面的半导体管芯（14）和用于接收半导体管芯的衬底（16）。 衬底应在半导体管芯下方具有一个（18）的孔口，用于在温度偏移期间提供湿气释放。 施加到基板上的粘合剂（20）允许将半导体管芯安装到基板上。 然后，半导体管芯与引线接合。 最后，在半导体管芯和衬底的部分之上形成用于密封半导体管芯的顶表面的密封剂（12）。

公开(公告)号：US5166772A

公开(公告)日：1992-11-24

申请号：US658810

申请日：1991-02-22

申请人： Keith D. Soldner ,  Frank J. Juskey ,  Bruce J. Freyman ,  Barry M. Miles

发明人： Keith D. Soldner ,  Frank J. Juskey ,  Bruce J. Freyman ,  Barry M. Miles

IPC分类号： H01L23/31 ,  H01L23/552 ,  H01L23/60

CPC分类号： H01L23/3121 ,  H01L23/552 ,  H01L23/60 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025

摘要： A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a substrate (10) having a metallization pattern (12, 13), with one portion of the metallization pattern being a circuit ground (13). A semiconductor device (16) is electrically interconnected (17) to the metallization pattern (12). A perforated metal shield or screen (18) covers the semiconductor device (16) and is electrically and mechanically attached to the metallization circuit ground (13) in order to shield the semiconductor device (16) from radio frequency energy. A resin material (14) is transfer molded about the semiconductor device, the electrical interconnections, and the metal screen to form the completed package.

摘要翻译： 提供一种屏蔽半导体封装及其制造方法。 屏蔽半导体封装包括具有金属化图案（12,13）的衬底（10），金属化图案的一部分是电路接地（13）。 半导体器件（16）与金属化图案（12）电互连（17）。 穿孔的金属屏蔽或屏蔽（18）覆盖半导体器件（16）并且电气和机械地附接到金属化电路接地（13），以便屏蔽半导体器件（16）与射频能量。 树脂材料（14）围绕半导体器件，电互连和金属屏蔽传递模制以形成完成的封装。

公开(公告)号：US5985695A

公开(公告)日：1999-11-16

申请号：US141928

申请日：1998-08-28

申请人： Bruce J. Freyman ,  Robert F. Darveaux

发明人： Bruce J. Freyman ,  Robert F. Darveaux

IPC分类号： H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/854 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181

摘要： A grid array assembly method uses a flex circuitry substrate and includes providing a series of conforming flex circuitry substrates, the flex circuitry substrates include bonding pads and metallization on a first surface and, holes or vias in the substrate which define a contact pad array on the opposite surface. The substrates are tested and acceptable, then mounted on a carrier strip with longitudinally aligned apertures. The carrier strip is typically a metal such as copper. The strip with mounted substrates is then passed to a station where an IC die is mounted on the substrate first surface, wire bonds are placed from the die to the bonding pads, and the assembly is encapsulated by auto-molding to form a package body. Subsequently, interconnecting bumps are placed on the contact pads and the assembly is removed from the strip.

摘要翻译： 网格阵列组装方法使用柔性电路基板，并且包括提供一系列一致的柔性电路基板，所述柔性电路基板包括在第一表面上的接合焊盘和金属化，以及在所述基板中的孔或通孔，其限定所述接触焊盘阵列 相反的表面。 基板被测试和可接受，然后安装在具有纵向对齐的孔的载体条上。 载体条通常是诸如铜的金属。 然后将带有安装基板的条带传送到其中IC芯片安装在基板第一表面上的工位，将引线从管芯放置到焊盘，并且通过自动模制来封装组件以形成封装体。 随后，将互连凸块放置在接触垫上，并将组件从带上移除。

公开(公告)号：US5136366A

公开(公告)日：1992-08-04

申请号：US609355

申请日：1990-11-05

申请人： Nicolaas H. Worp ,  Bruce J. Freyman ,  Kurt C. Conrath

发明人： Nicolaas H. Worp ,  Bruce J. Freyman ,  Kurt C. Conrath

IPC分类号： H01L23/31 ,  H05K3/30

CPC分类号： H05K3/303 ,  H01L23/3121 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613

摘要： An overmolded semiconductor package (150) is formed by electrically and mechanically attaching a semiconductor device (100) to a substrate (110) having at least one hole (130). A plastic molding compound (140) is overmolded around the semiconductor device 100) so as to encapsulate the device, the molding compound (140) extending at least partially into the substrate hole (130) to form an anchor (135) to aid in bonding the molding compound to the substrate. An alternate embodiment of the invention forms a pedestal (449) from the portion of the molding compound extending beyond the surface of the substrate. The pedestal functions as an anchor to aid in bonding the molding compound (440) to the substrate, and also as a spacer to maintain a preselected clearance between the substrate (410) and the printed circuit board (460). The portion of the molding compound extending beyond the surface of the substrate may also be used to form an alignment pin (548). The pin functions as an anchor to aid in bonding the molding compound to the substrate, and also as an alignment aid to maintain positional relationships between the substrate and the printed circuit board. In another embodiment of the invention, the overmolded semiconductor is mounted directly on a printed circuit board containing other active circuitry.

