Abstract:
The present disclosure generally relates to semiconductor structures and, more particularly, to program and erase memory structures and methods of manufacture. The semiconductor memory includes: a charge trap transistor; and a self-heating circuit which selectively applies voltages to terminals of the charge trap transistor to assist in erase operations of the charge trap transistor.
Abstract:
A multi-time programmable memory (MTPM) memory cell and method of operating. Each MTPM bit cell including a first FET transistor and a second FET transistor having a first common connection, and said second FET transistor and a third FET transistor having a second common connection, said first and second connected FET transistors programmable to store a first bit value, and said second FET and said third connected FET transistors programmable to store a second bit value, wherein said first FET transistor exhibits a low threshold voltage value (LVT), said second FET transistor exhibits an elevated threshold voltage value HVT and said third FET transistor exhibits a threshold value LVT lower than HVT. The MTPM cell enables two bits of information to be stored as default bit values like an electrical fuse. To store opposite bit values, the LVT transistors are programmed such that their threshold voltage is higher than that of HVT.
Abstract:
Aspects of the present disclosure include methods and test structures for an intermediate metal level of an integrated circuit (IC). A method according to the present disclosure can include: fabricating a first plurality of metal levels including an intermediate metal level of an IC structure, the intermediate metal level being one of a plurality of metal levels in the IC structure other than a capping metal level of the IC structure; performing a first functional test on a first circuit positioned within the intermediate metal level; fabricating a second plurality of metal levels after performing the first functional test, the second plurality of metal levels including the capping metal level of the IC structure; and performing a second functional test on a second circuit positioned within the plurality of metal levels, after the fabricating of the capping metal level.
Abstract:
A system and method of operating a twin-transistor single bit multi-time programmable memory cell to provide a high gain, sensing scheme for small signals. The memory cell includes a pair of a first transistor and a second transistor providing a differential signal output. The first transistor of the memory cell couples a first circuit leg having a first current source load transistor and the second transistor couples a second circuit leg having a second current source load transistor. A programmed value is represented by a voltage threshold shift in one of the first or second transistors. A feedback circuit receives one of: a first signal or a second signal of the differential signals, and generates, in response, a feedback signal which is simultaneously applied to bias each current source load transistor in each the first and second circuit legs to amplify a voltage differential between the differential signal outputs.
Abstract:
A multi-time programmable memory (MTPM) memory cell and method of operating. Each MTPM bit cell including a first FET transistor and a second FET transistor having a first common connection, and said second FET transistor and a third FET transistor having a second common connection, said first and second connected FET transistors programmable to store a first bit value, and said second FET and said third connected FET transistors programmable to store a second bit value, wherein said first FET transistor exhibits a low threshold voltage value (LVT), said second FET transistor exhibits an elevated threshold voltage value HVT and said third FET transistor exhibits a threshold value LVT lower than HVT. The MTPM cell enables two bits of information to be stored as default bit values like an electrical fuse. To store opposite bit values, the LVT transistors are programmed such that their threshold voltage is higher than that of HVT.
Abstract:
Wordline decoder circuits for an embedded Multi-Time-Read-Only-Memory that includes a plurality of NMOS memory cells coupled to a plurality of wordlines in each row. The wordline decoder circuits control the charge trap behavior of the target NMOS memory array by the mode-dependent wordline high voltage (VWLH) and wordline low voltage (VWLL) trapping the charge in a programming mode by applying an elevated wordline voltage (EWLH) to one of the plurality of WLs, while de-trapping the charge in a reset mode by applying a negative wordline voltage (NWLL) to the entire array. The mode dependent voltage control is realized by switching to couple EWLH to VWLH in a programming mode, otherwise VDD to VWLH, while coupling NWLL to VWLL in a reset mode, otherwise, GND to VWLL. The switch includes plural gated diodes from VWLH with the wordline high protection voltage of VWLH_PR generated by lowering VWLH determined by gated diodes times threshold voltage. The switch includes a series of gated diodes from VWLL with a wordline low protection voltage of VWLL_PR generated by raising VWLL determined by the gated diodes by the threshold voltage, resulting in controlling the WL swing using thin-oxide devices.
Abstract:
Described are a hardware encryption engine, and secret key registration and authentication system recoverable binary bit using knowing an initial secret key stored in the master system. The secret key is overwritten in each authentication, updating it to the master and encryption engine independently. The secret key over write command can be preferably given to the chip as a CHG, and the non recoverable binary bit from the sense amplifier is used for response.
Abstract:
A method of generating a default state in an embedded Multi-Time-Programmable-Read-Only-Memory for a high-performance logic technology consisting of a plurality of memory cells featuring a charge trap, each having a first and a second NMOS transistor. The first and second NMOS transistors use a different mask having different threshold voltages. The second NMOS threshold voltage is adjusted to a middle point of the threshold voltage of the first NMOS with or without trapping the charge. When the charge is not trapped by the first NMOS, the NMOS threshold is lowered to the second NMOS, thereby generating a default state. When the charge is trapped to the first NMOS, the NMOS threshold is higher than the second NMOS, generating a second state. Moreover, a reference voltage generation can use two arrays, each consisting of memory cells and reference memory cells such that a default state can be generated for a single transistor per memory cell.
Abstract:
Approaches for a memory including a cell array are provided. The memory includes a first device of the cell array which is connected to a bitline and a node and controlled by a word line, and a second device of the cell array which comprises a third device which is connected to a source line and the node and controlled by the word line and a fourth device which is connected between the word line and the node. In the memory, in response to another word line in the cell array being activated and the word line not being activated to keep the first device in an unprogrammed state, the third device isolates and floats the node such that a voltage level of a gate to source of the first device is clamped down by the fourth device to a voltage level around zero volts.
Abstract:
A system and method of operating a twin-transistor, multi-time programmable memory (MTPM) memory cell that ensures accurate reproducibility of bit values read after each of write cycle. Each multi-time programmable memory cell includes a series connection of a first transistor and a second transistor. The method includes writing, using a write circuit at select memory cell locations, initial bit values to one or more select memory cells. Then, using the write circuit, a rebalancing of a state of a parameter associated with one or more the first transistor or second transistor, at each the select memory cell, is performed. Then, an erasing cycle is performed, at each the rebalanced select memory cell, the written initial bit value. In one embodiment, the erasing cycle may first be performed prior to rebalancing. The rebalancing and erasing are to be performed prior to each bit value write cycle.