摘要翻译： 通过将半导体器件（100）电连接和机械地附接到具有至少一个孔（130）的衬底（110）来形成包覆成型的半导体封装（150）。 一种塑料模塑料（140）在半导体器件100周围包覆成型以封装该器件，该模塑料料140至少部分地延伸到衬底孔130中以形成锚固件，以帮助粘合 模塑料到基材。 本发明的替代实施例从延伸超过衬底表面的模制化合物的部分形成基座（449）。 基座用作锚固件，以有助于将模塑料（440）粘合到基材上，并且还用作间隔件，以在基板（410）和印刷电路板（460）之间保持预选的间隙。 延伸超过基板表面的模塑料的部分也可用于形成对准销（548）。 该引脚用作锚固件以有助于将模塑料粘合到基材上，并且还用作对准助剂以保持基板和印刷电路板之间的位置关系。 在本发明的另一实施例中，包覆成型的半导体直接安装在包含其它有源电路的印刷电路板上。

公开(公告)号：US06329606B1

公开(公告)日：2001-12-11

申请号：US09203826

申请日：1998-12-01

申请人： Bruce J. Freyman ,  John Briar ,  Jack C. Maxcy

发明人： Bruce J. Freyman ,  John Briar ,  Jack C. Maxcy

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A grid array assembly is provided employing a thin copper or steel carrier frame having apertures extending longitudinally of the frame. A series of semi-flexible substrate printed circuit boards are mounted in seriatim to peripheral edges of the apertures, the circuit boards including bonding pads and metallization on a first surface and conductive vias in the circuit boards extending to a second opposite surface containing a contact pad array. The carrier strip with the mounted circuit boards are passed to a station where an IC die is mounted on the board first surface, wire bonds are placed from the die to the bonding pads and the assembly encapsulated using a portion of the carrier strip as a mold gate to form a package body. Subsequently each grid array assembly is singulated from the carrier strip.

摘要翻译： 使用具有沿框架纵向延伸的孔的薄铜或钢托架框架提供栅格阵列组件。 一系列半柔性基板印刷电路板安装到孔的周边边缘，电路板包括第一表面上的焊盘和金属化层，以及延伸到包含接触焊盘的第二相对表面的电路板中的导电通孔 数组。 具有安装的电路板的载体带被传递到其中IC芯片安装在基板第一表面上的工位，引线键合从模具放置到焊盘，并且使用载体条的一部分作为模具封装的组件 门形成包装体。 随后，每个栅格阵列组件从载体条切片。

公开(公告)号：US5134462A

公开(公告)日：1992-07-28

申请号：US728822

申请日：1991-07-09

申请人： Bruce J. Freyman ,  Barry M. Miles ,  Jill L. Flaugher

发明人： Bruce J. Freyman ,  Barry M. Miles ,  Jill L. Flaugher

IPC分类号： H01L23/10 ,  H01L23/24 ,  H01L23/498

CPC分类号： H01L23/24 ,  H01L23/10 ,  H01L23/4985 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181

摘要： A flexible film is made into a substrate (100) having metallization patterns. A semiconductor device (106) is affixed to the substrate, and the assembly is heated to expand the substrate. A cover (110) is attached to the substrate, over the device (106). Upon cooling, the substrate (100) shrinks and becomes taut and planar within the reinforced area. Alternatively, a reinforcing ring (210) can be attached to the substrate (200) either before or after attachment of the semiconductor device (206).

摘要翻译： 将柔性膜制成具有金属化图案的基板（100）。 将半导体器件（106）固定到衬底上，并且加热组件以使衬底膨胀。 覆盖物（110）在装置（106）上连接到基底。 在冷却时，衬底（100）在加强区域内收缩并且变得绷紧和平坦。 或者，可以在半导体器件（206）的附接之前或之后，将加强环（210）附接到基板（200）。

公开(公告)号：US5006673A

公开(公告)日：1991-04-09

申请号：US447349

申请日：1989-12-07

申请人： Bruce J. Freyman ,  Barry M. Miles ,  Jill L. Flaugher

发明人： Bruce J. Freyman ,  Barry M. Miles ,  Jill L. Flaugher

IPC分类号： H01L21/48 ,  H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40

CPC分类号： H01L21/486 ,  H05K1/0287 ,  H05K1/0306 ,  H05K2201/09945 ,  H05K3/0097 ,  H05K3/4053 ,  Y10T29/49155

摘要： A method of manufacturing a chip carrier from a universal ceramic substrate provides for a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes. On the first side, wire bond pads and conductors connected to the conductively filled through-holes are provided as required. Similarly, on the second side, solder pads on the conductively filled through-holes are provided as required. Finally, at least one insulating layer is provided over part of the first side for die attachment.

摘要翻译： 从通用陶瓷基板制造芯片载体的方法提供了具有第一和第二相对侧的通用陶瓷基板和导电填充的通孔阵列。 在第一面上，根据需要提供连接到导电填充通孔的导线接合焊盘和导体。 类似地，在第二面上，根据需要提供导电填充的通孔上的焊盘。 最后，在第一侧的一部分上设置至少一个绝缘层用于管芯附接。